
TrenchMV
TM
Power MOSFET
IXTA60N10T
IXTP60N10T
N-Channel Enhancement Mode
Avalanche Rated
Symbol Test Conditions Maximum Ratings
V
DSS
V
DGR
V
GSM
I
D25
I
DM
I
A
E
AS
P
D
T
J
T
JM
T
stg
T
L
T
SOLD
M
d
Weight TO-263 2.5 g
TJ= 25°C to 175°C 100 V
TJ= 25°C to 175°C, RGS = 1MΩ 100 V
Transient ± 30 V
TC= 25°C60 A
TC= 25°C, pulse width limited by T
JM
180 A
TC= 25°C10 A
TC= 25°C 500 mJ
TC= 25°C 176 W
-55 ... +175 °C
175 °C
-55 ... +175 °C
1.6mm (0.062in.) from case for 10s 300 °C
Plastic body for 10 seconds 260 °C
Mounting torque (TO-220) 1.13/10 Nm/lb.in
TO-220 3.0 g
V
I
R
D25
DSS
DS(on)
= 100V
= 60A
≤ ≤
18m
≤
≤ ≤
ΩΩ
Ω
ΩΩ
TO-263 (IXTA)
G
S
(TAB)
TO-220 (IXTP)
G
D
S
G = Gate D = Drain
S = Source TAB = Drain
(TAB)
Features
z
International standard packages
z
175°C Operating Temperature
z
Avalanche Rated
z
Low R
DS(on)
Symbol Test Conditions Characteristic Values
(TJ = 25°C unless otherwise specified) Min. Typ. Max.
BV
V
I
GSS
I
DSS
DSS
GS(th)
VGS= 0V, ID = 250μA 100 V
VDS= VGS, ID = 50μA 2.5 4.5 V
VGS= ± 20V, VDS = 0V ± 100 nA
VDS= V
DSS
1 μA
VGS= 0V TJ = 150°C 100 μA
R
DS(on)
© 2007 IXYS CORPORATION, All rights reserved
VGS= 10V, ID = 25A, Notes 1, 2 14.8 18 mΩ
Advantages
z
Easy to mount
z
Space savings
z
High power density
Applications
z
DC/DC Converters and Off-line UPS
z
Primary Switch for 24V and 48V
Systems
z
High Current Switching Applications
z
Distributed Power Architechtures
and VRMs
z
Electronic Valve Train Systems
z
High Voltage Synchronous Recifier
DS99647B(08/08)

Symbol Test Conditions Characteristic Values
(TJ = 25°C unless otherwise specified) Min. Typ. Max.
g
C
C
C
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
R
R
fs
iss
oss
rss
g(on)
gs
gd
thJC
thCH
VDS= 10V, ID = 0.5 • I
, Note 1 25 42 S
D25
2650 pF
VGS = 0V, VDS = 25V, f = 1MHz 335 pF
60 pF
27 ns
Resistive Switching Times
V
= 10V, VDS = 0.5 • V
GS
R
= 15Ω (External)
G
DSS
, ID = 10A
40 ns
43 ns
37 ns
49 nC
VGS= 10V, VDS = 0.5 • V
, ID = 10A 15 nC
DSS
11 nC
0.85 °C/W
TO-220 0.50 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
TJ = 25°C unless otherwise specified) Min. Typ. Max.
I
S
I
SM
V
SD
t
rr
I
RM
Q
RM
VGS = 0V 60 A
Repetitive, pulse width limited by T
JM
240 A
IF = 25A, VGS = 0V, Note 1 1.2 V
= 0.5 • IS, VGS = 0V
I
F
-di/dt = 100A/μs
VR = 0.5 • V
DSS
59 ns
3.8
112 nC
IXTA60N10T
IXTP60N10T
TO-263 (IXTA) Outline
Pins: 1 - Gate 2 - Drain
3 - Source 4, TAB - Drain
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.06 4.83 .160 .190
A1 2.03 2.79 .080 .110
b 0.51 0.99 .020 .039
b2 1.14 1.40 .045 .055
c 0.46 0.74 .018 .029
c2 1.14 1.40 .045 .055
D 8.64 9.65 .340 .380
D1 7.11 8.13 .280 .320
E 9.65 10.29 .380 .405
E1 6.86 8.13 .270 .320
e 2.54 BSC .100 BSC
L 14.61 15.88 .575 .625
L1 2.29 2.79 .090 .110
L2 1.02 1.40 .040 .055
L3 1.27 1.78 .050 .070
L4 0 0.38 0 .015
R 0.46 0.74 .018 .029
TO-220 (IXTP) Outline
A
Notes: 1. Pulse test, t ≤ 300 μs; duty cycle, d ≤ 2%.
2. On through-hole packages, R
Kelvin test contact location must be
DS(on)
5mm or less from the package body.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Pins: 1 - Gate 2 - Drain
3 - Source 4, TAB - Drain

