IXYS DSEP2X31-12A Datasheet

© 2000 IXYS All rights reserved
1 - 2
HiPerFREDTM Epitaxial Diode
with soft recovery
Features
International standard package miniBLOC
Isolation voltage 2500 V~
UL registered E 72873
2 independent FRED in 1 package
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low IRM-values
Soft recovery behaviour
Applications
Antiparallel diode for high frequency switching devices
Antisaturation diode
Snubber diode
Free wheeling diode in converters and motor control circuits
Rectifiers in switch mode power supplies (SMPS)
Inductive heating
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
Avalanche voltage rated for reliable operation
Soft reverse recovery for low EMI/RFI
Low IRM reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Dimensions see outlines.pdf
miniBLOC, SOT-227 B
Pulse test: Pulse Width = 5 ms, Duty Cycle < 2.0 %
Pulse Width = 300 ms, Duty Cycle < 2.0 %
Data according to IEC 60747 and per diode unless otherwise specified
IXYS reserves the right to change limits, test conditions and dimensions.
DSEP 2x 31-12A
I
FAV
= 2x 30 A
V
RRM
= 1200 V
t
rr
= 40 ns
V
RSM
V
RRM
Type
V V
1200 1200 DSEP 2x 31-12A
Symbol Conditions Maximum Ratings I
FRMS
70 A
I
FAVM
TC = 70°C; rectangular, d = 0.5 30 A
I
FSM
TVJ = 45°C; tp = 10 ms (50 Hz), sine 200 A
E
AS
TVJ = 25°C; non-repetitive 14 mJ IAS = 12 A; L = 180 µH
I
AR
VA = 1.25·VR typ.; f = 10 kHz; repetitive 1.2 A
T
VJ
-40...+150 °C
T
VJM
150 °C
T
stg
-40...+150 °C
P
tot
TC = 25°C 110 W
V
ISOL
50/60 Hz, RMS 2500 V~ I
ISOL
£ 1 mA
M
d
mounting torque (M4) 1.1-1.5/9-13 Nm/lb.in. terminal connection torque (M4) 1.1-1.5/9-13 Nm/lb.in.
Weight typical 30 g
Symbol Conditions Characteristic Values
typ. max.
I
R
TVJ = 25°C VR= V
RRM
0.25 mA
TVJ = 150°C VR= V
RRM
1mA
VF② IF = 30 A; TVJ= 125°C 1.96 V
TVJ= 25°C 2.72 V
R
thJC
1.15 K/W
R
thCH
0.1 K/W
t
rr
IF = 1 A; -di/dt = 200 A/ms; 40 ns VR = 30 V; TVJ = 25°C
I
RM
VR = 100 V; IF = 50 A; -diF/dt = 100 A/ms 5.5 A TVJ = 100°C
008
© 2000 IXYS All rights reserved
2 - 2
NOTE: Fig. 2 to Fig. 6 shows typical values
DSEP 2x 31-12A
200 600 10000 400 800
120
140
160
180
200
220
0.00001 0.0001 0.001 0.01 0.1 1
0.0001
0.001
0.01
0.1
1
10
0 40 80 120 160
0.0
0.5
1.0
1.5
2.0
K
f
T
VJ
°C
-di
F
/dt
t
s
K/W
0 200 400 600 800 1000
0
40
80
120
0.0
0.4
0.8
1.2
V
FR
diF/dt
V
200 600 10000 400 800
0
10
20
30
40
50
60
100 1000
0
1
2
3
4
5
01234
0
10
20
30
40
50
60
70
I
RM
Q
r
I
F
A
V
F
-diF/dt
-di
F
/dt
A/ms
A
V
m
C
A/ms
A/ms
t
rr
ns
t
fr
Z
thJC
A/ms
µs
DSEP 2x31-12A
IF= 60A IF= 30A IF= 15A
TVJ= 100°C VR = 600V
TVJ= 100°C IF = 30A
Fig. 3 Peak reverse current I
RM
versus -diF/dt
Fig. 2 Reverse recovery charge Q
r
versus -diF/dt
Fig. 1 Forward current I
F
versus V
F
TVJ= 100°C VR = 600V
TVJ= 100°C VR = 600V
IF= 60A IF= 30A IF= 15A
Q
r
I
RM
Fig. 4 Dynamic parameters Qr, I
RM
versus T
VJ
Fig. 5 Recovery time trr versus -diF/dt Fig. 6 Peak forward voltage VFR and t
fr
versus diF/dt
IF= 60A IF= 30A IF= 15A
t
fr
V
FR
Fig. 7 Transient thermal resistance junction to case
008
TVJ=150°C TVJ=100°C TVJ= 25°C
Constants for Z
thJC
calculation:
iR
thi
(K/W) ti (s)
1 0.436 0.0056 2 0.482 0.0092 3 0.117 0.0007 4 0.115 0.0418
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