JETWAY G03-NF795-F Technical Manual
TECHNICAL MANUAL
Of
Intel Q170 Express Chipset
Based Mini-ITX M/B
NO. G03-NF795-F
Revision: 1.0
Release date: May 16, 2018
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................... iii
USER’S NOTICE ............................................................................................................. iv
MANUAL REVISION INFORMATION.............................................................................. iv
ITEM CHECKLIST........................................................................................................... iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................ 1
1-2 SPECIFICATION .................................................................................................... 2
1-3 LAYOUT DIAGRAM ............................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................. 8
2-2 CONNECTORS AND HEADERS............................................................................ 13
2-2-1 CONNECTORS ......................................................................................... 13
2-2-2 HEADERS................................................................................................. 15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................. 21
3-2 BIOS MENU SCREEN............................................................................................ 22
3-3 FUNCTION KEYS................................................................................................... 22
3-4 GETTING HELP...................................................................................................... 23
3-5 MENU BARS .......................................................................................................... 23
3-6 MAIN MENU ........................................................................................................... 24
3-7 ADVANCED MENU ................................................................................................ 25
3-8 CHIPSET MENU..................................................................................................... 38
3-9 SECURITY MENU .................................................................................................. 41
3-10 BOOT MENU.......................................................................................................... 42
3-11 SAVE & EXIT MENU .............................................................................................. 43
TABLE OF CONTENT
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition May 16, 2018
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable
(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® Q170 express chipset
Support LGA 1151 CPU socket for the 6th & 7th CPU Intel® Core™ i7 / i5 i3
processors / Pentium™ & Celeron™ processors (TDP ≤65 W).
Support 2* DDR4 2133MHz SO-DIMM up to 32GB and dual channel function
Integrated with 3*Intel i211AT & 1* i219LM Gigabit Ethernet LAN chip
Support USB 3.0 data transport demand
Support 4 * SATAIII (6Gb/s) Devices & RAID 0, 1, 5, 10 mode
Support 1 * full-size Mini-SATA slot
Support 1* PCIE 2.0 x16 slot, 1* half-full-size Mini-PCIE slot and 1* M.2 E-key 2230
PCIe slot
Support 3G module with SIM card slot
1 * HDMI port & 1 * 24-bits dual channel LVDS
Support Smart FAN function
Supports ACPI S3 Function
Compliance with ErP Standard
Support Watchdog Timer Technology
Solution for Networking Appliance, POE & Surveillance & IoT
2
1-2 Specification
Spec Description
Design
Thin mini-ITX form factor; 8-layer; PCB size: 17.0x17.0cm
Chipset
Intel Q170 Express Chipset
CPU Socket
Intel® LGA 1151 Socket for Skylake & kabylack series
processors: 6th & 7th Core™ i7/ i5/ i3, Pentium™ & Celeron
™
processors
* for detailed CPU support information please visit our website
Memory Slot
2*DDR4 SO-DIMM slot
Support DDR4 2133 MHz SO-DIMM up to 32GB
Support dual channel function
Expansion Slot
1* PCIE x16 slot (
PE1
)
1* half-size Mini-PCIE slot (
MPE
)
1* M.2 PCIE slot (
M2E
,2230 E-key PCIE interface)
1* SIM card slot (
BSIMCARD
)
Storage
4* SATAIII 6G/s ports with support for RAID 0/1/5/10 mode
1* full-size Mini-SATA slot (
MSATA
)
Gigabit LAN Chip
Integrated with 3* Intel I211AT Gigabit PCI-E LAN chip &
1*
Intel I219LM Gigabit PHY LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
BIOS
AMI Flash ROM
Multi I/O
Rear Panel I/O:
1* RJ-45 COM port
4* RJ-45 LAN port
4* USB 3.0 port
1* HDMI port
Internal I/O Connectors & Headers:
1 *24-pin main power connector
1 *4-pin 12V power connector
1* CPUFAN connector & 1* SYSFAN connector
3
1* Front panel header
1* 9-Pin USB 2.0 header for 2* USB 2.0 ports
1* 19-Pin USB 3.0 header for 2* USB3.0 ports
1 * PS2 Keyboard & Mouse header
1* LAN Status LED header
1* GPIO header
1*LVDS header
1*Inverter header
1*Speaker header
1-3 Layout Diagram
Rear IO Diagram
RJ-45 LAN Ports
RJ-45 COM
Port
USB 3.0 Ports
USB 3.0 Ports
HDMI Port
4
Motherboard Internal Diagram-Front
ATX
Type
Main Power Connector
CPUFAN Connector
SYS
FAN
Connector
ATX 12V
Power Connector
LGA 1151
CPU Socket
RJ-45
COM
Port
USB 3.0 Ports
USB 3.0 Ports
HDMI
Port
USB 2.0 Port
Header
Front Panel
Header
SATAIII Ports
(SATA1/2/3/4)
Speaker
Header
USB 3.0 Port
Header
DDR4
SODIMM Slots
(SODIMM1/SODIMM2)
RJ-45 LAN Port
s
(LAN1)
LVDS
Header
GPIO
Header
LVDS
Inverter
Full-size
MSATA Slot (MSATA)
Half-size
Mini-PCIE
Slot (MPE)
PS/2 Keyboard &
Mouse Header
PCIE X16
Slot
M.2 PCIE Slot
(
M2E)
LAN_LED
Header
5
Internal Diagram-Back Side:
*Note: 1.SIM card slot (BSIMCARD) only works when compatible SIM card installed & USB 3G
expansion card installed in the full-size MSATA slot (MSATA); 2. USB 3G card and MSATA card is
optional, i.e., user can only choose one to installed in the full-size MSATA at the same time.
