COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 865PBA/865PBAP MOTHER-BOARD
AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT
ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT
WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL
OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS,
LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Release October 2004
Item Checklist
5
865PBA/865PBAP Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB2 Port (Option)
□
SPDIF-IN/SPDIF-OUT Adaptor (Option)
5
Cable for Serial ATA IDE Port
5
865PBA/ 865PBAP User’s Manual
Intel Pentium 4 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the proper
thermal environment is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heatsinks evaluated and recommended by Intel for use with Intel processors. Note, those heatsinks are
recommended for maintaining the specified Maximum T case requirement. In addition, this collection
is not intended to be a comprehensive listing of all heatsinks that support Intel processors.
For vendor list of heatsink and fan, please visit :
http://developer.intel.com/design/Pentium4/components/index
ii
Chapter 1
Introduction of 865PBA/865PBAP Motherboard
1-1 Feature of motherboard
The 865PBA/865PBAP motherboard is design for use Intel Pentium 4 Processor in LGA775
(Land Grid Array) Socket Prescott Processor with the Intel 865PE Chipset delivers a high
performance and professional desktop platform solution. Which utilize the design and the
memory size expandable to 2.0GB.
These motherboards use the newest Intel 865PE Chipset Supports 800/533MHz System Bus
in data transfer rate, these motherboards provided 200/166/133MHz SDRAM clock frequency
support DDR400/DDR333/DDR266 SDRAM. These motherboards also provided Dual Channel
function to increase memory performance. The motherboard embedded ICH5 chipset offers
two parallel ULTRA ATA 100 interface and two serial ATA interface to provide speedier
HDD throughout that boosts overall system performance.
For those wanting even greater graphic performance, an AGP 4X slot is included on the board
(For 1.5V AGP card only. No for 3.3V or Universal AGP card). This AGP slot will
support either a 4X/8X VGA card.
The 865PBAP motherboard including Fast Ethernet PCI controller chip support 10Mb/s,
100Mb/s Base transfer rate.
These motherboards also has an integrated 6-channel AC97’ CODEC chip on board support
6-channel 3D surround positioning Audio which is fully compatible with Sound Blaster Pro
that gives you the best sound quality and compatibility.
With USB control as well as capability of expanding to eight USB2.0 function ports, these
motherboards meet future USB demand also these motherboards have built-in hardware
monitor function. This will monitor and protect your computer. These motherboards special
design in hardware to protect BIOS from virus crash BIOS data.
These motherboards provide special function in BIOS Setup to setting CPU Host clock step
by step increasing let users to approach over clocking.
These motherboards provided high performance & meet future specification demand. It is
really wise choice for your computer.
1
1-2 Specification
Spec Description
ATX form factor 4 layers PCB size: 30.5x22.0cm
Design
Chipset
CPU Socket
(LGA 755 Socket)
Memory Socket
Expansion Slot &
Headers
Integrate IDE
Integrate Serial ATA
LAN On Board
(for 865PBAP only)
Audio
BIOS
Multi I/O
∗
Intel 865PE Memory Controller Hub (MCH) Chipset for
∗
865PBA/865PBAP
Intel 82801EB I/O Controller Hub (ICH5) Chipset
∗
Support Intel Pentium 4 755-Land LGA Package utilizes Flip-
∗
Chip Land Grid Array (FCLGA4) package processor
Support CPU Frequency 533MHz/800MHz
∗
Support 2.8G/3.0G/3.2G LGA 755 Pentium 4 processor
∗
Reserves support for future Intel Pentium 4 processors
∗
184-pin DDR SDRAM module socket x2
∗
Support Dual channel DDR266/DDR333/DDR400 DDR
∗
SDRAM
Expandable to 2.0GB
∗
AGP slot x1 for AGP 0.8V/1.5V standard only, support AGP
∗
2.0/3.0 & 4X/8X mode
32-bit PCI slot x 5
∗
Two IDE controllers support PCI Bus Mastering, ATA
∗
PIO/DMA and the ULTRA DMA 33/66/100 functions that
deliver the data transfer rate up to 100 MB/s
Two Serial ATA Host controllers, that deliver the data transfer
∗
rate up to 150 MB/s
VIA VT6106S PCI LAN controller chip
∗
Supports 10/100 Mb/sec data transfer rate
∗
Realtek ALC 6-channel AC97’ Codec integrated
∗
Support 6-channel 3D surround & Positioning Audio
∗
Audio driver and utility included
∗
Award 2Mb Flash ROM
∗
PS/2 keyboard and PS/2 mouse connectors
∗
Floppy disk drive connector x1
∗
Parallel port x1, Serial port x2
∗
USB 2.0 connector x4, headers x4 (connecting cable option)
∗
Audio connector Line-in, Line-out, MIC & Game Port header
∗
2
1-3 Performance List
The following performance data list is the testing result of some popular benchmark testing
programs. These data are just referred by users, and there is no responsibility for different
testing data values gotten by users (the different Hardware & Software configuration will
result in different benchmark testing results.)
