JETWAY G03-NC9T-F Technical Manual
TECHNICAL MANUAL
Of
Intel 1037U CPU + Intel NM70 Chipset
Based Mini-ITX M/B
NO. G03-NC9T-F
Revision: 1.0
Release date: October 15, 2013
Trademark:
* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation us e only , and ar e
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................16
2-2-1 CONNECTORS .............................................................................................16
2-2-2 HEADERS .....................................................................................................20
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................26
3-2 BIOS MENU SCREEN ................................................................................................27
3-3 FUNCTION KEYS .......................................................................................................27
3-4 GETTING HELP ..........................................................................................................28
3-5 MEMU BARS...............................................................................................................28
3-6 MAIN MENU................................................................................................................29
3-7 ADVANCED MENU.....................................................................................................30
3-8 CHIPSET MENU..........................................................................................................37
3-9 BOOT MENU...............................................................................................................41
3-10 SECURITY MENU.......................................................................................................43
3-11 SAVE & EXIT MENU...................................................................................................44
TABLE OF CONTENT
iii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition October 15, 2013
Item Checklist
5
Motherboard
5
DVD for motherboard utilities
5
User’s Manual
5
Cable(s)
5
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
z
Intel® 1037 dual-core CPU+ Intel® NM70 express chipset
z
Support 1 * DDRIII SO-DIMM 1066/1333/1600 MHz up to 8GB
z
Support Mini-PCIE connector
z
Support m-SATA connector
z
Integrated with 24-bit dual channel LVDS header
z
Support 1 * Serial ATAII (3Gb/s) & 1 * Serial ATAIII (6Gb/s) Devices
z
Support HDMI and VGA Video Outputs
z
Supports ACPI S3 Function
z
Support CPU Smart FAN
z
Support Watchdog Timer Technology
z
Support Windows8 OS
z
Compliance with EuP Standard
2
1-2 Specification
Spec Description
Design z
Mini-ITX form factor;
z
PCB size: 17.0 x 17.0 cm
Embedded CPU
z
Intel® 1037U Dual Core CPU (1.8GHz)
Chipset
z
Intel® NM70 Express Chipset
Memory Slot
z
1* DDRIII SO-DIMM slot
z
Support DDRIII 1333/1600 MHz DDRIII SO-DIMM
expandable to 8GB
Expansion Slot
z
1 * PCI Express x1 slot
z
1 * halt-size Mini-PCIE slot
Storage
z
1* SATA III 6G/s connector
z
1* SATA II 3G/s connector
z
1 * full-size M-SATA/ Mini-PCIE selectable slot
Dual LAN Chip
z
Integrated with dual Realtek RTL8111G PCI-E Gigabit LAN
chip
z
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip
z
Realtek ALC662 2-CH HD Audio Codec integrated
z
Audio driver and utility included
BIOS z
32M DIP Flash ROM
Multi I/O
Rear Panel I/O:
z
1* 12V DC in power connector
z
1* RJ-11port
z
1* PS/2 keyboard & mouse combo port
z
1 * VGA port
z
1* HDMI port
z
1* serial port (COM1)
z
1* parallel port
z
4* USB 2.0/1.1 port
z
2* RJ-45 port
3
z
1* Line-out connector
z
1* MIC connector
Internal I/O Connectors& Headers:
z
1 *2-pin ATX12V internal power connector
z
1 *4-pin SATA power connector
z
3* fan connector
z
1* speaker connector
z
1* LVDS inverter connector
z
1 * Front panel audio header
z
1* speaker header
z
1* PWRLED connector
z
1 * Front panel header
z
1 * 9-Pin USB 2.0/1.1 header for two USB 2.0/1.1 ports
z
1 *24-bit dual channel LVDS header
z
5 * serial port header
z
1 *GPIO header
z
2* LAN activity LED header
1-3 Layout Diagram
Rear IO Diagram
DC 12V
Power-in
Connector
VGA Port
Parallel Port
HDMI Port
Serial Port 1
RJ-11 Port
USB 2.0 Ports
RJ-45 LAN Ports
Line-Out
MIC-In
PS/2 KB & MS
Combo Port
4
Motherboard Internal Diagram
*Rear IO:
Please refer to Page3 (Rear IO Diagram).
