IXYS MEK300-06DA, MEE300-06DA, MEA300-06DA Datasheet

Fast Recovery Epitaxial Diode (FRED) Module
Preliminary data
MEA 300-06 DA MEK 300-06 DA
MEE 300-06 DA
V
RRM
I
FAVM
t
rr
= 600 V = 304 A = 250 ns
V
RSM
V V 600 600
V
RRM
Type
MEA 300-06DA MEK 300-06DA MEE 300-06DA
123 123 123
Symbol Test Conditions Maximum Ratings I
FRMS
I
ÿÿ
TC = °C; rectangular, d = 0.5 A
FAVM
I
FRM
I
FSM
I2t TVJ = 45°C; t = 10 ms (50 Hz), sine A2s
T
VJ
T
stg
T
Smax
P
tot
V
ISOL
M
d
d
S
d
A
a Maximum allowable acceleration m/s Weight g
75 430 A
TC = °C
75 304
tP < 10 ms; rep. rating, pulse width limited by T
VJM
TVJ = 45°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms(60 Hz), sine A
TVJ = 150°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms(60 Hz), sine A
1640 2400
2640 2160
2380
A
28800
t = 8.3 ms(60 Hz), sine A2s
TVJ = 150°C; t = 10 ms (50 Hz), sine A2s
t = 8.3 ms(60 Hz), sine A2s
TC = 25°CW 50/60 Hz, RMS t = 1 min V~
I
£ 1 mA t = 1 s V~
ISOL
Mounting torque (M6) Nm/lb.in. Terminal connection torque (M6) Nm/lb.in.
2.25-2.75/20-25
4.50-5.50/40-48
Creeping distance on surface mm Strike distance through air mm
29300 23300
23800
-40...+150
-40...+125 110
875
3000 3600
12.7
9.6
°C °C °C
50
150
Symbol Test Conditions Characteristic Values (per diode)
typ. max.
I
R
V
F
V
T0
r
T
R
thJH
R
thJC
t
rr
I
RM
-di/dt = A/msT
I
rating includes reverse blocking losses at T
FAVM
Data according to IEC 60747 IXYS reserves the right to change limits, test conditions and dimensions
TVJ = 25°CVR= V TVJ = 25°CVR= 0.8 • V TVJ = 125°CVR= 0.8 • V
150 1.05
IF = A; TVJ=125°CV
260 1.19
IF = A; TVJ=125°CV
For power-loss calculations only V
RRM
RRM RRM
TVJ=25°CV TVJ=25°CV
1.27
1.36
0.85
12 80
mA mA
3
mA
1.34 mW
DC current K/W DC current K/W
300 250 300
IF = A TVJ = 100°Cns
300 44
VR= V TVJ = 25°CA
400 66
= 100°CA
VJ
, VR = 0.6 V
VJM
, duty cycle d = 0.5
RRM
0.228
0.143
© 2000 IXYS All rights reserved
3
2
1
Features
International standard package with DCB ceramic base plate
Planar passivated chips
Short recovery time
Soft recovery behaviour
Isolation voltage 3600 V~
UL registered E 72873
Applications
Antiparallel diode for high frequency switching devices
Free wheeling diode in converters and motor control circuits
Inductive heating and melting
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
High reliability circuit operation
2
Low voltage peaks for reduced protection circuits
Low noise switching
Low losses
Dimensions in mm (1 mm = 0.0394")
749
1 - 2
MEA 300-06 DA MEE 300-06 DA MEK 300-06 DA
500
A
400
I
F
300
200
TVJ=125°C TVJ=25°C
100
0
0.0 0.4 0.8 1.2 1.6 V
F
Fig. 1 Forward current IF versus
max. voltage drop VF per leg
1.4
1.2
K
f
1.0
0.8
0.6
I
RM
Q
r
20
TVJ= 100°C VR = 300V
µC
Q
15
r
IF= 600A IF= 300A
10
IF= 150A
5
0
V
100 1000
A/ms
-diF/dt
Fig. 2 Typ. reverse recovery
charge Qr versus -diF/dt
400
ns
350
t
rr
300
TVJ= 100°C VR = 300V
IF= 600A IF= 300A IF= 150A
200
TVJ= 100°C VR = 300V
A
I
RM
150
IF= 600A IF= 300A
100
IF= 150A
50
0
-di
F
A/ms
/dt
200 600 10000 400 800
Fig. 3 Typ. peak reverse current I
versus -diF/dt
60
V
t
fr
50
V
FR
40
30
20
TVJ= 100°C IF = 300A
V
FR
RM
3.0 µs
2.5
t
fr
2.0
1.5
1.0
250
10
0.5
0.4 0 40 80 120 160
T
VJ
Fig. 4 Dynamic parameters Q
versus junction temperature T
°C
, I
r
RM
VJ
200
200 600 10000 400 800
/dt
-di
F
Fig. 5 Typ. recovery time t
versus -diF/dt
0.25
K/W
0.20
0.15
Z
Z
thJH
thJS
0.10
0.05
0.00
0.001 0.01 0.1 1 10
Fig. 7 Transient thermal impedance junction to heatsink
s
t
© 2000 IXYS All rights reserved
A/ms
rr
0
0 200 400 600 800 1000
A/ms
diF/dt
Fig. 6 Typ. peak forward voltage V
and t
versus diF/dt
fr
Constants for Z
iR
calculation:
thJS
(K/W) ti (s)
thi
1 0.002 0.08 2 0.008 0.024 3 0.054 0.112 4 0.164 0.464
0.0
FR
814
2 - 2
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