IXYS IXFX180N85, IXFK180N85 Datasheet
1 - 2
© 2000 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
TJ= 25°C to 150°C85V
V
DGR
TJ= 25°C to 150°C; RGS = 1 MW 85 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
TC= 25°C (MOSFET chip capability) 180 A
I
D(RMS)
External lead current limit 76 A
I
DM
TC= 25°C, Note 1 720 A
I
AR
TC= 25°C 180 A
E
AR
TC= 25°C60mJ
E
AS
TC= 25°C3J
dv/dt I
S
£ IDM, di/dt £ 100 A/ms, VDD £ V
DSS
5 V/ns
TJ£ 150°C, RG = 2 W
P
D
TC= 25°C 560 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.063 in.) from case for 10 s 300 °C
M
d
Mounting torque TO-264 0.9/6 Nm/lb.in.
Weight PLUS 247 6 g
TO-264 10 g
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, ID = 3mA 85 V
V
GS(th)
V
DS
= VGS, ID = 8mA 2.0 4.0 V
I
GSS
VGS = ±20 V, VDS = 0 ±100 nA
I
DSS
VDS = V
DSS
TJ = 25°C 100 mA
V
GS
= 0 V TJ = 125°C2 mA
R
DS(on)
VGS = 10 V, ID = 0.5 • I
D25
7 mW
Note 1
Single MOSFET Die
Features
• International standard packages
• Low R
DS (on)
HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS)
rated
• Low package inductance
- easy to drive and to protect
• Fast intrinsic rectifier
Applications
• DC-DC converters
• Synchronous rectification
• Battery chargers
• Switched-mode and resonant-mode
power supplies
• DC choppers
• Temperature and lighting controls
• Low voltage relays
Advantages
• PLUS 247
TM
package for clip or spring
mounting
• Space savings
• High power density
HiPerFET
TM
Power MOSFET s
98637 (7/99)
PLUS 247
TM
(IXFX)
G
D
D (TAB)
G = Gate D = Drain
S = Source TAB = Drain
IXFK 180N085 V
DSS
= 85 V
IXFX 180N085 I
D25
= 180 A
R
DS(on)
= 7 mW
trr £ 250 ns
S
G
D
(TAB)
TO-264 AA (IXFK)
Advanced T echnical Information
IXYS reserves the right to change limits, test conditions, and dimensions.
2 - 2
© 2000 IXYS All rights reserved
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
g
fs
VDS= 10 V; ID = 60A Note 2 55 75 S
C
iss
9100 pF
C
oss
VGS = 0 V, VDS = 25 V, f = 1 MHz 4000 pF
C
rss
2000 pF
t
d(on)
65 ns
t
r
VGS = 10 V, VDS = 0.5 • V
DSS
, ID = 0.5 • I
D25
90 ns
t
d(off)
RG = 1 W (External), 140 ns
t
f
55 ns
Q
g(on)
320 nC
Q
gs
VGS = 10 V, VDS = 0.5 • V
DSS
, ID = 0.5 • I
D25
65 nC
Q
gd
170 nC
R
thJC
0.22 K/W
R
thCK
0.15 K/W
Source-Drain Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
VGS= 0 V 180 A
I
SM
Repetitive; 720 A
pulse width limited by T
JM
V
SD
IF = 100A, VGS = 0 V, Note 1 1.3 V
t
rr
250 ns
Q
RM
1.2 mC
I
RM
10 A
IF = 50A,-di/dt = 100 A/ms, VR = 50 V
Note: 1. Pulse width limited by T
JM
2. Pulse test, t £ 300 ms, duty cycle d £ 2 %
IXFK 180N085
IXFX 180N085
PLUS247TM (IXFX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A21.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b22.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 .244
R 4.32 4.83 .170 .190
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
TO-264 AA Outline
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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