iSenseTek Technology, Inc
Approved
Checked
Designed
Checked
Received
Approval Sheet
Model : 1810 BLE Module (nRF52832)
Part No : ISBLE1810-P52832ACA
Datasheet Version : v2.4
Date : 2017/02/09
Customer name
Model
P/N
：
：
：
1
Index
1. Overall Introduction .................................................................................................... 3
1.1 Applications ........................................................................................................... 3
1.2 Features ................................................................................................................ 4
2. P/N Number Define .................................................................................................... 5
3. Module Description .................................................................................................... 5
3.1 Product Dimensions .............................................................................................. 5
3.2 Pin Descriptions ..................................................................................................... 6
3.3 PCB Layout Guide ................................................................................................. 8
4. Main Chip Solution ..................................................................................................... 8
5. Shipment Packing Information ................................................................................... 9
6. Specification ............................................................................................................ 10
6.1 Absolute Maximum Ratings ................................................................................. 10
6.2 Operation Conditions ........................................................................................... 10
6.3 Electrical Specifications ....................................................................................... 11
6.3.1 Radio Transceiver ............................................................................................ 11
6.3.2 Transmitter Specifications ................................................................................ 12
6.3.3 Receiver Operation .......................................................................................... 12
6.3.4 RX Intermodulation .......................................................................................... 12
6.3.5 RX Selectivity ................................................................................................... 13
6.3.6 Radio Timing .................................................................................................... 14
6.3.7 RSSI Specifications .......................................................................................... 14
6.3.8 CPU Performance ............................................................................................ 15
6.3.9 Current Consumption, Sleep ............................................................................ 15
7. Reference Circuit ..................................................................................................... 16
7.1 Schematic with Internal LDO ............................................................................... 16
7.2 Schematic with Internal DC/DC Converter .......................................................... 16
8. Development Kit ...................................................................................................... 17
9. Antenna Forbidden Zone Description ...................................................................... 18
10. RF Exposure Warning Statement ............................................................................ 19
11. Document History .................................................................................................... 21
2
1. Overall Introduction
18 ± 0.3mm
10 ± 0.3mm
1.95 ± 0.2mm
iSenseTek’s ISBLE is a Bluetooth smart (Bluetooth low energy or BLE) module designed
based on Nordic solution. The feature of the module.
Based on the Nordic nRF52832 SoC
Multiple protocol of BLE & RF 2.4GHz & ANT+ upon customer preference
Dimension :
Length Width Height
Low power requirements, Ultra-low peak, Average and idle mode power
Consumption
Compatible with a large installed based of mobiles phones, tablets and computers
Fully coverage of wireless applications
BLE & RF transmission switching may help products to fit all operation system
BLE & RF transmission switching may help products to fit all kinds of hardwares
1.1 Applications
Computer peripherals and I/O devices
Mouse
Keyboard
