IXYS DSEP8-03A Datasheet

DSEP 8-03A
HiPerFREDTM Epitaxial Diode
with soft recovery
V
RSM
V V
300 300 DSEP 8-03A
Symbol Conditions Maximum Ratings I
FRMS
I
FAVM
I
FSM
E
AS
I
AR
T
VJ
T
VJM
T
stg
P
tot
M
d
Weight typical 2 g
Symbol Conditions Characteristic Values
IR① TVJ = 25°C VR= V
VF② IF = 10 A; TVJ= 150°C 1.29 V
R
thJC
R
thCH
t
rr
I
RM
Pulse test: Pulse Width = 5 ms, Duty Cycle < 2.0 %
V
RRM
Type
A
35 A
TC = 130°C; rectangular, d = 0.5 10 A
TVJ = 45°C; tp = 10 ms (50 Hz), sine 60 A TVJ = 25°C; non-repetitive 0.5 mJ
IAS = 2 A; L = 180 µH VA = 1.5·VR typ.; f = 10 kHz; repetitive 0.2 A
-55...+175 °C 175 °C
-55...+150 °C
TC = 25°C 60 W mounting torque 0.4...0.6 Nm
typ. max.
60 mA
0.25 mA
TVJ = 150°C VR= V
RRM RRM
TVJ= 25°C 1.75 V
2.5 K/W
0.5 K/W
IF = 1 A; -di/dt = 50 A/ms; 30 ns VR = 30 V; TVJ = 25°C
VR = 100 V; IF = 12 A; -diF/dt = 100 A/ms2.4A TVJ = 100°C
Pulse Width = 300 ms, Duty Cycle < 2.0 %
I
FAV
V t
rr
TO-220 AC
C
A = Anode, C = Cathode, TAB = Cathode
RRM
C
= 10 A = 300 V = 30 ns
A
Features
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low IRM-values
Soft recovery behaviour
Epoxy meets UL 94V-0
Applications
Antiparallel diode for high frequency switching devices
Antisaturation diode
Snubber diode
Free wheeling diode in converters and motor control circuits
Rectifiers in switch mode power supplies (SMPS)
Inductive heating
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
Avalanche voltage rated for reliable operation
Soft reverse recovery for low EMI/RFI
Low IRM reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Dimensions see outlines.pdf
C (TAB)
Data according to IEC 60747 and per diode unless otherwise specified
IXYS reserves the right to change limits, test conditions and dimensions.
© 2000 IXYS All rights reserved
025
1 - 2
DSEP 8-03A
30
A
I
F
20
T
VJ
T
VJ
T
VJ
=150°C =100°C = 25°C
10
0
0.0 0.5 1.0 1.5 2.0 V
F
Fig. 1 Forward current IF versus V
1.4
1.2
K
f
1.0
I
RM
Q
0.8
r
400
T
= 100°C
VJ
nC
V
= 150V
R
300
Q
r
IF = 20A
= 10A
200
I
F
I
= 5A
F
15
T
= 100°C
VJ
= 150V
V
R
A
I
RM
IF = 20A
10
= 10A
I
F
I
= 5A
F
5
100
0
V
100 1000
A/ms
-diF/dt
F
Fig. 2 Reverse recovery charge Q
versus -diF/dt
70
ns
t
60
rr
50
T
VJ
V
R
I
F
I
F
I
F
= 100°C
= 150V
= 20A = 10A = 5A
r
40
0
200 600 10000 400 800
-di
Fig. 3 Peak reverse current I
versus -diF/dt
16
V
t
fr
12
V
FR
8
4
T I
V
FR
A/ms
/dt
F
= 100°C
VJ
= 10A
F
RM
0.8 µs
0.6
t
fr
0.4
0.2
0.6 0 40 80 120 160
T
VJ
Fig. 4 Dynamic parameters Qr, I
versus T
VJ
°C
RM
30
200 600 10000 400 800
-di
A/ms
/dt
F
Fig. 5 Recovery time trr versus -diF/dt Fig. 6 Peak forward voltage VFR and t
10
K/W
1
Z
thJC
0.1
0.01
0.001
0.00001 0.0001 0.001 0.01 0.1 1
s
t
Fig. 7 Transient thermal resistance junction to case
NOTE: Fig. 2 to Fig. 6 shows typical values
© 2000 IXYS All rights reserved
DSEP 8-03A
0
0 200 400 600 800 1000
A/ms
diF/dt
versus diF/dt
Constants for Z
iR
calculation:
thJC
(K/W) ti (s)
thi
1 1.449 0.005 2 0.558 0.0003 3 0.493 0.017
0.0
fr
025
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