2 - 2
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Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
g
fs
IC= I
C90
; VCE = 10 V, 7 9.5 S
Note 2
C
ies
1400 pF
C
oes
VCE = 25 V, VGE = 0 V, f = 1 MHz 98 pF
C
res
37 pF
Q
g
57 nC
Q
ge
IC= I
C90
, VGE = 15 V, VCE = 0.5 V
CES
14 nC
Q
gc
25 nC
t
d(on)
30 ns
t
ri
25 ns
t
d(off)
148 300 ns
t
fi
126 250 ns
E
off
1.5 2.9 mJ
t
d(on)
30 ns
t
ri
25 ns
E
on
1.1 mJ
t
d(off)
265 ns
t
fi
298 ns
E
off
3.1 mJ
R
thJC
0.83 K/W
R
thCK
(TO-247) 0.25 K/W
Inductive load, TJ = 125°C
IC = I
C90
, VGE = 15 V
RG = 10 W, VCE = 0.8 V
CES
Note 3
Inductive load, TJ = 25°C
IC = I
C90
, VGE = 15 V
RG = 10 W
VCE = 0.8 V
CES
Note 3
Notes: 1. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
2. Pulse test, t £ 300 ms, duty cycle £ 2 %
3. Switching times may increase for V
CE
(Clamp) > 0.8 • V
CES
, higher TJ or
increased RG.
IXSH 15N120B
IXST 15N120B
TO-247 AD (IXSH) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 19.81 20.32 0.780 0.800
B 20.80 21.46 0.819 0.845
C 15.75 16.26 0.610 0.640
D 3.55 3.65 0.140 0.144
E 4.32 5.49 0.170 0.216
F 5.4 6.2 0.212 0.244
G 1.65 2.13 0.065 0.084
H - 4.5 - 0.177
J 1.0 1.4 0.040 0.055
K 10.8 11.0 0.426 0.433
L 4.7 5.3 0.185 0.209
M 0.4 0.8 0.016 0.031
N 1.5 2.49 0.087 0.102
TO-268AA (D3 PAK)
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.9 5.1 .193 .201
A
1
2.7 2.9 .106 .114
A2.02 .25 .001 .010
b 1.15 1.45 .045 .057
b
2
1.9 2.1 .75 .83
C .4 .65 .016 .026
D 13.80 14.00 .543 .551
E 15.85 16.05 .624 .632
E
1
13.3 13.6 .524 .535
e 5.45 BSC .215 BSC
H 18.70 19.10 .736 .752
L 2.40 2.70 .094 .106
L1 1.20 1.40 .047 .055
L2 1.00 1.15 .039 .045
L3 0.25 BSC .010 BSC
L4 3.80 4.10 .150 .161
Min. Recommended Footprint
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025