Performance Test Report
CPU:
DRAM:
TwinMOS Winbond W942508CH-5 512MB DDR400 X 2
VGA Card:
Hard Disk Driver:
BIOS:
Win XP Professional (Service Pack 1)
OS:
Award Optimal default
Intel Pentium 4 3.2GHZ (800MHz FSB)
ATI 9800 PRO 128MB (1024X768X32BIT Color)
Maxtor DiamondMax Plus8 (ATA-133 7200RPM)
3D Mark 2001SE 18217
3D Mark 2003 5978
AQUAMRK3 43573
PCMark2004
System / CPU / Memory 4958 / 4885 / 5041
Graph / HDD 4146 / 3126
Content Creation Winstone 2004 29.5
Business Winstone 2004 22.6
3.Integer/Floating-Point SSE2 IT/S 22610 / 30323
UT2003 Benchmark (flyby/botmatch) 229.67 / 79.32
Quake3 DEMO1 / DEMO2 FPS 330.0 / 324.4
Return to Castle Wolfenstein FPS 155.9
Super Pi (1M) Second 43s
CPUZ System / CPU Clock 1999.7 / 3195.2
3
r
r
1-4 Layout Diagram & Jumper Setting
PS/2 Mouse
PS/2 Keyboard
PS2 KB/Mouse Port
K/B Power ON Jumper
(JP1)
PC99 Back Panel
ATX 12V Power Connector
USB Port (USB1)
USB Power ON Jumpe
(JP2)
USB Port/LAN Connector
PRINT LAN
MIC
LINE-IN
LINE-OUT
COM1 COM2 USB1
USB
CPU Socket
CPU FAN
ATX Power Connector
DDR DIMMx2
Floppy Connector
Audio Connector (CN1)
Front Panel Audio
CD Audio
VIA VT6106S LAN Controller
6-CH AC’97 Audio Codec
PCI Slot
SPDIF Connector
ITE 8712 I/O Chip
GAME Port Connector
2MBit FWH BIOS
IR Connector
USB Power ON Jumper
(JP4)
USB Port
(USB3, USB2)
Intel 865PE Chip
SYSFAN1
AGP 4X/8X 1.5V Slot
Intel 82801EB Chip
ATA 100 IDE Connector
Serial-ATA Connecto
(SATA1, 2)
Clear CMOS (JP3)
Speak Connector
Front Panel Connector
SYSFAN2
4
Jumpers
Jumper Name Description Page
JP3 CMOS RAM Clear 3-pin Block P.6
JP1 Keyboard Power On Enable/Disabled 3-pin Block P.7
JP2, JP4 USB Power On Enable/Disabled 3-pin Block P.7
Connectors
Connector Name Description Page
ATXPWR24P ATX Power Connector 24-pin Block P.21
ATX12V1 ATX 12V Power Connector 4-pin Block P.21
USB1, UL_B USB Port Connector 4-pin Connector P.22
LAN
(for 865PBAP)
KB
(PS2 KB/MOUSE)
PARALLEL Parallel Port Connector 25-pin Female P.22
CN1 Audio Line In/Out MIC Connector 3 phone jack Connector P.22
COM1 Serial Port COM1 Connector 9-pin Connector P.22
COM2 Serial Port COM2 Connector 9-pin Connector P.22
FDD Floppy Driver Connector 34-pin Block P.23
IDE1/IDE2 Primary/Secondary 40-pin Block P.23
SATA1, SATA2 Serial-ATA Port Connector 7-pin Block P.24
LAN Connectors RJ-45 Connector P.22
PS/2 Mouse & PS/2 Keyboard
6-pin Female P.22
Connector
Headers
Header Name Description Page
AUDIO Line-Out, MIC Headers 9-pin Block P.24
USB2, USB3 USB Port Headers 9-pin Block P.24
SPEAK Speaker connector 4-pin Block P.25
JW_FP
(Power LED/Reset/
IDE LED/ Power Button)
Front Panel Header
(including Power LED/ IDE activity LED/
Reset switch / Power On Button lead)
9-pin Block P.25
CPUFAN FAN Headers 4-pin Block P.25
SFAN1, SFAN2 FAN Headers 3-pin Block P.25
IR IR infrared module Headers 5-pin Block P.26
CDIN CD Audio-In Headers 4-pin Block P.26
GAME Game Port Headers 15-pin Block P.26
Expansion Sockets
Socket/Slot Name Description Page
LGA 775 Socket CPU Socket LGA 775 CPU Socket