SIM Card Slot
6
Motherboard Jumper Position
*Note: JP2 is for RMA test only.
AT_MODE
JPM2E
JPBKLT
COPEN
JPMPE
JBAT
*JP2
JP1
JPCOM1
JPLCD
7
Connectors
P/N Name
RJ45_COM1 RJ-45 COM Port Connector for Console
USB1/USB2 USB 3.0 Port Connector X4
LAN1 RJ-45 LAN Connector X4
HDMI HDMI Port Connector
ATXPWR Main Power Connector
ATX12V Internal 12V Power Connector
SATA1/2/3/4 SATAIII Connector
CPUFAN CPUFAN Connector
SYSFAN SYFFAN Connector
Headers
P/N Name Description
JW_FP
Front Panel Header(PWR LED/ HD
LED/Power Button /Reset)
9-pin Block
SPEAKER Speaker Header 4-pin Block
FP_USB1 USB 2.0 Port Header 9-pin Block
FP_USB31 USB 3.0 Port Header 19-pin Block
PS2KBMS PS2 Keyboard & Mouse Header 6-pin Block
LAN_LED LAN Status LED Header 8-pin Block
GPIO_CON GPIO Header 10-pin Block
LVDS2 LVDS Header 30-pin Block
INVERTER2 LVDS Inverter Header 8-pin Block
8
Jumper
P/N Name Description
JPCOM1 RJ45_COM1 Port VCC 5V/12V Select 4-pin Block
JBAT Clear CMOS Setting 2-pin Block
COPEN Case Open Message Display Function Select 2-pin Block
AT_MODE AT/ATX Mode Select 3-Pin Block
JPLCD LVDS Panel VCC 3.3V/5V/12V Select 4-pin Block
JPBKLT LVDS Backlight VCC 5V/12V Select 3-pin Block
JPMPE
MPE Slot VCC 3VSB/VCC3 Select
3-Pin Block
JPM2E
M2E Slot VCC 3VSB/VCC3 Select
3-Pin Block
JP1 DFDS Override Select 2-pin Block
Chapter 2
Hardware Installation
2-1 Jumper Setting
JPCOM1 (4-pin): RJ45_COM1 Port Pin5 VCC Select
JPCOM1→RJ45_COM1 Pin5 VCC Select
6 4 2
3 1 5
2-4 Closed:
Pin5=NC;
3-4 Closed:
Pin5=+5V;
4-6 Closed:
Pin5=+12V.
1 3 5
2
4 6
1
3 5
2
4
6
JPCOM1
9
JBAT (2-pin): Clear CMOS Settings
1-2 Closed: Clear CMOS.
JBAT→Clear CMOS
1-2 Open: Normal；
Pin1
Pin1
COPEN (2-pin): Case Open Message Display Function Select
Pin1
COPEN→Case Open Detection
CASE
OPEN
GND
Pin 1-2 Short
: When Case open function pin short to GND, the Case open function
was detected. When Used, needs to enter BIOS and enable ‘Case Open Detect’
function. In this case if your case is removed, next time when you restart your computer,
a message will be displayed on screen to inform you of this.
JBAT
COPEN
10
AT_MODE (3-pin): AT Mode /ATX Mode Select
1
3
1
3
AT_MODE→ATX/AT Mode Select
1-2 Closed: ATX Mode Selected;
2-3 Closed: AT Mode Selected.
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.
JPLCD (4-pin): LVDS VCC 3.3V/5V/12V Select
JPLCD→LVDS Panel VCC
6 4 2
3 1
5
2-4 Closed:
VCC=3.3V;
3-4 Closed:
VCC=5V;
4-6 Closed:
VCC=12V.
1
3
5
2
4 6
1
3
5
2
4 6
AT_MODE
JPLCD
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