IXYS DSA 90 C 200HB Service Manual

Schottky
A
A
A
A
VIV
VAV
j
Ω
High Performance Schottky Diode Low Loss and Soft Recovery Common Cathode
DSA 90 C 200HB
preliminary
= = =
2x
200
45
0.86
RRM
FAV
F
Part number
DSA 90 C 200HB
Features / Advantages:
Very low Vf
Extremely low switching losses
Improved thermal behaviour
High reliability circuit operation
Low voltage peaks for reduced
protection circuits
Low noise switching
Low losses
Symbol Definition
V
RRM
I
R
V
F
I
FAV
V
F0
r
F
R
thJC
T
VJ
P
tot
I
FSM
C
J
E
S
I
R
max. repetitive reverse voltage reverse current
forward voltage
average forward current threshold voltage
slope resistance thermal resistance junction to case
virtual junction temperature total power dissipation max. forward surge current
unction capacitance non-repetitive avalanche energy repetitive avalanche current
Applications:
Rectifiers in switch mode power supplies (SMPS)
Free wheeling diode in low voltage converters
Conditions
=
200
V
R
V
=
R
I
=A
45
F
=A90
I
F
IF=A45
=A90
I
F
rectangular, d = 0.5
for power loss calculation only
tp=10
VR=V; f = 1 MHz
I
V
ms (50 Hz), sine
100
=A;LH
tbd 100
S
=
1.5·VRtyp.;
123
T
VJ
C=
V200
T
VJ
T
VJ
TVJ=°C25
T
VJ
T
C
T
VJ
T
C
T
VJ
T
VJ
T
VJ
f = 10 kHz
=
°C
25
25
°C=
125
125
°C
=
=150°C
= 175 °C
25
°C=
=45°C
25
°C
=
25
°C=
Backside: cathode
Package:
TO-247AD
Industry standard outline
Epoxy meets UL 94V-0
RoHS compliant
R a t i n g s
min.
typ. max.
200
1.8
0.96
1.18
0.86
6.5
0.55 K/W
-55
175
275 W
450
115 pF
tbd mJ
tbd
45
Unit
V
mA
mA
5
V V
V
V1.14
A
V0.52
m
°C
A
A
IXYS reserves the right to change limits, conditions and dimensi
© 2007 IXYS all rights reserved
Data according to IEC 60747and per diode unless otherwise specified
20070703a
DSA 90 C 200HB
g
preliminary
Ratings
Symbol Definition
I
R
M
F
T
RMS
thCH
D
C
st
RMS current
thermal resistance case to heatsink
mounting torque mounting force with clip
storage temperature
Weight
* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting the backside.
Conditions
per pin*
0.8
20
-55
typ. max.min.
70
0.25
120
150
6
Unit
A
K/W
Nm1.2
N
°C
g
Outlines
TO-247AD
Symbol Inches Millimeters
min max min max
A 0.185 0.209 4.70 5.30 A1 0.087 0.102 2.21 2.59 A2 0.059 0.098 1.50 2.49 D 0.819 0.845 20.79 21.45 E 0.610 0.640 15.48 16.24 E2 0.170 0.216 4.31 5.48 e0.215BSC5.46BSC L 0.780 0.800 19.80 20.30 L1 - 0.177 - 4.49 ØP 0.140 0.144 3.55 3.65 Q 0.212 0.244 5.38 6.19 S0.242BSC6.14BSC b 0.039 0.055 0.99 1.40 b2 0.065 0.094 1.65 2.39 b4 0.102 0.135 2.59 3.43 c 0.015 0.035 0.38 0.89 D10.515-13.07­D2 0.020 0.053 0.51 1.35 E10.530-13.45­ØP1 - 0.291 - 7.39
IXYS reserves the right to change limits, conditions and dimensi
© 2007 IXYS all rights reserved
Data according to IEC 60747and per diode unless otherwise specified
20070703a
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