Multi-touch trackpad
Interactive entertainment devices
Remote control
Gaming controller
Beacons
Personal area networks
Health/fitness sensor and monitor devices
Medical devices
Key-fobs + Wrist watch
Remote control toys
Wearable device
IoT network accessories
3
1.2 Features
2.4GHz transceiver
-96 dBm sensitivity in Bluetooth
GFSK at 1 Mbps, 2 Mbps supported data rates
TX Power -20 to +4 dBm in 4 dB steps
®
low energy mode
ARM® Cortex™-M4F 32 bit processor
Serial Wire Debug (SWD)
Memory
512 kB embedded flash program memory
64 kB RAM
Low current consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.5 mA, 5.3 mA
TX only @ +4 dBm, 0 dBm 16.6 mA, 11.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled 5.4 mA
RX only @ 1 Mbps 11.7 mA
CPU @ 64MHz from flash, from RAM 7.4 mA, 6.7 mA
CPU @ 64MHz from flash, from RAM @ 3V, DCDC 3.7 mA, 3.3 mA
System Off , On 0.7μA, 1.2 μA
Additional current for RAM retention 20 nA / 4K block
On-air compatibility with nRF24L series
12 bit ADC/200KSPS - 8 configurable channels
31 General Purpose I/O Pins
NFC-A tag interface for OOB pairing
SPI Master/Slave
I2S audio interface
Low power comparator
Temperature sensor
Two-wire Master (I2C compatible)
UART (w/ CTS/RTS and DMA)
CPU independent Programmable Peripheral Interconnect (PPI)
Quadrature Decoder (QDEC)
128-bit AES HW encryption
5*32bit, 3*24bit Real Timer Counter (RTC)
4
2. P/N Number Define
Figure 1 : P/N Number Define
3. Module Description
3.1 Product Dimensions
Figure 2 : Product Dimensions
5
3.2 Pin Descriptions
Figure 3 : Module Pin Descriptions
Pin NO. Name Pin function Description
P.029 Digital I/O General-purpose digital I/O
0
AIN5 Analog input ADC input 5
1 GND Ground The pad must be connected to a solid ground plane
2 GND Ground The pad must be connected to a solid ground plane
3 GND Ground The pad must be connected to a solid ground plane
4 P0.25 Digital I/O General-purpose digital I/O
5 P0.26 Digital I/O General-purpose digital I/O
6 P0.27 Digital I/O General-purpose digital I/O
P0.28 Digital I/O General-purpose digital I/O
7
AIN4 Analog input ADC input 4
P0.30 Digital I/O General-purpose digital I/O
8
AIN6 Analog input ADC input 6
9 VDD_NRF Power Power supply
10
11 DEC4 Power Power supply
12 DCC Power DC/DC output voltage to external LC filter
P0.31 Digital I/O General-purpose digital I/O
AIN7 Analog input ADC input 7
6
Pin NO. Name Pin function Description
13 VDD_NRF Power Power supply
14 VDD_NRF Power Power supply
15 GND Ground The pad must be connected to a solid ground plane
16 GND Ground The pad must be connected to a solid ground plane
17
18
19
20
21
22
23 P0.06 Digital I/O General-purpose digital I/O
24 P0.07 Digital I/O General-purpose digital I/O
25 P0.08 Digital I/O General-purpose digital I/O
26
P0.00 Digital I/O General-purpose digital I/O
XL1 Analog output Connector for 32.768KHz crystal
P0.01 Digital I/O General-purpose digital I/O
XL2 Analog output Connector for 32.768KHz crystal
P0.02 Digital I/O General-purpose digital I/O
AIN0 Analog input ADC input 0
P0.03 Digital I/O General-purpose digital I/O
AIN1 Analog input ADC input 1
P0.04 Digital I/O General-purpose digital I/O
AIN2 Analog input ADC input 2
P0.05 Digital I/O General-purpose digital I/O
AIN3 Analog input ADC input 3
P0.09 Digital I/O General-purpose digital I/O
NFC1 NFC input NFC antenna connection
27
28 P0.11 Digital I/O General-purpose digital I/O
29 GND Ground The pad must be connected to a solid ground plane
30 P0.12 Digital I/O General-purpose digital I/O
31 P0.13 Digital I/O General-purpose digital I/O
32 P0.14 Digital I/O General-purpose digital I/O
33 P0.15 Digital I/O General-purpose digital I/O
34 P0.16 Digital I/O General-purpose digital I/O
35 P0.17 Digital I/O General-purpose digital I/O
36 P0.18 Digital I/O General-purpose digital I/O
37 P0.19 Digital I/O General-purpose digital I/O
38 P0.20 Digital I/O General-purpose digital I/O
39
P0.10 Digital I/O General-purpose digital I/O
NFC2 NFC input NFC antenna connection
P0.21 Digital I/O General-purpose digital I/O
RESET Digital I/O Configurable as pin reset
7
Pin NO. Name Pin function Description
40 SWDIO Digital I/O
41 SWDCLK Digital input
42 P0.22 Digital I/O General-purpose digital I/O
43 P0.23 Digital I/O General-purpose digital I/O
44 P0.24 Digital I/O General-purpose digital I/O
45 GND Ground The pad must be connected to a solid ground plane
46 GND Ground The pad must be connected to a solid ground plane
1. Digital I/O pad with 5mA source/sink capability.
System reset(active low).Also HW debug and flash
Programming
HW debug and flash programming. Connect a 12K ohm
resister to GND for flash programming .