DIMM1, DIMM2 DDR Module Socket 184-pin DDR SDRAM Module
Expansion Socket
PCI1 ∼ PCI5
PCI Slot 32-bit PCI Local Bus Expansion slots P.19
AGP AGP 4X/8X Mode Slot AGP Expansion Slot P.20
P.8
P.18
5
Chapter 2
Hardware installation
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect IDE and Floppy cables, Front Panel /Back Panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) CMOS RAM Clear (3-pin) : JP3
A battery must be used to retain the motherboard configuration in CMOS RAM short 1-2
pins of JP3 to store the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power
2. Remove ATX power cable from ATX power connector
3. Locate JP3 and short pins 2-3 for a few seconds
4. Return JP3 to its normal setting by shorting pins 1-2
5. Connect ATX power cable back to ATX power connector
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
13
JP3
1-2 closed Normal (Default)
CMOS RAM Clear Setting
13
JP3
2-3 closed Clear CMOS
6
(2) Keyboard/USB Power On function Enabled/Disabled: JP1/JP2, JP4
When setting Enabled you can using keyboard by key in password/USB device to power
on system.
JP1
JP2
JP4
JP1
3
1
JP2
1
3
13
13
JP1 1-2 closed K/B Power ON Disabled (Default)
3
JP1 2-3 closed K/B Power ON Enabled
1
JP2 1-2 closed USB Power On Disabled (Default)
1
JP2 2-3 closed USB Power On Enabled
3
JP4 1-2 closed USB Power On Disabled (Default) JP4
JP4 2-3 closed USB Power On Enabled
2-3 Install CPU
2-3-1 Glossary
Chipset (or core logic) - two or more integrated circuits which control the interfaces between
the system processor, RAM, I/O devises, and adapter cards.
Processor slot/socket - the slot or socket used to mount the system processor on the
motherboard.
Slot (AGP, PCI, ISA, RAM) - the slots used to mount adapter cards and system RAM.
AGP - Accelerated Graphics Port - a high speed interface for video cards; runs at 1X
(66MHz), 2X (133MHz), 4X (266MHz), or 8X (533MHz).PCI - Peripheral Component Interconnect - a high speed interface for video cards, sound
cards, network interface cards, and modems; runs at 33MHz.
ISA - Industry Standard Architecture - a relatively low speed interface primarily used for
sound cards and modems; runs at approx. 8MHz.
Serial Port - a low speed interface typically used for mouse and external modems.
Parallel Port - a low speed interface typically used for printers.
PS/2 - a low speed interface used for mouse and keyboards.
USB - Universal Serial Bus - a medium speed interface typically used for mouse, keyboards,
scanners, and some digital cameras.
Sound (interface) - the interface between the sound card or integrated sound connectors and
speakers, MIC, game controllers, and MIDI sound devices.
LAN (interface) - Local Area Network - the interface to your local area network.
BIOS (Basic Input/Output System) - the program logic used to boot up a computer and
establish the relationship between the various components.
Driver - software, which defines the characteristics of a device for use by another device or
other software.
