JETWAY JNC9KDL-2550, MBD-J-JNC9KDL-2550 Technical Manual
TECHNICAL MANUAL
Of
Intel Cedar Trail-D & NM10 Chipset
Based
Mini-ITX M/B for ATOM Processor
NO.G03-NC9K-F
Revision: 1.0
Release date: November, 2011
Trademark:
* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation us e only , and ar e
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................6
2-2 CONNECTORS AND HEADERS................................................................................8
2-2-1 CONNECTORS .............................................................................................8
2-2-2 HEADERS .....................................................................................................9
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERNING SETUP...................................................................................................14
3-2 BIOS MENU SCREEN ................................................................................................14
3-3 FUNCTION KEYS .......................................................................................................15
3-4 GETTING HELP ..........................................................................................................16
3-5 MENU BAR..................................................................................................................16
3-6 MAIN MENU................................................................................................................17
3-7 ADVANCED MENU.....................................................................................................18
3-8 CHIPSET MENU..........................................................................................................23
3-9 BOOT MENU...............................................................................................................25
3-10 SECURITY MENU.......................................................................................................26
3-11 SAVE & EXIT MENU...................................................................................................27
TABLE OF CONTENT
iii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition December 8, 2011
Item Checklist
5
Motherboard
5
User’s Manual
5
DVD for motherboard utilities
5
Cable(s)
5
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of motherboard
z
Intel Cedar Trail-D and NM10 chipset, with low power consumption never denies
high performance.
z
Support two DDRIII 800/1066MHz SO-DIMM up to 4GB.
z
Support 2 * Serial ATAII (3Gb/s) Devices
z
Onboard dual Realtek RTL 8111E Gigabit Ethernet LAN chip.
z
Integrated ALC662 6-channel HD audio CODEC.
z
Support USB2.0 data transport demands.
z
Support PCI slot
z
Support Watchdog function.
z
Support Smart Fan function.
z
Compliance with ErP standard
2
1-2 Specification
Spec Description
Design z
Mini-ITX form factor; PCB size: 17.0x17.0cm
Chipset
z
Intel®NM10 Express chipset
Embedded CPU
z
Intel Cedar Trail-D Processor
Memory Slot
z
SO-DIMM DDRIII slot x 2
z
Support two DDRIII 800/1066 MHz SO-DIMM with memory
capacity expandable to 4GB
Expansion Slot
z
32-bit PCI slot x 1
Dual LAN Chip
z
Integrated with two Realtek RTL8111E PCI-E Gigabit LAN
chips
z
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip
z
ALC 662 6-channel Audio Codec integrated
z
Audio driver and utility included
BIOS z
AMI 16MB DIP Flash ROM
Multi I/O
z
PS/2 keyboard connector x1
z
PS/2 mouse connector x1
z
VGA port connector x1
z
HDMI port connector x1
z
USB port connector x4
z
RJ-45 LAN connector x2
z
Audio connector x3 (Line-in, Line-out, MIC)
z
SATAII Connector x2
z
Front panel audio header x1
z
HDMI_SPDIF header x1
z
Serial port header x1
z
USB 2.0 header x2
z
PWRLED header x1
z
Speaker header x1
z
Front panel header x1
3
z
LVDS header x1
z
LVDS Inverter x1
z
Parallel header x1
1-3 Layout Diagram
MIC-IN
VGA Port
Line-OUT
Line-IN
PS/2
Ke
y
board Port
RJ-45 LAN Ports
USB Ports
PS/2
Mouse Port
HDMI Port
4
Notice!
When installing only one SODIMM to the board, please always install it
in SODIMM2 slot, otherwise system won’t start.
DDRIII
SODIMM Slot x2
(DDRIII 800/1066)
HD Audio Chip
ATX Power
Connector
SYSFAN
Header
USB 2.0 Heade
r
Audio Connector
VGA Port
PS/2 Mouse Port over
PS/2 Keyboard Port
HDMI Port
RJ-45 LAN Port over
USB 2.0 Ports
Front Panel
Audio Header
PCI Slot
Power
LED Header
CPUFAN Header
RJ-45 LAN Port over
USB 2.0 Ports
LVDS Inverter
LVDS
Heade
r
Parallel Port
Heade
r
Serial Port
Header
SATAII
Connectors
(SATA1/SATA2)
Front Panel Header
Speaker Header
Intel CPU
Intel NM 10 Chipset
HDMI_SPDIF
Header
J
P1
J
P2
JP4 J
BAT
J
P5
Gigabit LAN Chip
Gigabit LAN Chip
SODIMM1
SODIMM2*
5
Jumper
Jumper Name Description
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP1 Inverter12V/5V Select 3-pin Block
JP2 LVDS PVCC 5V/3.3V Select 3-pin Block
JP4 K/B, USB Power On Function Setting 3-pin Block
JP5 USB 2/3 Header Power On Function Setting 3-pin Block
Connectors
Connector Name Description
ATXPWR1 ATX Power Connector 24-pin Connector
KB from KBMS PS2 Keyboard Connector 6-pin Female
MS from KBMS PS2Mouse Connector 6-pin Female
HDMI High-Definition Multimedia Interface 10-pin Connector
VGA Video Graphic Attach Connector 15-pin Female
LAN from UL1,UL2 RJ-45 LAN Connector 8-pin Connector
USB from UL1,UL2 USB Port Connector 4-pin Connector
AUDIO Audio Connector(Line-in/Line-out/MIC) 3-phone Jack
SATA1,2 Serial ATAII Connector 7-pin Connector
Headers
Header Name Description
FP-AUDIO Front panel audio Header 9-pin block
SPDIF SPDIF Out header 2-pin block
COM1 Serial Port Header 9-pin Block
USB2, USB3 USB Header 9-pin Block
PWR LED1 Power LED 3-pin Block
SPEAK1 Speaker Header 4-pin Block
JW_FP1
Front Panel Header(PWR LED/
HD LED/ /Power Button /Reset)
9-pin Block
LVDS LVDS Header 35-pin Block
INVERTER1 LVDS Inverter Connector 7-pin Block
CPUFAN,SYSFAN FAN Speed Headers 3-pin Block
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