JETWAY G03-NP93-F Technical Manual
Technical Manual
Of
Intel Bay Trail Series CPU
Based
SBC
NO.G03-NP93-F
Revision: 1.0
Release date: August 7, 2014
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... iv
USER’S NOTICE.................................................................................................................. v
MANUAL REVISION INFORMATION................................................................................... v
ITEM CHECKLIST................................................................................................................ v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................ 1
1-2 SPECIFICATION .................................................................................................... 2
1-3 LAYOUT DIAGRAM ............................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................. 6
2-2 CONNECTORS AND HEADERS............................................................................ 10
2-2-1 CONNECTORS ......................................................................................... 10
2-2-2 HEADERS................................................................................................. 12
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................. 16
3-2 BIOS MENU SCREEN............................................................................................ 17
3-3 FUNCTION KEYS................................................................................................... 18
3-4 GETTING HELP...................................................................................................... 18
3-5 MEMU BARS.......................................................................................................... 19
3-6 MAIN MENU ........................................................................................................... 20
3-7 ADVANCED MENU ................................................................................................ 21
3-8 CHIPSET MENU..................................................................................................... 28
3-9 SECURITY MENU .................................................................................................. 31
3-10 BOOT MENU.......................................................................................................... 32
3-11 SAVE & EXIT MENU .............................................................................................. 33
TABLE OF CONTENT
iv
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition August 7, 2014
Item Checklist
Motherboard
User’s Manual
CD for motherboard utilities
Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never
denies high performance
Onboard 2GB DDR3L 1333 MHz DRAM
Onboard one full-size MSATA slot
Onboard one half-size Mini-PCIE slot
Support 1 * SATAII device
Support RJ-45 gigabit Ethernet LAN port
Integrated with 1 * 24-bit dual channel LVDS header
Support dual display output
Support USB 3.0 data transport demand
Compliance with ErP standard
Support Watchdog function
2
1-2 Specification
Spec
Description
Design
8-layer SBC; PCB size: 100 mm x 72 mm
Embedded CPU
Integrated with Intel® Bay Trail series CPU
Memory
Onboard 2G un-buffered DDR3L 1333 MHz DRAM
Expansion Slot
1 * halt-size Mini-PCIE slot
Storage
1* SATA II 3G/s Connector
1 * full-size mSATA slot
LAN Chip
Integrated with Realtek RTL8111G PCI-E Gigabit LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip
Realtek ALC662 4-CH HD Audio Codec integrated
Audio driver and utility included
BIOS
64Mbit Flash ROM
Rear I/O
1* DC 12V power-in connector
1* USB 2.0 port
1* USB 3.0 port
1* HDMI port
1* RJ-45 LAN port
Internal I/O
1* SATA Power connector
1* LVDS inverter
1* Front panel audio header
3* 9-pin USB 2.0 header (Expansible to 6* USB 2.0 ports)
1* LAN LED activity header
1* Front panel header
2* Serial port header (*COM1 support RS232/RS422/RS485)
1* LVDS header
3
1-3 Layout Diagram
Internal Diagram-Front Side:
Front Panel Header
12V DC-in Power
Connector
HDMI Port
INVERTER
Full-size
mSATA Slot
USB 2.0 Headers
Front Panel
Audio Header
SATA
Power Connector
LANLED Header
RJ-45 LAN Port
USB 3.0 Port
Over USB 2.0 Port
LVDS Header
SATA II Port
JP3
Half-size
Mini-PCIE Slot
J1 Jumper
Serial Port Headers
(COM1/2)
JPCOM1
JP1
Battery
Connector
4
Internal Diagram-Back Side:
Intel Bay Trail Series
CPU
Onboard
2G DRAM
5
Connectors
Connector
Name
DCIN DC 12V Power–in Connector
USB1(Top) USB 2.0 Port Connector
USB1(Bottom) USB 3.0 Port Connector
HDMI High-Definition Multimedia Interface
LAN RJ-45 Gigabit LAN Port Connector
SATA1 SATAII Port Connector
PWROUT1 SATA Power out Connector
INVERTER LVDS Inverter Connector
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
USB2/3/4 USB 2.0 Header X3 9-pin Block
LAN_LED LAN Activity LED Headers 2-pin Block
FP
Front Panel Header(PWR LED/
HDD LED/ /Power Button /Reset)
9-pin Block
COM1 Serial Port Header 9-pin Block
COM2 Serial Port Header 9-pin Block
LVDS LVDS Header 30-pin Block
6
Jumper
Jumper Name Description
JP1 INVERTER VLED 5V/12V Select 3-Pin Block
JPCOM1 COM1 Header Pin9 Function Select 4-Pin Block
JP3 LVDS VLCD 5V/3.3V /12V Select 4-Pin Block
J1 (Pin 1-3) Clear CMOS Setting 8-Pin Block
J1 (Pin 5-7) Clear ME Setting 8-Pin Block
J1 (Pin 2-4) AT Mode Function Select 8-Pin Block
J1 (Pin 6-8) Disable ME Function Select 8-Pin Block
Chapter 2
Hardware Installation
2-1 Jumper Setting
JP1 (3-pin): INVERTER VLED 5V/12V Select
2-3 Closed: Inverter VLED= 12V.
JP1→INVERTER
1-2 Closed: Inverter VLED= 5V;
1 3
1
7
JPCOM1 (4-pin): COM1 Header Pin9 Function Select
JCOMP1→COM1 Header
4-6 Closed:
RI= 12V.
1
3
5
3-4 Closed:
RI= 5V;
2-4 Closed:
RI=RS232;
4
6
2
6
5
3
1
4
2
5
3
1
6
4
2
JP3 (4-pin): LVDS VLCD 3.3V/5V/12V Select
JP3→ LVDS VLCD
4-6 Closed:
VLCD = 12V;
6
4
2
3-4 Closed:
VLCD = 5V;
2-4 Closed:
VLCD = 3.3V
6
4 2
6
4
2
3
3
3
1
5
1
5
1
5
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