IXYS DSI2X55-16A, DSI2X55-12A Datasheet

DSI 2x55
Rectifier Diode
V
RSM
VV
1300 1200 DSI 2x55-12A 1700 1600 DSI 2x55-16A
Symbol Conditions Maximum Ratings (per diode) I
FRMS
I
F(AV)M
I
FSM
I2t TVJ = 45°C t = 10 ms (50 Hz), sine 2210 A2s
T
VJ
T
VJM
T
stg
P
tot
V
ISOL
M
d
Weight 30 g
V
RRM
Type
120 A
TC = 80°C; 180° sine 56 A TVJ = 45°C; t = 10 ms (50 Hz), sine 650 A
t = 8.3 ms(60 Hz), sine 700 A
TVJ = 150°C; t = 10 ms (50 Hz), sine 570 A
t = 8.3 ms(60 Hz), sine 610 A
t = 8.3 ms(60 Hz), sine 2060 A2s
TVJ = 150°C; t = 10 ms (50 Hz), sine 1620 A2s
t = 8.3 ms(60 Hz), sine 1560 A2s
-40...+150 °C 150 °C
-40...+150 °C
TC = 25°C 190 W 50/60 Hz, RMS 2500 V~
I
£ 1 mA
ISOL
Mounting torque 1.5/13 Nm/lb.in. Terminal connection torque (M4) 1.5/13 Nm/lb.in.
I
F(AV)M
V
= 2x 56 A = 1200-1600 V
RRM
miniBLOC, SOT-227 B E72873
Features
International standard package miniBLOC (ISOTOP compatible)
Isolation voltage 2500 V~
2 independent rectifier diodes in one package
Planar passivated chips
Applications
Input rectifier diode
Rectifiers in switch mode power supplies (SMPS)
Inductive heating and melting
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
miniBLOC, SOT-227 B
Symbol Conditions Characteristic Values (per diode)
typ. max.
I
V
F
V
T0
r
T
R
thJC
R
thCH
TVJ = 25°CVR = V TVJ = 150°C5mA
RRM
0.3 mA
IF = 60 A; TVJ = 125°C 1.25 V
TVJ = 25°C 1.20 V
For power-loss calculations only 0.8 V TVJ = T
VJM
8mW
0.65 K/W
0.1 K/W
Data according to IEC 60747
© 2000 IXYS All rights reserved
M4 screws (4x) supplied
Dim. Millimeter Inches
Min. Max. Min. Max.
A 31.50 31.88 1.240 1.255 B 7.80 8.20 0.307 0.323
C 4.09 4.29 0.161 0.169 D 4.09 4.29 0.161 0.169
E 4.09 4.29 0.161 0.169 F 14.91 15.11 0.587 0.595
G 30.12 30.30 1.186 1.193 H 37.80 38.20 1.489 1.505
J 11.68 12.22 0.460 0.481 K 8.92 9.60 0.351 0.378
L 0 .76 0.84 0.030 0.033 M 12.60 12.85 0.496 0.506
N 25.15 25.42 0.990 1.001 O 1.98 2.13 0.078 0.084
P 4.95 5.97 0.195 0.235 Q 26.54 26.90 1.045 1.059
R 3.94 4.42 0.155 0.174 S 4.72 4.85 0.186 0.191
T 24.59 25.07 0.968 0.987 U -0.05 0.1 -0.002 0.004
V 3.30 4.57 0.130 0.180 W 0.780 0.830 19.81 21.08
008
1 - 2
DSI 2x55
4
10
VR = 0 V
2
s
A
I2t
T
= 45°C
VJ
3
10
T
= 150°C
VJ
I
FSM
500
50Hz, 80% V
A
400
300
T
= 45°C
VJ
RRM
80
A
70
60
I
F
TVJ=125°C TVJ= 25°C
50
40
30
200
20
100
T
VJ
= 150°C
10
0
0.00.40.81.21.6
V
V
F
Fig. 1 Forward current versus voltage
0
0.001 0.01 0.1 1
s
t
Fig. 2 Surge overload current Fig. 3 I2t versus time per diode
drop per diode
180
W
160
R
140
P
tot
120 100
80
thHA
0.1 K/W
0.5 K/W
1.0 K/W
2.0 K/W
4.0 K/W
7.0 K/W
:
60 40 20
0
0 20406080100
I
F(AV)M
A
0 20 40 60 80 100 120 140
T
amb
°C °C
Fig. 4 Power dissipation versus direct output current and ambient temperature, sine 180°
0.8
2
10
23456789110
ms
t
80
A
70
I
F(AV)M
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
T
C
Fig. 5 Max. forward current versus case
temperature, sine180°
K/W
Z
thJC
0.6
0.4
0.2
0.0
0.001 0.01 0.1 1 10
Fig. 6 Transient thermal impedance junction to case
t
© 2000 IXYS All rights reserved
Constants for Z
iR
calculation:
thJC
(K/W) ti (s)
thi
1 0.031 0.00024 2 0.0554 0.0036 3 0.114 0.0235 4 0.281 0.142
DSI 2x55
s
5 0.1686 0.7
2 - 2
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