IXYS MEA75-12DA, MEK75-12DA, MEE75-12DA Datasheet

Fast Recovery Epitaxial Diode (FRED) Module
MEA 75-12 DA MEK 75-12 DA
MEE 75-12 DA
V I t
RRM
FAV
rr
= 1200 V = 75 A = 250 ns
Preliminary data
V
RSM
V V MEA75-12 DA MEK 75-12 DA MEE 75-12 DA
1200 1200
Symbol Test Conditions Maximum Ratings
I
FRMS
I
FAV
I
FRM
I
FSM
I2t T
T
VJ
T
stg
T
Hmax
P
tot
V
ISOL
M
d
d
S
d
A
a Maximum allowable acceleration m/s
Weight g
V
RRM
T
= °CA
75 107
case
T
= °C; rectangular, d = 0.5 A
75 75
case
t
< 10 µs; rep. rating, pulse width limited by T
P
T
= 45°C; t = 10 ms (50 Hz), sine A
VJ
T
= 150°C; t = 10 ms (50 Hz), sine A
VJ
= 45°C; t = 10 ms (50 Hz), sine A
VJ
T
= 150°C; t = 10 ms (50 Hz), sine A
VJ
T
= 25°CW
case
50/60 Hz, RMS t = 1 min V~ I
1 mA t = 1 s V~
ISOL
Mounting torque (M5) Nm/lb.in. Terminal connection torque (M5) Nm/lb.in.
Creep distance on surface mm Strike distance through air mm
Type
123 123 123
VJM
TBD
A
t = 8.3 ms (60 Hz), sine A
t = 8.3 ms (60 Hz), sine A
t = 8.3 ms (60 Hz), sine A2s
t = 8.3 ms (60 Hz), sine A2s
-40...+150
-40...+125 110
°C °C °C
280
2.50-4/22-35
2.50-4/22-35
12.7
9.6
2
2
50
90
s
s
2
TO-240 AA
3
2
1
Features
International standard package with DCB ceramic base plate
Planar passivated chips
Short recovery time
Low switching losses
Soft recovery behaviour
Isolation voltage 3600 V~
UL registered E 72873
Applications
Antiparallel diode for high frequency switching devices
Free wheeling diode in converters and motor control circuits
Inductive heating and melting
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
High reliability circuit operation
Low voltage peaks for reduced protection circuits
Low noise switching
Low losses
Symbol Test Conditions Characteristic Values (per diode)
typ. max.
I
R
V
F
V
T0
r
T
R
thJH
R
thJC
t
rr
I
RM
Data according to IEC 60747 IXYS reserves the right to change limits, test conditions and dimensions
T
= 25°CV
VJ
T
= 25°CV
VJ
T
= 125°CV
VJ
100 1.85
IF = A; T
300 2.58
IF = A; T
For power-loss calculations only V
DC current K/W DC current K/W
IF = A T
150 250 300
VR = V T
600 22
-di/dt = A/µsT
200 33
= V
R
RRM
= 0.8 • V
R
= 0.8 • V
R
= 125°CV
VJ
T
=25°CV
VJ
= 125°CV
VJ
T
=25°CV
VJ
RRM
RRM
2.17
2.64
0.5 34
mA
2
mA mA
1.48
3.65
m
0.550
0.450
= 100°Cns
VJ
= 25°CA
VJ
= 100°CA
VJ
© 2000 IXYS All rights reserved
Dimensions in mm (1 mm = 0.0394")
015
D6 - 5
MEA 75-12 DA MEE 75-12 DA
MEK 75-12 DA
200
A
175
150
I
F
125
TVJ=125°C TVJ= 25°C
100
75
50
25
0
0123
V
V
F
Fig. 1 Forward current IF versus
voltage drop VF per leg
1.4
1.2
K
f
1.0
I
0.8
RM
Q
r
0.6
0.4 0 50 100 150
°C
T
VJ
Fig. 4 Dynamic parameters Qr, I
versus junction temperature T
Q
10
µC
8
r
6
TVJ= 100°C VR = 600V
IF= 150A IF= 100A IF= 70A
I
RM
100
A
80
60
TVJ= 100°C VR = 600V
IF= 150A IF= 100A IF= 70A
4
2
0
10 100 1000
A/µs
-diF/dt
Fig. 2 Reverse recovery charge Q
versus -diF/dt
350
ns
300
t
rr
250
200
TVJ= 100°C VR = 600V
IF= 150A IF= 100A IF= 70A
r
40
20
0
200 600 10000 400 800
-di
Fig. 3 Peak reverse current I
versus -diF/dt
100
A
80
V
FR
60
40
20
t
fr
F
A/µs
/dt
RM
2.0
µs
V
FR
1.6 t
fr
1.2
0.8
0.4
TVJ= 100°C IF = 150A
150
200 600 10000 400 800
RM
Fig. 5 Recovery time trr versus -diF/dt Fig. 6 Peak forward voltage VFR and t
VJ
-di
A/µs
/dt
F
0
0 200 400 600 800 1000
diF/dt
versus diF/dt
0.0
A/µs
fr
0.6
K/W
0.5
0.4
Z
thJH
0.3
0.2
0.1
0.0
0.001 0.01 0.1 1 10
s
Fig. 7 Transient thermal impedance junction to heatsink
D6 - 6
Constants for Z
iR
calculation:
thJH
(K/W) ti (s)
thi
1 0.037 0.002 2 0.138 0.134 3 0.093 0.25
75-12 DA
t
4 0.282 0.274
016
© 2000 IXYS All rights reserved
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