JETWAY ARMR3288W Series, ARMR3288WM-2N User Manual
ARMR3288W Series
User’s Manual
P/N: G03-ARMR3288R21-F
Revision: 1.0
Release date: June 18, 2019
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
i
ENVIRONMENTAL SAFETY INSTRUCTION ........................................................................ iii
USER’S NOTICE .................................................................................................................. iv
MANUAL REVISION INFORMATION ................................................................................... iv
ITEM CHECKLIST ................................................................................................................ iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD............................................................................. 1
1-2 SPECIFICATION ..................................................................................................... 2
1-3 PRODUCT DIAGRAM ............................................................................................. 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 REAR I/O CONNECTORS ...................................................................................... 6
TABLE OF CONTENT
2-2 INTERNAL CONNECTORS, HEADERS AND JUMPER ......................................... 7
ii
Environmental Safety Instruction
l Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
l 0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
l Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
l The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
l Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June 18, 2019
Item Checklist
R
Motherboard
R
User’s Manual
iv
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
l Rockchip® ARM Cortex A17 RK3288 Quad-core 1.8GHz
l Onboard 2GB DDR3L 1333MHz DRAM
l Onboard 8G Flash ROM (Max.32GB)
l 1 * Realtek GbE LAN
l 4 * COM
l 6 * USB 2.0, 1 * OTG (Option USB2.0)
l 1 * HDMI, 1 * eDP, 1 * LVDS
l 1 * Micro SD (TF) Card socket, 1 * SIM card socket
l Support 3G/4G/LTE, Bluetooth
l Support Android 5.1
1
Spec
Description
l 3.5” SBC (102 * 146mm)
l 1* Mini
PCIe
slot
(full size
,
by USB interface)
l 1* Realtek RTL8211E
-
VB Gigabit LAN
(S
upport Fast Ethernet LAN
802.11 b/g/n, 2.4G
l 1* DC
-IN
Jack
1-2 Specification
Design
Chipset
CPU Socket
Memory Slot
l Rockchip® ARM Cortex A17 RK3288 SoC
l Rock chip® ARM Cortex A17 RK3288 1.8GHz
* for detailed CPU support information please visit our website
l Onboard 2GB DDR3L 1333MHz DRAM
l Onboard 8GB Flash ROM (Max. 32GB)
Expansion
Network
Rear I/O
Internal I/O
l 1* Micro SD (TF) Socket (Max 64GB)
l 1* SIM Card Holder
function of providing 10/100/1000Mbps Ethernet data transfer rate)
l RTL8723BS WIFI & Bluetooth module (Support
& BT 4.0)
l 1* HDMI port
l 2* USB2.0 port (1with USB OTG function via Jumper select)
l 1* Audio (Line-out, MIC)
l 1* RJ-45 port
l 1* Micro SD (TF) Card Socket (top)
l 1* SIM Card socket (bottom)
l 4* USB 2.0 connector
l 4* Serial interface
l 1* MIC & 1* Speaker connector
l 1* DC-IN power connector
l 1* LVDS header & 1* eDP header & 1* MIPI CSI connector
l 1* MIPI DSI connector (optional to ARMR3288WM-2N)
l 1* Inverter connector
l 1* GPIO & I2C combo header block
l 1* VDD_LCDLED jumper
l 1* LVDS LCD_VDD jumper & 1* EDP LCD_VDD jumper
l 1*OTG/HOST select jumper
2
Loading...