IXYS IXBT16N170, IXBH16N170 Datasheet

© 2000 IXYS All rights reserved
1 - 2
Advanced T echnical Information
V
CES
= 1700 V
I
= 25 A
V
CE(sat)
= 3.3 V
IXBH 16N170 IXBT 16N170
G = Gate, C = Collector, E = Emitter, TAB = Collector
G
C
E
TO-247 AD (IXBH)
98657 (9/99)
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
BV
CES
IC= 250 mA, VGE = 0 V 1700 V
V
GE(th)
IC= 250 mA, VCE = V
GE
2.5 5 V
I
CES
VCE= 0.8 V
CES
TJ = 25°C50mA
VGE= 0 V TJ = 125°C 1.5 mA
I
GES
VCE= 0 V, VGE = ±20 V ±100 nA
V
CE(sat)
IC= I
C90
, VGE = 15 V 3.3 V
TJ = 125°C 2.9 V
Symbol Test Conditions Maximum Ratings V
CES
TJ= 25°C to 150°C 1700 V
V
CGR
TJ= 25°C to 150°C; RGE = 1 MW 1700 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
TC= 25°C25A
I
C90
TC= 90°C16A
I
CM
TC= 25°C, 1 ms 40 A
SSOA V
GE
= 15 V, TVJ = 125°C, RG = 33 W I
CM
=40 A
(RBSOA) Clamped inductive load V
CES
= 1350 V
P
C
TC= 25°C 150 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
Maximum Lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s 260 °C
M
d
Mounting torque (M3) 1.13/10 Nm/lb.in.
Weight TO-247 AD 6 g
TO-268 4 g
TO-268 (IXBT)
G
E
High Voltage, High Gain
BIMOSFETTM Monolithic Bipolar MOS Transistor
Features
• High Blocking Voltage
• JEDEC TO-268 surface and JEDEC TO-247 AD
• Low conduction losses
• High current handling capability
• MOS Gate turn-on
- drive simplicity
• Molding epoxies meet UL 94 V-0 flammability classification
Applications
• AC motor speed control
• Uninterruptible power supplies (UPS)
• Switched-mode and resonant-mode power supplies
• Capacitor discharge circuits
Advantages
• High power density
• Suitable for surface mounting
• Easy to mount with 1 screw, (isolated mounting screw hole)
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
2 - 2
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
g
fs
IC= I
C90
; VCE = 10 V, 11 14 S
Pulse test, t £ 300 ms, duty cycle £ 2 %
C
ies
1700 pF
C
oes
VCE= 25 V, VGE = 0 V, f = 1 MHz 83 pF
C
res
31 pF
Q
g
69 nC
Q
ge
IC= I
C90
, VGE = 15 V, VCE = 0.5 V
CES
13 nC
Q
gc
24 nC
t
d(on)
35 ns
t
ri
25 ns
t
d(off)
600 1000 ns
t
fi
1110 1600 ns
E
off
12 16 mJ
t
d(on)
35 ns
t
ri
28 ns
E
on
2.0 mJ
t
d(off)
660 ns
t
fi
1600 ns
E
off
15 mJ
R
thJC
0.83 K/W
R
thCK
(TO-247) 0.25 K/W
Reverse Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max. V
F
IF= I
C90
, VGE = 0 V, Pulse test, 3.3 V
t < 300 us, duty cycle d < 2%
I
RM
IF= 25 A, VGE = 0 V, -diF/dt = 50 A/us 24 A
t
rr
vR= 100A 360 ns
Inductive load, T
J
= 125°C
IC= I
C90
, VGE = 15 V
VCE= 0.8 V
CES
, RG = R
off
= 33 W
Inductive load, T
J
= 25°C
I
C
= I
C90
, VGE = 15 V
VCE= 0.8 V
CES
, RG = R
off
= 33 W
IXBH 16N170 IXBT 16N170
Remarks: Switching times may increase for VCE (Clamp) > 0.8 • V
CES
,
higher TJ or increased R
G
Remarks: Switching times may increase for VCE (Clamp) > 0.8 • V
CES
,
higher TJ or increased R
G
TO-247 AD Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 19.81 20.32 0.780 0.800 B 20.80 21.46 0.819 0.845
C 15.75 16.26 0.610 0.640 D 3.55 3.65 0.140 0.144
E 4.32 5.49 0.170 0.216 F 5.4 6.2 0.212 0.244
G 1.65 2.13 0.065 0.084 H - 4.5 - 0.177
J 1.0 1.4 0.040 0.055 K 10.8 11.0 0.426 0.433
L 4.7 5.3 0.185 0.209 M 0.4 0.8 0.016 0.031
N 1.5 2.49 0.087 0.102
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.9 5.1 .193 .201 A
1
2.7 2.9 .106 .114
A2.02 .25 .001 .010 b 1.15 1.45 .045 .057
b
2
1.9 2.1 .75 .83
C .4 .65 .016 .026 D 13.80 14.00 .543 .551
E 15.85 16.05 .624 .632 E
1
13.3 13.6 .524 .535
e 5.45 BSC .215 BSC H 18.70 19.10 .736 .752 L 2.40 2.70 .094 .106
L1 1.20 1.40 .047 .055 L2 1.00 1.15 .039 .045 L3 0.25 BSC .010 BSC L4 3.80 4.10 .150 .161
TO-268AA (D3 PAK)
Min. Recommended Footprint
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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