Advanced Technical Information
HiPerFET
TM
FMK 75-01F
Power Mosfet
-Common Source Topologyin ISOPLUS i4-PAC
MOSFETs
Symbol Conditions Maximum Ratings
V
DSS
V
GS
I
D25
I
D90
I
F25
I
F90
dv/dt VDS < V
E
AR
Symbol Conditions Characteristic Values
TVJ = 25°C to 150°C 10 0 V
TC = 25°C 75 A
TC = 90°C 50 A
(diode) TC = 25°C 10 0 A
(diode) TC = 90°C 60 A
DSS
TVJ = 150°C
TC = 25°C 30 mJ
TM
4
5
3
1
2
±20 V
; IF ≤ 300A;diF/dt≤ 100A/µs; RG = 2 Ω 5 V/ns
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
I
D25
V
R
DSS
DSon
= 75 A
= 100 V
= 25 m
ΩΩ
Ω
ΩΩ
1
5
Features
• HiPerFET
- low R
TM
DSon
technology
- low gate charge for high frequency
operation
- unclamped inductive switching (UIS)
capability
- dv/dt ruggedness
- fast intrinsic reverse diode
• ISOPLUS i4-PACTM package
- isolated back surface
- enlarged creepage towards heatsink
- application friendly pinout
- low inductive current path
- high reliability
- industry standard outline
Applications
R
DSon
V
GSth
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
V
F
t
rr
R
thJC
IXYS reserves the right to change limits, test conditions and dimensions.
VGS = 10 V; ID = I
D90
VDS = 20 V; ID = 4 mA; 2 4 V
VDS = V
= 0 V; TVJ = 25°C 0.3 mA
DSS; VGS
TVJ = 125°C 0.25 mA
VGS = ±20 V; VDS = 0 V 200 nA
VGS= 10 V; VDS = 0.5 • V
VGS= 10 V; VDS = 0.5 • V
ID = I
; RG = 2 Ω
D90
DSS
DSS
; ID = I
;
D90
(diode) IF = 75 A; VGS = 0 V 1.2 1.5 V
(diode) IF = 37.5 A; -di/dt = 100 A/µs; VDS = 25 V 300 ns
© 2001 IXYS All rights reserved
25 mΩ
180 nC
35 nC
85 nC
20 ns
60 ns
80 ns
60 ns
0.5 K/W
• drives and power supplies
• battery or fuel cell powered
• automotive, industrial vehicle etc.
• secondary side of mains power
supplies
129
1 - 2
FMK 75-01F
Component
Dimensions in mm (1 mm = 0.0394")
Symbol Conditions Maximum Ratings
T
VJ
T
stg
V
ISOL
F
C
I
≤ 1 mA; 50/60 Hz 2500 V~
ISOL
mounting force with clip 20...120 N
-55...+150 °C
-55...+125 °C
Symbol Conditions Characteristic Values
min. typ. max.
C
p
d
, d
S
dS, d
R
thCH
A
A
coupling capacity between 40 pF
shorted pin and mounting tab
pin - pin 1.7 mm
pin - backside metal 5.5 mm
with heatsink compound 0.15 K/W
Weight 9g
© 2001 IXYS All rights reserved
2 - 2