IXYS IXFN280N07 Datasheet

HiPerFET
TM
IXFN 280N07 V
DSS
= 70 V
Power MOSFETs Single Die MOSFET
N-Channel Enhancement Mode t
Avalanche Rated, High dv/dt, Low t
rr
Preliminary data sheet
Symbol Test Conditions Maximum Ratings V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
L(RMS)
I
DM
I
AR
E
AR
E
AS
dv/dt I
P
D
T
J
T
JM
T
stg
V
ISOL
M
d
Weight 30 g
Symbol Test Conditions Characteristic Values
V
DSS
V
GH(th)
I
GSS
I
DSS
R
DS(on)
T
= 25°C to 150°C70V
J
T
= 25°C to 150°C; RGS = 1 M 70 V
J
Continuous ±20 V Transient ±30 V
T
= 25°C, Chip capability 280 A
C
Terminal current limit 100 A
T
= 25°C, pulse width limited by T
C
T
= 25°C 180 A
C
T
= 25°C60mJ
C
T
= 25°C3J
C
IDM, di/dt 100 A/µs, VDD V
S
150°C, RG = 2
T
J
T
= 25°C 600 W
C
JM
, 5 V/ns
DSS
-55 ... +150 °C
50/60 Hz, RMS t = 1 min 2500 V~ I
1 mA t = 1 s 3000 V~
ISOL
Mounting torque 1.5/13 Nm/lb.in. Terminal connection torque 1.5/13 Nm/lb.in.
(T
= 25°C, unless otherwise specified)
J
min. typ. max.
VGS= 0 V, ID = 3 mA 70 V
VDS= VGS, ID = 8 mA 2.0 4.0 V
V
= ±20 V
GS
VDS= V VGS= 0 V T
VGS= 10 V, I
Pulse test, t 300 µs,
, V
= 0 ±200 nA
DC
DS
T
DSS
= 120A 5 m
D
= 25°C 100 µA
J
= 125°C2mA
J
duty cycle d 2 %
G
S
1120 A
150 °C
-55 ... +150 °C
D
S
I
R
D25
rr
DS(on)
= 280 A = 5 m
< 250 ns
miniBLOC, SOT-227 B (IXFN) E153432
S
G
S
D
G = Gate D = Drain S = Source
Either Source terminal at miniBLOC can be used as Main or Kelvin Source
Features
International standard packages
miniBLOC, with Aluminium nitride
isolation
Low R
HDMOSTM process
DS (on)
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
Low package inductance
Fast intrinsic Rectifier
Applications
DC-DC converters
Synchronous rectification
Battery chargers
Switched-mode and resonant-mode
power supplies
DC choppers
Temperature and lighting controls
Low voltage relays
Advantages
Easy to mount
Space savings
High power density
© 2002 IXYS All rights reserved
98555B (1/02)
IXFN 280N07
Symbol Test Conditions Characteristic Values
= 25°C, unless otherwise specified)
(T
g C
C C
t t t t
Q Q Q
R R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
thCK
J
VDS= 15 V; 60A, pulse test 60 90 S
VGS= 0 V, VDS = 25 V , f = 1 M Hz 4600 pF
VGS= 10 V, VDS = 0.5 • V
, ID = 90A 90 ns
DSS
RG= 1 (External), 140 ns
VGS= 10 V, VDS, ID = 100A 65 nC
min. typ. max.
9400 pF
2550 pF
65 ns
55 ns
420 nC
220 nC
0.22 K/W
0.05 K/W
miniBLOC, SOT-227 B
M4 screws (4x) supplied
Dim. Millimeter Inches
Min. Max. Min. Max.
A 31.50 31.88 1.240 1.255 B 7.80 8.20 0.307 0.323
C 4.09 4.29 0.161 0.169 D 4.09 4.29 0.161 0.169
E 4.09 4.29 0.161 0.169 F 14.91 15.11 0.587 0.595
G 30.12 30.30 1.186 1.193 H 38.00 38.23 1.496 1.505
J 11.68 12.22 0.460 0.481 K 8.92 9.60 0.351 0.378
L 0.76 0.84 0.030 0.033 M 12.60 12.85 0.496 0.506
N 25.15 25.42 0.990 1.001 O 1.98 2.13 0.078 0.084
P 4.95 5.97 0.195 0.235 Q 26.54 26.90 1.045 1.059
R 3.94 4.42 0.155 0.174 S 4.72 4.85 0.186 0.191
T 24.59 25.07 0.968 0.987 U -0.05 0.1 -0.002 0.004
Source-Drain Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max. I
S
I
SM
V
SD
VGS= 0 V 280 A
Repetitive; 1120 A pulse width limited by T
JM
IF = 100A, VGS = 0 V, 1.3 V Pulse test, t ≤ 300 µs, duty cycle d 2 %
t
rr
Q
RM
I
RM
IF = 50A, -di/dt = 100 A/µsT VR = 50V 1.2 µC
=25°C 200 ns
J
10 A
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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