IXYS DSA 20 C 150PN Service Manual

Schottky

V

V

V

A

V

j

Ω

High Performance Schottky Diode
Low Loss and Soft Recovery
Common Cathode

DSA 20 C 150PN

advanced

=

I

RRM

FAV

F

=
=

2x

150

10

0.74

Part number

(Marking on product)

DSA 20 C 150PN

Features / Advantages:

● Very low Vf

● Extremely low switching losses

● Low Irm-values

● Improved thermal behaviour

● High reliability circuit operation

● Low voltage peaks for reduced

protection circuits

● Low noise switching

● Low losses

Symbol Definition

V

RRM

I

R

V

F

I

FAV

V

F0

r

F

R

thJC

T

VJ

P

tot

I

FSM

C

J

E

AS

I

AR

max. repetitive reverse voltage
reverse current

forward voltage

average forward current
threshold voltage

slope resistance
thermal resistance junction to case

virtual junction temperature
total power dissipation
max. forward surge current

unction capacitance
non-repetitive avalanche energy
repetitive av a l an che current

123

Applications:

● Rectifiers in switch mode power
supplies (SMPS)

● Free wheeling diode in low voltage
converters

Conditions

150

V

=

R

=

V

R

=A

10

I

F

=A20

I

F

=A10

I

F

=A20

I

F

rectangular, d = 0.5

for power loss calculation only

ms (50 Hz), sine

=10

t

p

VR= V; f = 1 MHz

I

=A;L = µH

AS

1.5·V

=

V

A

V

V150

R

typ.;

100

f = 10 kHz

=

T

VJ

T

VJ

T

VJ

=

T

VJ

T

=

VJ

T

=140°C

C

= 175 °C

T

VJ

T

C

T

=45°C

VJ

=

T

VJ

=

T

VJ

25

25

125

25

125

25

25

25

Package:

TO-220FPAB

● Industry standard outline

● Plastic overmolded tab for

electrical isolation

● Epoxy meets UL 94V-0

● RoHS compliant

R a t i n g s

min.

typ. max.

°C

°C=

°C=

°C

°C

-55

°C=

°C

°C

Unit

0.3

mA

mA

3

0.88

0.99

0.74

10

0.55

11.5

m

4.50 K/W

175

°C

35 W

60

pF

tbd mJ

tbd

V150

V

V

V

V0.86

A

V

A

A

IXYS reserves the right to change limits, conditions and dimensi

© 2005 IXYS all rights reserved

0614

Data according to IEC 60747and per diode unless otherwise specified

DSA 20 C 150PN

advanced

Ratings

Symbol Definition

I

R

M

F

T

RMS

thCH

D

C

stg

RMS current
thermal resistance case to heatsink
mounting torque

mounting force with clip
storage temperature

Weight

* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.
In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting
the backside.

Conditions

per pin*

0.4

20

-55

typ. max.min.

35

0.50

60

150

2

Unit

A

K/W

Nm0.6

N

°C

g

Outlines

Q

L1

TO-220FPAB

b1

ØP

E

A

A1

H

D

A2

L

b

c

e

IXYS reserves the right to change limits, conditions and dimensi

© 2005 IXYS all rights reserved

0614

Data according to IEC 60747and per diode unless otherwise specified