IS61LV5128 ISSI
®
512K x 8 HIGH-SPEED CMOS STATIC RAM
FEATURES
• High-speed access times:
10, 12 and 15 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with CE and OE
options
• CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 36-pin 400-mil SOJ
– 36-pin miniBGA
– 44-pin TSOP (Type II)
DESCRIPTION
The ISSI IS61LV5128 is a very high-speed, low power,
524,288-word by 8-bit CMOS static RAM. The IS61LV5128
is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields higher performance
and low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS61LV5128 operates from a single 3.3V power
supply and all inputs are TTL-compatible.
The IS61LV5128 is available in 36-pin 400-mil SOJ, 36pin mini BGA, and 44-pin TSOP (Type II) packages.
JULY 2001
FUNCTIONAL BLOCK DIAGRAM
A0-A18
VCC
GND
I/O0-I/O7
CE
OE
WE
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
512K X 8
MEMORY ARRAY
COLUMN I/O
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
07/16/01
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IS61LV5128 ISSI
1
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9
10
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14
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36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
A0
A1
A2
A3
A4
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
Vcc
I/O5
I/O4
A14
A13
A12
A11
A10
NC
PIN CONFIGURATION
36 mini BGA
44-Pin TSOP (Type II)
®
1 2 3 4 5 6
A
B
C
D
E
F
G
H
A0
I/O4
I/O5
GND
Vcc
I/O6
I/O7
A9
A1
A2
OE
A10
PIN DESCRIPTIONS
NC
WE
NC
A18
CE
A11
A3
A4
A5
A17
A16
A12
A6
A7
A15
A13
A8
I/O0
I/O1
Vcc
GND
I/O2
I/O3
A14
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
36-Pin SOJ
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
Vcc
I/O5
I/O4
A14
A13
A12
A11
A10
NC
NC
NC
A0-A18 Address Inputs
CE Chip Enable Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Bidirectional Ports
Vcc Power
GND Ground
NC No Connection
TRUTH TABLE
Mode WE CE OE I/O Operation Vcc Current
Not Selected X H X High-Z ISB1, ISB2
(Power-down)
Output Disabled H L H High-Z ICC
Read H L L DOUT ICC
Write L L X DIN ICC
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Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
07/16/01
IS61LV5128 ISSI
®
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to Vcc + 0.5 V
TBIAS Temperature Under Bias –55 to +125 °C
TSTG Storage Temperature –65 to +150 °C
PT Power Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
OPERATING RANGE
10 ns 12 ns, 15 ns
Range Ambient Temperature VCC VCC
Commercial 0°C to +70°C 3.3V +10%, -5% 3.3V ± 10%
Industrial –40°C to +85°C 3.3V +10%, -5% 3.3V ± 10%
CAPACITANCE
(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
CI/O Input/Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A = 25°C, f = 1 MHz, Vcc = 3.3V.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
07/16/01
3