Processor - the "central processing unit" (CPU); the principal integrated circuit used for doing
the "computing" in "personal computer"
Front Side Bus Frequency -
by the clock generator for CPU, DRAM and PCI BUS.
CPU L2 Cache -
the flash memory inside the CPU, normally Athlon CPU has 256K or above,
while Duron will have 64K.
the working frequency of the motherboard, which is generated
7
2-3-2 About Intel Pentium 4 LGA775 CPU
This motherboard provides a 775-pin surface mount, LGA775 Land Grid Array socket,
referred to as the LGA775 socket supports Intel Pentium 4 processor in the 775 Pin package
utilizes Flip-Chip Land Grid Array (FC-LGA4) package technology.
The CPU that comes with the motherboard should have a cooling FAN attached to prevent
overheating. If this is not the case, then purchase a correct cooling FAN before you turn on
your system.
WARNING!
Be sure that there is sufficient air circulation across the processor’s
heatsink and CPU cooling FAN is working correctly, otherwise it may
cause the processor and motherboard overheat and damage, you may install
an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA775 socket
and open it by first pulling the level sideways away from the socket then upward to a 90degree angle. Insert the CPU with the correct orientation as shown below. The notched
corner should point toward the end of the level. Because the CPU has a corner pin for two of
the four corners, the CPU will only fit in the orientation as shown.
LGA775
Colden Arrow
CPU LGA775 Socket
When you put the CPU into the LGA775 socket. No force require to insert of the CPU, then
press the level to Locate position slightly without any extra force.
8
2-3-3 LGA 775 CPU Installation Guide
Socket Preparation
1. Opening the socket:
Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever,
otherwise lever can bounce back like a “mouse trap” and WILL cause bent contacts (when
loaded)
Socket Load
Plate Open
1. Disengage Load Lever by depressing down and
out on the hook to clear retention tab
2. Rotate Load Lever to fully open position at
approximately 135degrees
3. Rotate Load Plate to fully open position at
approximately 100degrees
Socket Load
Lever Open
2. Remove PnP Cap (Pick & Place Cap)
i. With left hand index finger and thumb to support the load plate edge, engage PnP cap with right
hand thumb and peel the cap from LGA775 Socket while pressing on center of PnP cap to assist in
removal.
ii. Set PnP cap aside. Always put PnP cap back on if the processor is removed from the socket.
iii. Visually inspect PnP cap for damage. If damage observed, replace the PnP cap.
Note: After PnP cap removal, make sure socket
load plate and contacts are free of foreign
material; Refer to Overview Module for FM
cleaning.
Note: Optionally, remove PnP cap after CPU insertion.
This will compromise the ability to visually
inspect socket.
9
3. Visually inspect for bent contacts (Recommend at least 1stpass visual inspection)
NOTE:Refer to the Handling and Inspection Module for 1stand 2ndpass inspection details.
NOTE: Glove images are for illustrative purposes only. Please consult local safety guidelines for
specific requirements
NOTE: Recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing
the PnP cap with right hand
775-land LGA Package Insertion
Press to remove
Pin 1 Indicator
Alignment Key
1. Lift processor package from shipping media by
grasping the substrate edges ONLY.
Note: Orient processor package such that the Pin 1
triangle mark is on bottom left and both key
notches are on left side
2. Land Side Cover Handling: Remove land side cover
with the opposite hand by depressing larger
retention tab and peeling the cover away
3. Set and reserve the land side cover aside.
Note: Always keep the land side cover on the
processor when not in the socket.
4. Visually inspect the package gold pads: Scan the
processor package gold pad array for presence of
foreign material. Refer to Overview Module for FM
cleaning recommendations
5. Orient the package with IHS up. Locate Pin 1 and
the two orientation key notches
6. Carefully place the package into the socket body
using a purely vertical motion
CAUTION: Using Vacuum Pen for installation is not recommended
7. Verify that package is within the socket body and
properly mated to the orient keys
8. Close the socket by
i. Rotating the Load Plate onto the package HIS
ii. While pressing down lightly on Load Plate, engage
the Load Lever.
iii. Securing Load Lever with Load Plate tab under
retention tab of Load Lever
10
775-Land Package Removal
1. Open the Load Plate/Lever with both hands:
With left hand index finger and thumb to support
the load plate edge, engage PnP cap with right hand
thumb and peel the cap from LGA775 Socket while
pressing on center of PnP cap to assist in removal.
