IXYS IXFH 6N100F, IXFT 6N100F Service Manual

查询6N100F供应商
Power MOSFETs
F-Class: MegaHertz Switching
IXFH 6N100F IXFT 6N100F
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, Low Intrinsic R High dV/dt, Low t
Symbol Test Conditions Maximum Ratings
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt I
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight TO-247 6 g
TJ= 25°C to 150°C 1000 V TJ= 25°C to 150°C; RGS = 1 M 1000 V
Continuous ±20 V Transient ±30 V
TC= 25°C6A TC= 25°C, pulse width limited by T TC= 25°C6A
TC= 25°C20mJ TC= 25°C 500 mJ
TJ≤ 150°C, RG = 2 TC= 25°C 180 W
1.6 mm (0.063 in.) from case for 10 s 30 0 °C Mounting torque TO-247 1.13/10 Nm/lb.in.
rr
IDM, di/dt 100 A/µs, VDD V
S
TO-268 4 g
DSS
g
JM
24 A
15 V/ns
-55 ... +150 °C 150 °C
-55 ... +150 °C
V
DSS
I
D25
R
DS(on)
trr
250 ns
= 1000 V = 6 A = 1.9
TO-247 AD (IXFH)
TO-268 (IXFT) Case Style
G
S
G = Gate, D = Drain, S = Source, TAB = Drain
Features
RF capable MOSFETs
Double metal process for low gate resistance
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS) rated
Low package inductance
- easy to drive and to protect
Fast intrinsic rectifier
(TAB)
(TAB)
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS(th)
I
GSS
I
DSS
R
© 2002 IXYS All rights reserved
V
V
= 0 V, ID = 500uA 1000 V
GS
= VGS, ID = 2.5 mA 3.0 5.5 V
DS
VGS = ±20 V, VDS = 0 ±100 nA VDS = V
V VGS = 10 V, ID = 0.5 • I
DS(on)
Note 1
DSS
= 0 V TJ = 125°C1 mA
GS
D25
50 µA
1.9
Applications
DC-DC converters
Switched-mode and resonant-mode power supplies, >500kHz switching
DC choppers
13.5 MHz industrial applications
Pulse generation
Laser drivers
RF amplifiers
Advantages
Space savings
High power density
98732B (9/02)
Symbol Test Conditions Characteristic Values
(T
= 25°C, unless otherwise specified)
J
min. typ. max.
IXFH 6N100F IXFT 6N100F
TO-247 AD Outline
g
C
C
C
t
t
t
t
Q
Q
Q
R
R
fs
iss
oss
rss
d(on)
r
d(off)
f
g(on)
gs
gd
thJC
thCK
VDS= 20 V; ID = 0.5 • I
Note 1 3 5.5 S
D25
1770 pF
VGS = 0 V, VDS = 25 V, f = 1 MHz 18 6 p F
53 pF 11 ns
VGS = 10 V, VDS = 0.5 • V
, ID = 0.5 • I
DSS
D25
8.6 ns
RG = 2.0 (External), 21 ns
8.3 ns 54 nC
VGS = 10 V, VDS = 0.5 • V
, ID = 0.5 • I
DSS
D25
14 nC 27 nC
(TO-247) 0.25 K/W
0.65 K/W
Source-Drain Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
I
SM
V
SD
VGS= 0 V 6 A Repetitive; 24 A
pulse width limited by T
JM
IF = IS, VGS = 0 V, Note 1 1.5 V
1 2 3
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.7 5.3 .185 .209 A
2.2 2.54 .087 .102
1
A22.2 2.6 .059 .098 b 1.0 1.4 .040 .055
b
1.65 2.13 .065 .084
1
b22.87 3.12 .113 .123 C .4 .8 .016 .031
D 20.80 21.46 .819 .845 E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225 L 19.81 20.32 .780 .800 L1 4.50 .177
P 3.55 3.65 .140 .144 Q 5.89 6.40 0.232 0.252
R 4.32 5.49 .170 .216 S 6.15 BSC 242 BSC
TO-268 Outline
Terminals: 1 - Gate 2 - Drain 3 - Source Tab - Drain
t
rr
Q
RM
I
RM
IF = IS,-di/dt = 100 A/µs, VR = 100 V
Note: 1. Pulse test, t 300 µs, duty cycle d ≤ 2 %
Min Recommended Footprint
250 ns
0.6 µ C 4A
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.9 5.1 .193 .201 A
2.7 2.9 .106 .114
1
A2.02 .25 .001 .010
b 1.15 1.45 .045 .057
1.9 2.1 .75 .83
b
2
C .4 .65 .016 .026
D 13.80 14.00 .543 .551 E 15.85 16.05 .624 .632 E
13.3 13.6 .524 .535
1
e 5.45 BSC .215 BSC H 18.70 19.10 .736 .752 L 2.40 2.70 .094 .106
L1 1.20 1.40 .047 .055
L2 1.00 1.15 .039 .045 L3 0.25 BSC .010 BSC L4 3.80 4.10 .150 .161
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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