DSP 25
Phase-leg
Rectifier Diode
V
RSM
V
TO-247 AD TO-268 AA ISOPLUS 247
RRM
V V Type
1300 1200 DSP 25-12A DSP 25-12AT
1700 1600 DSP 25-16A DSP 25-16AT DSP 25-16AR
Symbol Test Conditions Maximum Ratings
I
F(RMS)
I
F(AV)M
I
FSM
TVJ = T
VJM
T
= 100°C; 180° sine 28 A
case
TVJ = 45°C; t = 10 ms (50 Hz), sine 300 A
t = 8.3 ms (60 Hz), sine 330 A
TVJ = 150°C; t = 10 ms (50 Hz), sine 270 A
t = 8.3 ms (60 Hz), sine 300 A
I2t TVJ = 45°C t = 10 ms (50 Hz), sine 450 A2s
t = 8.3 ms (60 Hz), sine 450 A2s
TVJ = 150°C; t = 10 ms (50 Hz), sine 340 A2s
t = 8.3 ms (60 Hz), sine 325 A2s
T
VJ
T
VJM
T
stg
Md * mounting torque M3 0.8...1.2 N m
F
C
V
** 50/60 Hz, RMS, t = 1 minute, leads-to-tab 2500 V~
ISOL
mounting force with clip 20...120 N
Weight TO-268 / TO-247 4 / 6 g
* Verson A only; ** Version AR only
TM
1 2 3
43 A
-40...+180 °C
180 °C
-40...+150 °C
V
I
F(RMS)
I
F(AV)M
= 1200/1600 V
RRM
= 2x43 A
= 2x28 A
TO-247 AD TO-268 AA
Version A Version AT
1
2
3
ISOPLUS 247
2 (TAB)
TM
Version AR
1
2
3
1 = Cathode, 2 = Anode/Cathode, 3 = Anode
Features
●
International standard packages
JEDEC TO-247 AD and TO-268 AA
surface mountable
●
For single and three phase bridge
configuration
●
Planar passivated chips
●
Epoxy meets UL 94V-0 flammability
classification
●
Version AR isolated and
UL registered E153432
TO-247 AD and ISOPLUS 247
1
3
2 (TAB)
TAB
TM
Symbol Test Conditions Characteristic Values
I
R
V
F
V
T0
r
T
R
thJC
R
thCH
TVJ = 150°CVR= V
RRM
≤ 2mA
IF = 55 A; TVJ = 25°C ≤ 1.6 V
For power-loss calculations only 0.8 V
TVJ = T
VJM
15 mΩ
DC current 1.5 K/W
DC current (with heatsink compound) 0.4 K/W
a Maximum allowable acceleration 100 m/s
TO-268 AA Outline
Data according to IEC 60747 and refer to a single diode
IXYS reserves the right to change limits, test conditions and dimensions
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.9 5.1 .193 .201
A
2.7 2.9 .106 .114
1
A
.02 .25 .001 .010
2
b 1.15 1.45 .045 .057
b
1.9 2.1 .75 .83
2
C .4 .65 .016 .026
D 13.80 14.00 .543 .551
E 15.85 16.05 .624 .632
E113.3 13.6 .524 .535
e 5.45 BSC .215 BSC
H 18.70 19.10 .736 .752
L 2.40 2.70 .094 .106
L1 1.20 1.40 .047 .055
L2 1.00 1.15 .039 .045
L3 0.25 BSC .010 BSC
L4 3.80 4.10 .150 .161
© 2002 IXYS All rights reserved
2
Dim. Millimeter Inches
Min. Max. Min. Max.
A 19.81 20.32 0.780 0.800
B 20.80 21.46 0.819 0.845
C 15.75 16.26 0.610 0.640
D* 3.55 3.65 0.140 0.144
E 4.32 5.49 0.170 0.216
F 5.4 6.2 0.212 0.244
G 1.65 2.13 0.065 0.084
H - 4.5 - 0.177
J 1.0 1.4 0.040 0.055
K 10.8 11.0 0.426 0.433
L 4.7 5.3 0.185 0.209
M 0.4 0.8 0.016 0.031
N 1.5 2.49 0.087 0.102
* ISOPLUS 247
TM
without hole
211
1 - 2
DSP 25
70
A
60
I
F
50
40
30
20
TVJ = 150°C
= 25°C
T
VJ
10
0
0.0 0.5 1.0 1.5 2.0
V
F
V
Fig. 1 Forward current versus voltage
drop per diode
60
W
50
P
tot
40
30
3
10
VR = 0 V
2
A
s
I2t
I
FSM
200
A
50 Hz, 80% V
RRM
TVJ = 45°C
TVJ = 45°C
100
TVJ = 150°C
TVJ = 150°C
0
0.001 0.01 0.1 1
s
10
2
23456789110
t
Fig. 2 Surge overload current Fig. 3 I2t versus time per diode
30
I
d(AV)M
A
20
RthJA:
0.5 KW
1.8 KW
3 KW
5 KW
8 KW
15 KW
ms
t
20
10
0
0 5 10 15 20 25
I
d(AV)M
A
0 40 80 120 160
T
amb
°C °C
Fig. 4 Power dissipation versus direct output current and ambient temperature, sine 180°
1.6
K/W
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0001 0.001 0.01 0.1 1 10
DSP25
s
t
Fig. 6 Transient thermal impedance junction to case
10
0
0 30 60 90 120 150 180
T
C
Fig. 5 Max. forward current versus
case temperature
Constants for Z
iR
calculation:
thJC
(K/W) ti (s)
thi
1 0.06075 0.0004
2 0.183 0.00256
3 0.3405 0.0045
4 0.543 0.0242
5 0.3728 0.15
© 2002 IXYS All rights reserved
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