2. Pick up 775-land LGA package:
By Vacuum Pen: Place a minimum 9-mm cup at
approximately the center of IHS.
Recommend not to place Vacuum Pen on IHS edge.
Risk of dropping and causing bent contact.
Recommend not to use Vacuum Pen for inserting
CPU By Hand: Index finger to hold load plate hinge
Chamfer on Land Side
Cover (align this with
pin 1 mark on 775-land
LGA package)
Large Retention Tabs
(pointing towards user)
Hold at corners
side and thumb to hold load lever side
3. Lift the package straight up and away.
4. Assemble processors land side cover immediately
to prevent contamination.
i. While holding the processor by the 3 corners, the
other hand lift land side cover from work surface
by grasping at the large retention tabs. Ensure
retention tabs and package are pointing each
other.
ii. Orientate so that land side cover chamfer is
matching with package Pin 1 location.
iii. Hook the first large retention tab on the package
substrate. Then press the opposite tab onto the
substrate.
iv. Place processor with land side cover installed onto
proper shipping media or other ESD approved work
surface
11
r
5. Visually inspect socket contact array
1. First Pass Inspection
i. Scan socket contact array at varying angles noting the presence of any foreign material
ii. If foreign material can’t be blown off by compressed air, or mechanical damage (Mode1 or 4)
observed, reject the motherboard for further evaluation or socket replacement.
2. Second Pass Inspection
i. Repeat 2 more times to sight down the rows and columns from each of the 4 sides of the socket to
ensure all contacts within the array are inspected
ii. Inspect for Mode2, Mode3, and Mode5 failures
Note: Refer to the Test Module for detail visual inspections
6. Assemble LGA775 socket PnP cap
i. Secure/Hook the back side of PnP cap.
ii. Snap down the front side to fully secure
7. Close the Socket
Intel Reference Thermal Solution Assembly
NOTE: Depending on the configuration, Thermal Solution Integration procedure could perform with
M/B alone or with M/B in the Chassis.
Fan cabled on side
closest to MB heade
0.150-inch backside
clearance for
fastener installation
1. Place motherboard on support structure providing
minimum 0.150-inch backside clearance
2. Apply 300 mg of Thermal Interface Material (Shin-
Fastener slots
pointing straight out
Etsu G751) onto center of IHS
12
NOTE: Thermal Solutions that come with IntelR boxed
Apply Thermal
Interface Material
processor use pre-applied thermal interface material
and not grease.
3. Remove Heat Sink (HS) from packaging media
4. Place HS onto the LGA775 Socket
•Ensure fan cables are oriented on side closest to
fan header
•Align Fasteners with MB through-holes
5. Inspection
•Ensure cables are not trapped or interfere fastener
operation
•Ensure fastener slots are pointing straight out from
heatsink
Fastener Cap not
resting against spring
Press Down
(4 Places)
Fastener flush
against MB
Both fastener
halves are flush
against spring
Fastener flush
against spring
6. Actuate fasteners
•While holding HS to prevent tilting, press down on
fastener caps with thumb to install and lock
Repeat with remaining fasteners
7. Inspection
• Verify the fasteners are properly seated
• Ensure both fastener cap and base are flush with
spring and motherboard
8. Connect fan header with Board header
9. Secure excess cable with tie-wrap to ensure cable
does not interfere with fan operation or contact
other components.
13
Intel Reference Thermal Solution Disassembly
1. Rotate fastener cap. turn to un-lock
2. Pull up fastener cap to un-seat 12
1. Disconnect fan cable from motherboard header
2. Turn fastener caps (4) counter-clock wise
90degrees to the un-locked position
•A flat-bladed screwdriver may be used if required
3. Pull up on fastener caps to unseat
4. Manually remove HS with gentle twist motion.
5. To re-assemble the HS, reset the fastener caps to
their original position with the slot perpendicular to
the HS. Then, follow the assembly instructions.
Note: Thermal grease should be reapplied
TIM and Grease Removal from CPU
1 2
3
4
14
Loading...
+ 39 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.