IXTA60N10T
IXTP60N10T
Fig. 1. Ou tp u t C h ar acteri sti cs
@ 25ºC
60
55
50
45
40
35
30
- Amperes
25
D
I
20
15
10
5
0
0.00.10.20.30.40.50.60.70.80.91.01.11.2
V
= 10V
GS
9V
8V
VDS - Volts
7V
6V
Fig. 3. Output Characteristics
@ 150ºC
60
55
50
45
40
35
30
- Amperes
25
D
I
20
15
10
5
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
V
GS
9V
8V
VDS - Volts
= 10V
7V
6V
5V
Fig. 2. Extended Output Characteristics
@ 25ºC
200
180
160
140
120
100
- Amperes
D
80
I
60
40
20
0
0 2 4 6 8 101214161820222426
VDS - Volts
Fig. 4. R
Normalized to ID = 30A Value
DS(on)
V
= 10V
GS
9V
8V
7V
6V
vs. Junction Temperature
2.8
V
2.6
2.4
2.2
2.0
1.8
1.6
- Normalized
1.4
DS(on)
1.2
R
1.0
0.8
0.6
0.4
-50 -25 0 25 50 75 100 125 150 175
GS
= 10V
I D = 60A
I D = 30A
TJ - Degrees Centigrade
Fig. 5. R
Normalized to ID = 30A Value
DS(on)
vs. Drai n Current
3.2
V
= 10V
3.0
2.8
2.6
2.4
2.2
2.0
- Normalized
1.8
DS(on)
1.6
R
1.4
1.2
1.0
0.8
GS
15V
0 15 30 45 60 75 90 105 120 135 150
- - - -
ID - Amperes
© 2007 IXYS CORPORATION, All rights reserved
TJ = 175ºC
TJ = 25ºC
Fig. 6. Drain Current vs. Case Temperature
65
60
55
50
45
40
35
30
- Amperes
D
25
I
20
15
10
5
0
-50 -25 0 25 50 75 100 125 150 175
TC - Degrees Centigrade

IXTA60N10T
IXTP60N10T
Fig. 7. I n p u t Admittance
90
80
70
60
50
40
- Amperes
D
I
30
20
10
0
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5
T
= 150ºC
J
25ºC
- 40ºC
VGS - Volts
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
180
160
140
120
100
80
- Amperes
S
I
60
40
20
0
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
T
J
= 150ºC
TJ = 25ºC
VSD - Volts
Fig. 8. Transconductance
70
T
= - 40ºC
60
50
40
- Siemens
30
f s
g
20
10
0
0 102030405060708090
J
25ºC
150ºC
ID - Amperes
Fig. 10. Gate Charge
10
V
= 50V
9
8
7
6
- Volts
5
GS
V
4
3
2
1
0
DS
I
= 10A
D
I
= 10mA
G
0 5 10 15 20 25 30 35 40 45 50
QG - NanoCoulombs
Fig. 11. Capacitan ce
10,000
= 1 MHz
f
C
1,000
100
Capacitance - PicoFarads
10
0 5 10 15 20 25 30 35 40
iss
C
oss
C
rss
VDS - Volts
IXYS reserves the right to change limits, test conditions, and dimensions.
Fig. 12. Maximum T r an si en t Ther mal
Impedance
1.00
0.10
- ºC / W
(th)JC
Z
0.01
0.00001 0.0001 0.001 0. 01 0.1 1 10
Pulse Width - Seconds
IXYS REF: T_60N10T(2V)8-07-08-A

IXTA60N10T
IXTP60N10T
Fig. 13. Resistive Turn-on Rise Time
vs. Junction Tem perature
60
R
= 15Ω
55
50
45
40
- Nanoseconds
r
t
35
30
25
I D = 10A
25 35 45 55 65 75 85 95 105 115 125
I D = 30A
V
V
G
GS
DS
= 10V
= 50V
TJ - Degrees Centigrade
Fig. 15. R esi stive Turn -o n Swi tchi n g Times
vs. Gate Resi stan ce
170
t
r
TJ = 125ºC, VGS = 10V
V
DS
10A < I D < 30A
90
70
- Nanoseconds
t
150
130
110
r
= 50V
t
d(on)
- - - -
I D = 30A
I D = 10A
Fig. 14. Resistive Turn-on Rise Time
vs. Drai n C urren t
60
R
= 15Ω
G
= 10V
V
55
GS
= 50V
V
DS
50
45
40
- Nanoseconds
r
t
35
30
25
10 12 14 16 18 20 22 24 26 28 30
TJ = 25ºC
TJ = 125ºC
ID - Amperes
Fig. 16. R esi st i ve Tur n -o ff Sw it ch i n g Times
vs. Junction Tem perature
80
70
t
d(on)
60
- Nanoseconds
50
40
30
39
38
t
37
36
- Nanoseconds
f
35
t
f
RG = 15Ω, VGS = 10V
V
DS
t
d(off)
= 50V
- - - -
I D = 10A
I D = 30A
64
60
t
d(off )
56
- Nanoseconds
52
48
50
30
15 20 25 30 35 40 45 50 55
RG - Ohms
Fig. 17. R esi st i ve Tur n -o f f Swi tch i n g Times
vs. Drain Current
40
t
39
38
37
36
35
- Nanoseconds
f
t
34
33
32
10 12 14 16 18 20 22 24 26 28 30
TJ = 125ºC
f
RG = 15Ω, VGS = 10V
V
DS
TJ = 25ºC
ID - Amperes
= 50V
t
d(off)
- - - -
20
10
34
33
25 35 45 55 65 75 85 95 105 115 125
44
40
TJ - Degrees Centigrade
Fig. 18. R esi st i ve Tur n -o ff Sw it ch i n g Times
vs. Gate Resistance
67
63
t
d ( o f f )
59
55
- Nanoseconds
51
47
43
39
35
120
t
110
100
- Nanoseconds
f
t
90
80
70
60
50
40
30
f
TJ = 125ºC, VGS = 10V
V
DS
15 20 25 30 35 40 45 50 55
= 50V
t
d(off)
- - - -
I D = 10A, 30A
RG - Ohms
185
170
155
140
125
110
95
80
65
50
t
d(off )
- Nanoseconds
© 2007 IXYS CORPORATION, All rights reserved
IXYS REF: T_60N10T(2V)8-07-08-A