IXYS VUO34-18NO1, VUO34-16NO1, VUO34-14NO1, VUO34-12NO1, VUO34-08NO1 Datasheet

VUO 34
Three Phase Rectifier Bridge
V
RSM
VV
900 800 VUO 34-08NO1
V
RRM
Type
10
8 6
Symbol Test Conditions Maximum Ratings I
dAV
I
dAV
I
dAVM
I
FSM
2
t TVJ = 45°C t = 10 ms (50 Hz), sine 450 A2s
I
TK = 90°C, module 36 A TA = 45°C (R module 45 A
= 0.5 K/W), module 37 A
thKA
TVJ = 45°C; t = 10 ms (50 Hz), sine 300 A VR = 0 t = 8.3 ms (60 Hz), sine 320 A
= T
T
VJ
VJM
VR = 0 t = 8.3 ms (60 Hz), sine 280 A
t = 10 ms (50 Hz), sine 260 A
VR = 0 t = 8.3 ms (60 Hz), sine 425 A2s
= T
T
VJ
VJM
VR = 0 t = 8.3 ms (60 Hz), sine 325 A2s
T
VJ
T
VJM
T
stg
V
ISOL
M
d
50/60 Hz, RMS t = 1 min 3000 V~
£ 1 mA t = 1 s 3600 V~
I
ISOL
Mounting torque (M5) 2 - 2.5 Nm
t = 10 ms (50 Hz), sine 340 A2s
-40...+130 °C 130 °C
-40...+125 °C
(10-32UNF) 18-22 lb.in.
Weight typ. 35 g
1/2
4/5
I
dA VM
V
= 45 A = 800-1800 V
RRM
2
1
5
4
10
8
6
Features
Package with DCB ceramic base plate
Isolation voltage 3600 V~
Planar passivated chips
Blocking voltage up to 1800 V
Low forward voltage drop
Leads suitable for PC board soldering
UL registered E72873
Applications
Supplies for DC power equipment
Input rectifiers for PWM inverter
Battery DC power supplies
Field supply for DC motors
Advantages
Easy to mount with two screws
Space and weight savings
Improved temperature and power cycling
Dimensions in mm (1 mm = 0.0394")
Symbol Test Conditions Characteristic Values I
R
V
F
V
T0
r
T
R
thJH
d
S
d
A
a Max. allowable acceleration 50 m/s
Data according to IEC 60747 and refer to a single diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions.
VR= V
RRM
VR= V
RRM
IF= 55 A; TVJ = 25°C £ 1.51 V For power-loss calculations only 0.8 V
per diode, 120° rect. 2.5 K/W per module, 120° rect. 0.42 K/W
Creeping distance on surface 12.7 mm Creepage distance in air 9.4 mm
TVJ = 25°C £ 0.3 mA TVJ = T
VJM
£ 5mA
15 mW
© 2000 IXYS All rights reserved
2
1 - 2
VUO 34
Z
90
A
I
80
F
70
T
= 25°C
VJ
TVJ = 130°C
60
50
max.
40
typ.
30
20
10
0
0.00.51.01.52.02.5 V
F
Fig. 1 Forward current versus voltage
drop per diode
150
P
tot
W
120
90
250
A
I
FSM
50 Hz
0.8 x V
RRM
200
1000
A2s
I2dt
TVJ = 45°C
150
TVJ = 45°C
100
100
TVJ = 130°C
TVJ = 130°C
50
0
-3
V
10
-2
10
-1
10
t
10
s
Fig. 2 Surge overload current per diode
I
: Crest value. t:duration
FSM
10
0
110
Fig. 3 I2t versus time (1-10 ms)
per diode
ms
t
50
K/W
R
thKA
0.5 1
1.5
I
dAVM
A
40
2 3 4 6
30
60
30
0
I
A
dAVM
0 2550751001251500 10203040
°C
T
A
20
10
0
0 255075100125150
Fig. 4 Power dissipation versus direct output current and ambient temperature Fig. 5 Maximum forward current at
heatsink temperature T
3.0
K/W
th
JK
2.5
2.0
1.5
1.0
Zth
JK
Constants for Z
iR
calculation:
thJK
(K/W) ti (s)
th
K
1 0.005 0.008
0.5
2 0.3 0.05 3 1.245 0.1
0.0
-3
10
-2
10
-1
10
0
10
1
s
10
2
10
t
4 0.95 0.5
°C
T
K
Fig. 6 Transient thermal impedance junction to heatsink per diode
© 2000 IXYS All rights reserved
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