ATX12V
Power connector
DDRIII SODIMM Slot
Intel CPU
Intel NM70 Chipset
PCI Express x1 Slot
CPUFAN Header
Front Panel
Audio Heade
r
Front Panel Heade
r
*Rear IO
LVDS Inverte
r
Serial Port Headers
(
COM6/5/4/3/2
)
GPIO Heade
r
SATA Hard Disk
Powe
r
-Out Connecto
r
Speake
r
Connector
USB 2.0 Heade
r
LVDS Heade
r
SATAIII Port
(
SATA1
)
SATAII Port
(
SATA2
)
Full-size Mini-PCIE
/M-SATA Selectable slot
(MPE1)
SYS
F
AN2 Header
Speake
r
Header
PWRLED
Header
SYS
F
AN1 Header
LAN1_LED Heade
r
LAN2_LED Heade
r
Half-size
Mini-PCIE slot
(MPE2)
BUZZ
5
Motherboard Jumper Position
JBAT
AT_MODE
JP1
JP7
JP11
JP10
JP12
SYSFAN_DET
COPEN
JP6
JP9
JP2
JP4
JP8
JP5
JP3
6
Jumper
Jumper Name Description
JBAT CMOS RAM Clear Function Setting 3-pin Block
SYSFAN_DET SYSFAN1/ SYSFAN2 R.P.M. Select 3-pin Block
JP1 INVERTER Backlight VCC 5V/12V Select 3-pin Block
JP7 INVERTER Backlight Mode Select 3-pin Block
JP8 LCD VCC 3.3V/5V/12V Select 4-pin Block
JP2 Mini-PCIE & MSATA Slot (MPE1)
VCC 3.3V/3VSB Select
3-pin Block
JP12 RJ-11 VCC 12V/24V Select 3-pin Block
JP9 COM1Port Pin9 Function Select
4-pin Block
JP4 COM2 Header Pin9 Function Select
4-pin Block
JP3 COM3 Header Pin9 Function Select
4-pin Block
JP5 COM4 Header Pin9 Function Select
4-pin Block
JP10 COM5 Header Pin9 Function Select
4-pin Block
JP11 COM6 Header Pin9 Function Select
4-pin Block
JP6 ME Unlock Select
2-pin Block
COPEN Case Open Message Display Function
2-pin Block
AT_MODE AT MODE Function Select 2-pin Block
Connectors
Connector Name
DCIN DC 12V Power–in Connector
RJ-11 RJ-11 Connector
PS2 PS/2 keyboard & mouse combo port
VGA Video Graphic Attach Connector
HDMI High-Definition Multimedia Interface
COM1 Serial Port Header
LPT Parallel Port Header
USB1_LAN1(Middle & Bottom ),
USB2_LAN2(Middle & Bottom )
USB 2.0 Port Connector x4
USB1_LAN1(Top),USB2_LAN2(Top) RJ-45 LAN Connector x2
7
AUDIO(Top) Audio Line Out Connector
AUDIO(Bottom) Audio MIC Connector
ATXPWR 12V Power-in Connector
SATAPW SATA Power out Connector
SATA1 SATAIII Connector
SATA2 SATAII Connector
MPE1 Full-size MSATA/Mini-PCIE Connector
MPE2 Half-size Mini-PCIE Connector
SYSFAN1,SYSFAN2,CPUFAN FAN Connector X3
SPEAK Speaker Connector
INVERTER LVDS Inverter Connector
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
FP
Front Panel Header(PWR LED/ HD
LED/Power Button /Reset)
9-pin Block
SPEAK1 Speaker Header 4-pin Block
PWRLED PWRLED Header 3-pin Block
FP_USB USB 2.0 Port Header 9-pin Block
LVDS LVDS Header 30-pin Block
COM2/3/4/5/6 Serial Port Header X5 9-pin Block
GPIO GPIO Header 10-pin block
LAN1_LED,LAN2_LED LAN Activity LED Header x2 2-pin Block
8
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JBAT (3-pin): CMOS RAM Clear Function Setting
CMOS Clear Setti ng
2-3 Closed：Clear CMOS.
JBAT
1-2 Closed： Normal；
3
1
3
1
(2) SYSFAN_DET (3-pin): SYSFAN1/SYSFAN2 R.P.M. Select
SYSFAN_DET
1-2 Closed：
SYSFAN1 R.P.M. Se lected ;
3
1
3
1
2-3 Closed：
SYSFAN2 R.P.M. Selected.
9
(3) JP1 (3-pin): INVERTER Back Light VCC 5V /12V Select
2-3 Closed: Back Light VCC=12V.
JP1→INVERTER Back Light VCC
1-2 Cl os ed : Bac k Lig ht VC C= 5 V;
13
1
(4) JP7 (3-pin): INVERTER Back Light Mode Select
2-3 Cl ose d: Ba ck Light DC Mod e Selec ted .
JP7→INV ER TE R Back Lig ht M ode
1-2 Closed: Back Light PWM Mode Selected;
13
1
10
(5) JP8 (4-pin): LCD Back Light VCC 3.3V/5V/12V Select
JP8→ LCD Back Light VCC
4-6 Closed: LVDS
VCC= 12V.
642
3-4 Closed: LVDS
VCC= 5V ;
2-4 Closed: LVDS
VCC= 3.3V;
3
1
5
13
5
24
6
1 3
5
2 4 6
(6) JP2 (3-pin): MINI-PCIE & MSATA Slot (MPE1) VCC3.3V/ 3.3VSB Select
2-3 Closed: MPE1 SlotVCC=3 VSB.
JP2→MPE1 Slot VCC
1-2 Closed: MPE1 Slot VCC= 3.3V;
1
3
1
3
Loading...