IXYS DSEC60-03AR, DSEC60-03A Datasheet

DSEC 60-03A DSEC 60-03AR
HiPerFREDTM Epitaxial Diode
with common cathode and soft recovery
V
RSM
V V
300 300 DSEC 60-03A 300 300 DSEC 60-03AR
Symbol Conditions Maximum Ratings I
FRMS
I
FAVM
I
FSM
E
AS
I
AR
T
VJ
T
VJM
T
stg
P
tot
Md * mounting torque 0.8...1.2 Nm F
C
V
RRM
Type
A C A
70 A
TC = 145°C; rectangular, d = 0.5 30 A
TVJ = 45°C; tp = 10 ms (50 Hz), sine 300 A TVJ = 25°C; non-repetitive 1.2 mJ
IAS = 3 A; L = 180 µH VA = 1.5·VR typ.; f = 10 kHz; repetitive 0.3 A
-55...+175 °C 175 °C
-55...+150 °C
TC = 25°C 165 W
mounting force with clip 10...50 N
I V t
FAV
rr
= 2x 30 A = 300 V
RRM
= 30 ns
TO-247 AD ISOPLUS 247
Version A Version AR
A
C
A
A = Anode, C = Cathode
C (TAB)
A
C
A
* Patent pending
Isolated
back surface *
Features
International standard package
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low IRM-values
Soft recovery behaviour
Epoxy meets UL 94V-0
Version AR isolated and UL registered E153432
Applications
TM
V
** 50/60 Hz, RMS, t = 1 minute, leads-to-tab 2500 V~
ISOL
Weight typical 6 g
* Verson A only; ** Version AR only
Symbol Conditions Characteristic Values
typ. max.
IR① TVJ = 25°C VR= V
TVJ = 150°C VR= V
RRM RRM
250 mA
1mA
VF② IF = 30 A; TVJ= 150°C 0.91 V
TVJ= 25°C 1.25 V
R
thJC
R
thCH
t
rr
IF = 1 A; -di/dt = 200 A/ms; 30 ns
0.25 K/W
0.9 K/W
VR = 30 V; TVJ = 25°C
I
RM
VR = 100 V; IF = 50 A; -diF/dt = 100 A/ms7A TVJ = 100°C
Pulse test: Pulse Width = 5 ms, Duty Cycle < 2.0 %
Pulse Width = 300 ms, Duty Cycle < 2.0 %
Data according to IEC 60747 and per diode unless otherwise specified
IXYS reserves the right to change limits, test conditions and dimensions.
© 2000 IXYS All rights reserved
Antiparallel diode for high frequency switching devices
Antisaturation diode
Snubber diode
Free wheeling diode in converters and motor control circuits
Rectifiers in switch mode power supplies (SMPS)
Inductive heating
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
Avalanche voltage rated for reliable operation
Soft reverse recovery for low EMI/RFI
Low IRM reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Dimensions see outlines.pdf
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DSEC 60-03A DSEC 60-03AR
60
A
I
F
40
TVJ=150°C T
=100°C
VJ
T
= 25°C
VJ
20
0
0.0 0.5 1.0 1.5
V
V
F
Fig. 1 Forward current IF versus V
1.4
1.2
K
f
1.0
0.8
I
RM
Q
r
800
T
= 100°C
VJ
nC
V
= 150V
R
600
Q
r
400
I
= 60A
F
I
F = 30A
I
F = 15A
30
T
= 100°C
VJ
A
V
= 150V
R
25
I
RM
20
I
= 60A
F
I
F = 30A
I
15
F = 15A
10
200
5
0
100 1000
A/ms
-diF/dt
F
Fig. 2 Reverse recovery charge Q
versus -diF/dt
90
ns
80
t
rr
T
VJ
V
R
= 100°C
r
= 150V
70
= 60A
I
F
I
60
F = 30A
I
F = 15A
0
200 600 10000 400 800
-di
Fig. 3 Peak reverse current I
versus -diF/dt
14
V
V
t
FR
fr
12
10
T I
V
FR
A/ms
/dt
F
= 100°C
VJ
= 30A
F
RM
1.2 µs
1.0
t
fr
0.8
0.6
0.4
0.6
0.4 0 40 80 120 160
T
VJ
Fig. 4 Dynamic parameters Qr, I
versus T
VJ
°C
RM
50
40
200 600 10000 400 800
/dt
-di
F
Fig. 5 Recovery time trr versus -diF/dt Fig. 6 Peak forward voltage VFR and t
1
K/W
0.1
Z
thJC
0.01
0.001
0.0001
0.00001 0.0001 0.001 0.01 0.1 1
DSEP30-03A/DSEC 60-03A
t
A/ms
s
8
0 200 400 600 800 1000
A/ms
diF/dt
versus diF/dt
Constants for Z
iR
calculation:
thJC
(K/W) ti (s)
thi
1 0.465 0.005 2 0.179 0.0003 3 0.256 0.04
0.2
0.0
fr
Fig. 7 Transient thermal resistance junction to case
NOTE: Fig. 2 to Fig. 6 shows typical values
© 2000 IXYS All rights reserved
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