IXYS DSEE55-24N1F Datasheet
Advanced Technical Information
Dual HiPerFRED
TM
DSEE 55-24N1F
Epitaxial Diode
in ISOPLUS i4-PAC
Rectifier Bridge
Symbol Conditions Maximum Ratings
V
c 2400 V
RRM
V
RRM
I
FAV
I
F(AV)M
I
FSM
E
AS
P
tot
Symbol Conditions Characteristic Values
TC = 90°C; sine 180° 53 A
TC = 90°C; d = 0.5 rectangular 55 A
TVJ = 25°C; t = 10 ms; sine 50 Hz 500 A
IAS = 16 A; LAS = 180 µH; TC = 25°C; non repetitive 28 mJ
TC = 25°C (per diode) 200 W
TM
1
3
5
1200 V
(T
= 25°C, unless otherwise specified)
VJ
min. typ. max.
V
RRM
I
F(AV)M
t
rr
Features
• HiPerFRED
- fast and soft reverse recovery –
low switching losses
- avalanche rated
- low leakage current
• ISOPLUS i4-PACTM package
- isolated back surface
- low coupling capacity between pins
and heatsink
- enlarged creepage towards heatsink
- enlarged creepage between pins
- application friendly pinout
- high reliability
- industry standard outline
Applications
= 2400 V
= 55 A
= 220 ns
1
3
TM
5
Epitaxial Diodes
V
F
I
R
I
RM
t
rr
R
thJC
Data according to IEC 60747 and refer to a single diode unless otherwise stated.
c Diodes connected in series
Data according to IEC 60747 and refer to a single diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions.
© 2001 IXYS All rights reserved
IF = 40 A; TVJ = 25°C 2.0 2.5 V
TVJ = 125°C 1.5 V
VR = V
IF = 75 A; di
VR = 600 V 220 ns
(per diode) 0.63 K/W
TVJ = 25°C 1 mA
RRM;
TVJ = 125°C 1 mA
/dt = -750 A/µs; TVJ = 125°C 79 A
F
• rectifiers
- high frequency rectifiers, output
rectifiers of switched mode power
supplies
- mains rectifiers with minimized
emission of disturbances
• diodes in snubber networks
• high voltage diodes using the series
connection in the component
117
1 - 2
DSEE 55-24N1F
Component
Dimensions in mm (1 mm = 0.0394")
Symbol Conditions Maximum Ratings
T
VJ
T
stg
V
ISOL
F
C
I
≤ 1 mA; 50/60 Hz 2500 V~
ISOL
mounting force with clip 20...120 N
-55...+150 °C
-55...+125 °C
Symbol Conditions Characteristic Values
min. typ. max.
C
P
coupling capacity between 40 pF
shorted pins and mounting tab in the case
d
, d
S
dS, d
R
thCH
A
A
pin - pin 5.5 mm
pin - backside metal 5.5 mm
with heatsink compound 0.15 K/W
Weight 9g
© 2001 IXYS All rights reserved
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