Table 1 : Pin function
3.3 PCB Layout Guide
Figure 4 : PCB Layout Guide
4. Main Chip Solution
RF IC Crystal Frequency
Nordic nRF52832-QFAA
32MHz
Table 2 : Main Chip Solution
8
5. Shipment Packing Information
Part Number Package
ISBLE1810-P52832ACA 500 PCS/BOX
Table 3 : Shipment Packing Information
Figure 5 : Packing Information
9
6. Specification
6.1 Absolute Maximum Ratings
Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount
of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged
periods of time may affect the reliability of the device.
Symbol Parameter Min. Max. Units
Supply voltages
VDD -0.3 +3.9 V
VSS 0 V
I/O pin voltage
VIO , VDD ≤ 3.6 V
VIO , VDD > 3.6 V
NFC antenna pin current
INFC
Radio
1/2
-0.3 VDD+0.3 V
-0.3 3.9
80 mA
RF input level 10 dBm
Environmental WLCSP package
Storage temperature -40 +125
MSL Moisture Sensitivity Level 2
ESD HBM Human Body Model 4 kV
ESD CDMQF
Charged Device Model
750 V
(QFN48, 6x6 mm package)
°C
Flash memory
Endurance 10000
Retention
Table 4 : Absolute maximum ratings
10 years at 40 °C
Write /
erase cycles
6.2 Operation Conditions
The operating conditions are the physical parameters that the chip can operate within.
Symbol Parameter Notes Min. Typ. Max. Units
VDD Supply voltage, independent of DCDC enable
t
R_VDD
TA
Supply rise time (0 V to 1.7 V) 60 ms
Operating temperature -40 25 85
Table 5 : Operating conditions
10
1.7 3.0 3.6 V
°C
6.3 Electrical Specifications
6.3.1 Radio Transceiver
General radio characteristics
Symbol Description Min. Typ. Max. Units
fOP
f
PLL,PROG,RES
f
PLL,CH,SP
f
DELTA,1M
f
DELTA,BLE,1M
f
DELTA,2M
fsk
SPS
Radio current consumption
Operating frequencies 2360 2500 MHz
PLL programming resolution 2 kHz
PLL channel spacing 1 MHz
Frequency deviation @ 1 Msps ±170 kHz
Frequency deviation @ BLE 1Msps ±250 kHz
Frequency deviation @ 2 Msps ±320 kHz
On-the-air data rate 1 2 Msps
Table 6 : General radio characteristics
Symbol Description Min. Typ. Max. Units
I
TX,PLUS4dBM,DCDC
I
TX,PLUS4dBM
I
TX,0dBM,DCDC
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
TX,0dBM
TX,MINUS4dBM,DCDC
TX,MINUS4dBM
TX,MINUS8dBM,DCDC
TX,MINUS8dBM
TX,MINUS12dBM,DCDC
TX,MINUS12dBM
TX,MINUS16dBM,DCDC
TX,MINUS16dBM
TX,MINUS20dBM,DCDC
TX,MINUS20dBM
TX,MINUS40dBM,DCDC
TX,MINUS40dBM
START,TX,DCDC
START,TX
TX start-up current, PRF = 4 dBm
TX only run current (DCDC, 3V) PRF =+4 dBm 7.5 mA
TX only run current PRF = +4 dBm 16.6 mA
TX only run current (DCDC, 3V)PRF = 0dBm 5.3 mA
TX only run current PRF = 0dBm 11.6 mA
TX only run current DCDC, 3V PRF = -4dBm 4.2 mA
TX only run current PRF = -4 dBm 9.3 mA
TX only run current DCDC, 3V PRF = -8 dBm 3.8 mA
TX only run current PRF = -8 dBm 8.4 mA
TX only run current DCDC, 3V PRF = -12 dBm 3.5 mA
TX only run current PRF = -12 dBm 7.7 mA
