Advance Technical Information
High Current
MegaMOS
TM
FET
IXTK 180N15 V
N-Channel Enhancement Mode
Symbol Test conditions Maximum ratings
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
D(RMS)
I
DM
I
AR
E
AR
E
AS
dv/dt I
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight TO-264 10 g
TJ= 25°C to 150°C 150 V
TJ= 25°C to 150°C; R
= 1.0 MΩ 150 V
GS
Continuous ±20 V
Transient ±3 0 V
T
= 25°C MOSFET chip capability 180 A
C
External lead current limit 75 A
T
= 25°C, pulse width limited by T
C
T
= 25°C90A
C
T
= 25°C64mJ
C
T
= 25°C3.0J
C
≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ V
S
T
≤ 150°C, RG = 2 Ω
J
T
= 25°C 560 W
C
JM
DSS
720 A
5 V/ns
-55 ... +150 °C
150 °C
-55 ... +150 °C
1.6 mm (0.063 in.) from case for 10 s 300 °C
Mounting torque 0.7/6 Nm/lb.in.
= 150 V
= 180 A
= 10m
ΩΩ
Ω
ΩΩ
I
D25
R
DSS
DS(on)
TO-264 AA (IXTK)
G
D
S
G = Gate D = Drain
S = Source Ta b = Drain
D (TAB)
Features
•Low R
•Rugged polysilicon gate cell structure
HDMOSTM process
DS (on)
•International standard package
•Fast switching times
Symbol Test Conditions Characteristic Values
(T
= 25°C unless otherwise specified) Min. Typ. Max.
J
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
© 2002 IXYS All rights reserved
VGS= 0 V, ID = 1 mA 150 V
VDS= VGS, I
= 250 µA2.04.0V
D
VGS= ±20 V DC, VDS = 0 ±200 nA
VDS= V
VGS= 0 V TJ = 125°C 3 mA
VGS= 10 V, ID = 0.5 I
Pulse test, t ≤ 300 ms, duty cycle d ≤ 2%
DSS
D25
T
= 25°C 50 µA
J
10 mΩ
Applications
• Motor controls
• DC choppers
• Switched-mode power supplies
Advantages
• Easy to mount with one screw
(isolated mounting screw hole)
• Space savings
• High power density
98878A (02/02)
IXTK 180N15
Symbol Test Conditions Characteristic values
= 25°C unless otherwise specified) Min. Typ. Max.
(T
J
g
C
C
C
t
t
t
t
Q
Q
Q
R
R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
thCK
VDS= 10 V; ID = 0.5 I
VGS = 0 V, VDS = 25 V, f = 1 MHz 2525 pF
VGS = 10 V, V
R
= 1.5 Ω (External) 180 ns
G
VGS = 10 V, VDS = 0.5 V
, pulse test 65 82 S
D25
9200 pF
950 pF
35 ns
= 0.5 V
DS
, ID = 0.5 I
DSS
D25
50 ns
50 ns
400 nC
, ID = 0.5 I
DSS
D25
70 nC
155 nC
0.15 K/W
0.22 K/W
Source-Drain Diode Ratings and Characteristics
(TJ = 25°C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
TO-264 AA Outline
Dim.
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
I
S
I
SM
V
SD
t
rr
Q
rr
V
= 0V 180 A
GS
Repetitive; pulse width limited by T
IF = IS, V
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
= 0 V, 1.5 V
GS
JM
720 A
IF = 30A, -di/dt = 100 A/µs, VR = 100V 270 ns
6 µC
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025