Iton Technology BW2570PCIE User Manual
Iton Technology Corp.
Wi‐Fi MODULE SPECIFICATION
Part Number: BW2570‐PCIE
Version: V 1.0
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
THIS DOCUMENT IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDINGANYWARRANTY
OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this
document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual
property rights are granted herein.
The Wi‐Fi Alliance Member Logo is a trademark of the Wi‐Fi Alliance.
All trade names, trademarks and registered trademarks mentioned in this document are property of their
respective owners, and are hereby acknowledged.
Copyright ⓒ 2014 ITON Technology Corp. All rights reserved.
1. Overview
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GENERAL DESCRIPTION
The Broadcom BCM43570 single‐chip device provides the highest level of integration for a mobile or
handheld wireless system, with integrated IEEE 802.11 a/b/g/n/ac MAC/baseband/radio and Bluetooth 4.1
+ EDR. It provides a small form‐factor solution with minimal external components to drive down cost for
mass volumes and allows for handheld device flexibility in size, form, and function. Comprehensive power
management circuitry and software ensure the system can meet the needs of highly mobile devices that
require minimal power consumption and reliable operation.
2. Block Diagram
3. Application Diagram
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4. Feature
Wi-Fi Key Feature
• IEEE 802.11ac Draft compliant
• Dual-stream spatial multiplexing from 1 Mbps up to 866.7 Mbps data rates
• Supports 20, 40, and 80 MHz channels with optional Short GI(SGI) (256QAM modulation)
• Full IEEE 802.11a/b/g/n legacy compatibility with enhanced performance
• Supports IEEE 802.11ac/n beam forming
• On-chip power amplifiers and low-noise amplifiers for both bands
• Supports various RF front-end architectures including:
- Three antennas design: two separate antennas (Core0 and Core1 to WLAN) andaseparate
antenna to Bluetooth
• Supports PCIe Gen2 interfaces
Bluetooth Key Features
• Complies with Bluetooth Core Specification Version 4.1 + EDR with provisions for supporting future
specifications
• Bluetooth Class 1 or Class 2 transmitter operation
• Adaptive frequency hopping(AFH) for reducing radio frequency interference
• USB 2.0 full-speed (12Mbps) supported for Bluetooth
• Supports Serial Flash interface
• Incorporates GFSK for 1Mbps, Pi/4-DQPSK for 2Mbps and 8-DPSK for 3Mbps to support EDR
5. WLAN Product Specification
Dimension 29.8*26.8*0.3mm
Chip‐set BCM43570
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