* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Page 2
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
Page 3
ENVIRONMENTAL SAFETY INSTRUCTION ........................................................................ iii
USER’S NOTICE .................................................................................................................. iv
MANUAL REVISION INFORMATION ................................................................................... iv
ITEM CHECKLIST ................................................................................................................ iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD............................................................................. 1
2-2 INTERNAL CONNECTORS, HEADERS AND JUMPER ......................................... 7
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Environmental Safety Instruction
l Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
l 0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
l Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
l The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
l Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
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USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June 18, 2019
Item Checklist
R
Motherboard
R
User’s Manual
iv
Page 6
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
l Rockchip® ARM Cortex A17 RK3288 Quad-core 1.8GHz
l Onboard 2GB DDR3L 1333MHz DRAM
l Onboard 8G Flash ROM (Max.32GB)
l 1 * Realtek GbE LAN
l 4 * COM
l 6 * USB 2.0, 1 * OTG (Option USB2.0)
l 1 * HDMI, 1 * eDP, 1 * LVDS
l 1 * Micro SD (TF) Card socket, 1 * SIM card socket
l Support 3G/4G/LTE, Bluetooth
l Support Android 5.1
1
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Spec
Description
l 3.5” SBC (102 * 146mm)
l 1* Mini
PCIe
slot
(full size
,
by USB interface)
l 1* Realtek RTL8211E
-
VB Gigabit LAN
(S
upport Fast Ethernet LAN
802.11 b/g/n, 2.4G
l 1* DC
-IN
Jack
1-2 Specification
Design
Chipset
CPU Socket
Memory Slot
l Rockchip® ARM Cortex A17 RK3288 SoC
l Rock chip® ARM Cortex A17 RK3288 1.8GHz
* for detailed CPU support information please visit our website
l Onboard 2GB DDR3L 1333MHz DRAM
l Onboard 8GB Flash ROM (Max. 32GB)
Expansion
Network
Rear I/O
Internal I/O
l 1* Micro SD (TF) Socket (Max 64GB)
l 1* SIM Card Holder
function of providing 10/100/1000Mbps Ethernet data transfer rate)
l RTL8723BS WIFI & Bluetooth module (Support
& BT 4.0)
l 1* HDMI port
l 2* USB2.0 port (1with USB OTG function via Jumper select)
l 1* Audio (Line-out, MIC)
l 1* RJ-45 port
l 1* Micro SD (TF) Card Socket (top)
l 1* SIM Card socket (bottom)
l 4* USB 2.0 connector
l 4* Serial interface
l 1* MIC & 1* Speaker connector
l 1* DC-IN power connector
l 1* LVDS header & 1* eDP header & 1* MIPI CSI connector
l 1* MIPI DSI connector (optional to ARMR3288WM-2N)
l 1* Inverter connector
l 1* GPIO & I2C combo header block
l 1* VDD_LCDLED jumper
l 1* LVDS LCD_VDD jumper & 1* EDP LCD_VDD jumper
l 1*OTG/HOST select jumper
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l 1* MIPI_VDD
select
jumper
(JP9: optional to
ARMR3288WM
-2N)
SW1:
BOOT SW2:
RESET
SW3:
AD KEY
4*
USB 2.0
EDP LCD_VDD Select
1-3 Product Diagram
Motherboard Internal Diagram:
Top View for ARMR3288W-2N:
CON28/30/24/29:
CON44:
CON39:
3.3V RS232
Full-size
Mini-PCIE Slot
CON45 (Jumper): USB/OTG Select
Speaker
CON40:
MIC
CON32: MIPI CSI
5V RS232
CON6:
IR
CON36:
CPU
CON37:
5V RS232
VDD_LCD LED Select
LVDS LCD_VDD Select
CON35:
LED
CON31 (Jumper):
CON25 (Jumper):
CON33:
FP_JW
CON4:
Inverter
CON41:
GPIO & I2C
CON3:
LVDS
CON2 (Jumper):
CON1:
EDP
*Note:The product diagrams are for illustration purpose only and mostly come from Model
ARMR3288W-2N, unless otherwise noted.
3
CON27:
Power Connector
Page 9
SW1:
BOOT SW2:
RESET
SW3:
AD KEY
4*
USB 2.0
Top View for ARMR3288WM-2N:
CON28/30/24/29:
CON39:
3.3V RS232
Full-size
Mini-PCIE Slot
CON45 (Jumper): USB/OTG Select
CON44:
Speaker
CON40:
MIC
CON15: MIPI DSI
CON32: MIPI CSI
CON6:
IR
CON37:
RS485
CPU
CON34:
RS485
CON35:
LED
CON31 (Jumper):
VDD_LCD LED Select
CON25 (Jumper):
LVDS LCD_VDD Select
CON33:
FP_JW
CON4:
Inverter
CON41:
GPIO & I2C
CON3:
LVDS
CON2 (Jumper):
EDP LCD_VDD Select
CON1:
EDP
J2 (Top):
Micro SD (TF) Card Socket
JP9
CON27:
Power Connector
4
Page 10
GND
TX
RX
Bottom View:
UART2
(Debug)
Wi-Fi & Bluetooth
Chip
SIM1 (Bottom):
SIM Card Socket
*Note: UART2 is for further debug option. Please refer to the above description for Pin Definition.
5
Page 11
6
Micro SD
RJ-45
LAN Port
HDMI
DC-IN
SIM Card
Socket
USB 2.0/OTG
USB 2.0 Port
Chapter 2
Hardware Installation
2-1 Rear I/O Connectors
(TF) Card
Socket
Audio
Port
Icon P/N Name Function
CON27
J3 HDMI Port
USB2
USB3
J17
J2 (Top)
12V DC-in
Power Jack
USB 2.0 Port
USB2.0/OTG
Port
Audio
Connector
Macro-SD (TF)
Card Socket
For user to connect compatible power adapter to
provide power supply for the system.
To connect display device that support HDMI
specification.
To connect USB keyboard, mouse or other devices
compatible with USB specification.
To connect USB keyboard, mouse or other devices
compatible with USB specification, also can function as
USB OTG port for software upgrade flash by jumper
select.
Line-out & MIC audio jack.
For user to insert compatible micro-SD (TF) card into
the socket.
SIM1
(Bottom)
SIM Card Socket
For user to install compatible SIM card.
Page 12
7
DP
Pin1
RX
JP1
RJ-45 LAN Port
This connector is standard RJ-45 LAN jack for Network
connection.
2-2 Internal Connectors, Headers & Jumpers
CON28/30/24/29(4-pin): USB 2.0 Connector