IXYS IXFX24N100, IXFK24N100 Datasheet

HiPerFET
TM
IXFK 24N100 V
DSS
= 1000 V
Power MOSFETs
IXFX 24N100 I
Single MOSFET Die
Symbol Test Conditions Maximum Ratings
V
DSS
V
DGR
V
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt I
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight PLUS 247 6 g
TJ= 25°C to 150°C 1000 V TJ= 25°C to 150°C; RGS = 1 M 1000 V
Continuous ±20 V Transient ±30 V
TC= 25°C24A TC= 25°C, Note 1 96 A TC= 25°C24A
TC= 25°C60mJ TC= 25°C3J
IDM, di/dt 100 A/µs, VDD V
S
TJ≤ 150°C, RG = 2
DSS
5 V/ns
TC= 25°C 560 W
-55 ... +150 °C 150 °C
-55 ... +150 °C
1.6 mm (0.063 in.) from case for 10 s 300 °C
Mounting torque TO-264 0.9/6 Nm/lb.in.
TO-264 10 g
D25
R
DS(on)
trr
PLUS 247
= 24 A = 0.39
250 ns
TM
(IXFX)
G
D
TO-264 AA (IXFK)
G
D
S
G = Gate D = Drain S = Source TAB = Drain
Features
l
International standard packages
l
Low R
l
Rugged polysilicon gate cell structure
l
Unclamped Inductive Switching (UIS)
HDMOSTM process
DS (on)
rated
l
Low package inductance
- easy to drive and to protect
l
Fast intrinsic rectifier
D (TAB)
(TAB)
Symbol Test Conditions Characteristic Values
= 25°C, unless otherwise specified)
(T
V
V
I
I
R
DSS
GS(th)
GSS
DSS
DS(on)
J
V
V
= 0 V, ID = 3mA 1000 V
GS
= VGS, ID = 8mA 3.0 5.0 V
DS
VGS = ±20 V, VDS = 0 ±100 nA
VDS = V V
DSS
= 0 V TJ = 125°C 2 mA
GS
VGS = 10 V, ID = 0.5 • I
D25
TJ = 25°C 100 µA
min. typ. max.
0.39
Note 2
© 2002 IXYS All rights reserved
Applications
l
DC-DC converters
l
Battery chargers
l
Switched-mode and resonant-mode power supplies
l
DC choppers
l
AC motor control
l
Temperature and lighting controls
Advantages
l
PLUS 247
TM
package for clip or spring
mounting
l
Space savings
l
High power density
98598B (8/02)
IXFK 24N100 IXFX 24N100
Symbol Test Conditions Characteristic Values
= 25°C, unless otherwise specified)
(T
g
C
C
C
t
t
t
t
Q
Q
Q
R
R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
thCK
J
VDS= 10 V; ID = 0.5 • I
Note 2 15 22 S
D25
VGS = 0 V, VDS = 25 V, f = 1 MHz 750 pF
VGS = 10 V, VDS = 0.5 • V
, ID = 0.5 • I
DSS
RG = 1 (External), 75 n s
VGS = 10 V, VDS = 0.5 • V
, ID = 0.5 • I
DSS
min. typ. max.
7000 pF
260 pF
35 ns
D25
35 ns
21 ns
250 nC
D25
55 nC
135 nC
0.15 K/W
0.22 K/W
Source-Drain Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
I
SM
V
SD
VGS= 0 V 24 A
Repetitive; 96 A pulse width limited by T
JM
IF = IS, VGS = 0 V, Note 1 1.5 V
PLUS 247TM Outline
Terminals: 1 - Gate
Dim. Millimeter Inches
2 - Drain (Collector) 3 - Source (Emitter) 4 - Drain (Collector)
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
2.29 2.54 .090 .100
A
1
A21.91 2.16 .075 .085
b 1.14 1.40 .045 .055 b
1.91 2.13 .075 .084
1
b22.92 3.12 .115 .123
C 0.61 0.80 .024 .031 D 20.80 21.34 .819 .840 E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC L 19.81 20.32 .780 .800 L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244 R 4.32 4.83 .170 .190
TO-264 AA Outline
t
rr
Q
RM
I
RM
Note: 1. Pulse width limited by T
IF = IS, -di/dt = 100 A/µs, VR = 100 V
JM
2. Pulse test, t ≤ 300 µs, duty cycle d 2 %
250 ns
1.0 µC
8A
Millimeter Inches
Dim.
Min. Max. Min. Max.
A 4.82 5.13 .190 .202 A1 2.54 2.89 .100 .114 A2 2.00 2.10 .079 .083 b 1.12 1.42 .044 .056 b1 2.39 2.69 .094 .106 b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033 D 25.91 26.16 1.020 1.030 E 19.81 19.96 .780 .786 e 5.46 BSC .215 BSC J 0.00 0.25 .000 .010 K 0.00 0.25 .000 .010 L 20.32 20.83 .800 .820 L1 2.29 2.59 .090 .102 P 3.17 3.66 .125 .144 Q 6.07 6.27 .239 .247 Q1 8.38 8.69 .330 .342 R 3.81 4.32 .150 .170 R1 1.78 2.29 .070 .090 S 6.04 6.30 .238 .248 T 1.57 1.83 .062 .072
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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