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Advanced Technical Information
PolarHT
TM
Power MOSFET
IXTQ 75N10P
IXTA 75N10P
IXTP 75N10P
N-Channel Enhancement Mode
Symbol Test Conditions Maximum Ratings
V
DSS
V
DGR
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt I
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight TO-3P 5.5 g
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) Min. Typ. Max.
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
TJ= 25°C to 175°C 100 V
TJ= 25°C to 175°C; RGS = 1 MΩ 100 V
±20 V
TC= 25°C75A
TC= 25°C, pulse width limited by T
JM
200 A
TC= 25°C50A
TC= 25°C30mJ
TC= 25°C 1.0 J
≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ V
S
, 10 V/ns
DSS
TJ≤ 150°C, RG = 10 Ω
TC= 25°C 300 W
-55 ... +150 °C
150 °C
-55 ... +150 °C
1.6 mm (0.062 in.) from case for 10 s 300 °C
Maximum tab temperature for soldering 260 °C
TO-263 package for 10s
Mounting torque (TO-3P / TO-220) 1.13/10 Nm/lb.in.
TO-220 4 g
TO-263 3 g
VGS= 0 V, ID = 250 µA 100 V
VDS= VGS, ID = 250µA 2.5 5.0 V
VGS= ±20 VDC, VDS = 0 ±100 nA
VDS= V
DSS
25 µA
VGS= 0 V TJ = 125°C 250 µA
VGS= 10 V, ID = 0.5 I
D25
21 25 mΩ
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
V
I
D25
R
DSS
DS(on)
= 100 V
= 75 A
= 25 m
ΩΩ
Ω
ΩΩ
TO-3P (IXTQ)
G
D
S
(TAB)
TO-220 (IXTP)
G
D
S
(TAB)
TO-263 (IXTA)
G
S
(TAB)
G = Gate D = Drain
S = Source TAB = Drain
Features
z
International standard packages
z
Unclamped Inductive Switching (UIS)
rated
z
Low package inductance
- easy to drive and to protect
Advantages
z
Easy to mount
z
Space savings
z
High power density
PolarHTTM DMOS transistors
utilize proprietary designs and
process. US patent is pending.
© 2004 IXYS All rights reserved
DS99158(03/04)
IXTA 75N10P IXTP 75N10P
IXTQ 75N10P
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ. Max.
g
C
C
C
t
t
t
t
Q
Q
Q
R
R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
thCK
VDS= 10 V; ID = 0.5 I
, pulse test 20 28 S
D25
2250 pF
VGS = 0 V, VDS = 25 V, f = 1 MHz 890 pF
275 pF
27 ns
VGS = 10 V, VDS = 0.5 V
DSS
, ID = I
D25
53 ns
RG = 10 Ω (External) 66 ns
45 ns
74 nC
VGS= 10 V, VDS = 0.5 V
, ID = 0.5 I
DSS
D25
18 nC
40 nC
0.42 K/W
(TO-3P) 0.21 K/W
(TO-220) 0.25 K/W
Source-Drain Diode Characteristic Values
(T
Symbol Test Conditions Min. typ. Max.
= 25°C, unless otherwise specified)
J
TO-3P (IXTQ) Outline
I
S
I
SM
V
SD
VGS = 0 V 75 A
Repetitive 200 A
IF = IS, VGS = 0 V, 1.5 V
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
t
rr
IF = 25 A 120 ns
-di/dt = 100 A/µs
Q
RM
VR = 75 V 1.4 µC
TO-263 (IXTP) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.06 4.83 .160 .190
A1 2.03 2.79 .080 .110
b 0.51 0.99 .020 .039
b2 1.14 1.40 .045 .055
c 0.46 0.74 .018 .029
c2 1.14 1.40 .045 .055
D 8.64 9.65 .340 .380
D1 7.11 8.13 .280 .320
E 9.65 10.29 .380 .405
E1 6.86 8.13 .270 .320
e 2.54 BSC .100 BSC
L 14.61 15.88 .575 .625
L1 2.29 2.79 .090 .110
L2 1.02 1.40 .040 .055
L3 1.27 1.78 .050 .070
L4 0 0.38 0 .015
R 0.46 0.74 .018 .029
TO-220 (IXTA) Outline
Pins: 1 - Gate 2 - Drain
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 6,583,505
of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 6,683,344