TX only run current DCDC, 3V PRF = -16 dBm 3.3 mA
TX only run current PRF = -16 dBm 7.3 mA
TX only run current DCDC, 3V PRF = -20 dBm 3.2 mA
TX only run current PRF = -20 dBm 7.0 mA
TX only run current DCDC, 3V PRF = -40 dBm 2.7 mA
TX only run current PRF = -40 dBm
TX start-up current DCDC, 3V, PRF = 4 dBm
5.9 mA
4.0 mA
8.8 mA
Table 7 : Radio current consumption
11
6.3.2 Transmitter Specifications
Symbol Description Min. Typ. Max. Units
PRF
P
RFC
P
RFCR
P
RF1,1
P
RF2,1
P
RF1,2
P
RF2,2
Maximum output power. 4 6 dBm
RF power control range. 24 dB
RF power accuracy. ±4 dB
1st Adjacent Channel Transmit Power 1 MHz (1 Msps) -25 dBc
2nd Adjacent Channel Transmit Power 2 MHz (1 Msps) -50 dBc
1st Adjacent Channel Transmit Power 2 MHz (2 Msps) -25 dBc
2nd Adjacent Channel Transmit Power 4 MHz (2 Msps) -50 dBc
Table 8 : Transmitter specifications
6.3.3 Receiver Operation
Symbol Description Min. Typ. Max. Units
P
P
P
P
P
1. Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7] are used for receiver address
2. As defined in the Bluetooth Core Specification v4.0 Volume 6: Core System Package (Low Energy Controller Volume)
3. Equivalent BER limit < 10E-04
4. Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7] are used for receiver address
RX,MAX
SENS,IT,1M
SENS,IT,SP,1M,BLE
SENS,IT,LP,1M,BLE
SENS,IT,2M
correlation, the typical sensitivity for this mode is degraded by 3dB.
correlation, the typical sensitivity for this mode is degraded by 3dB.
Maximum received signal strength at < 0.1% PER 0 dBm
Sensitivity, 1Msps nRF mode 1 -93 dBm
Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes
BER=1E-3 2
Sensitivity, 1Msps BLE ideal transmitter >=128 bytes
BER=1E-4 3
Sensitivity, 2Msps nRF mode 4 -89 dBm
Table 9 : Receiver operation
-96 dBm
-95 dBm
6.3.4 RX Intermodulation
Symbol Description Min. Typ. Max. Units
P
IMD,1M
P
IMD,1M,BLE
P
IMD,2M
IMD performance, 1 Msps, 3rd, 4th, and 5th offset
-33 dBm
channel
IMD performance, BLE 1 Msps, 3rd, 4th, and 5th offset
-30 dBm
channel
IMD performance, 2 Msps, 3rd, 4th, and 5th offset
-33 dBm
channel
Table 10 : RX intermodulation
12
6.3.5 RX Selectivity
Symbol Description Min. Typ. Max. Units
C/I
1M,co-channel
C/I
1M,-1MHz
C/I
1M,+1MHz
C/I
1M,-2MHz
C/I
1M,+2MHz
C/I
1M,-3MHz
C/I
1M,+3MHz
C/I
1M,±6MHz
C/I
1MBLE,co-channel
C/I
1MBLE,-1MHz
C/I
1MBLE,+1MHz
C/I
1MBLE,-2MHz
C/I
1MBLE,+2MHz
C/I
1MBLE,>3MHz
C/I
1MBLE,image
C/I
1MBLE,image,1MHz
C/I
2M,co-channel
C/I
2M,-2MHz
C/I
2M,+2MHz
C/I
2M,-4MHz
C/I
2M,+4MHz
C/I
2M,-6MHz
C/I
2M,+6MHz
C/I
2M,≥12MHz
1Msps mode, Co-Channel interference 9 dB
1 Msps mode, Adjacent (-1 MHz) interference -2 dB
1 Msps mode, Adjacent (+1 MHz) interference -10 dB
1 Msps mode, Adjacent (-2 MHz) interference -19 dB
1 Msps mode, Adjacent (+2 MHz) interference -42 dB
1 Msps mode, Adjacent (-3 MHz) interference -38 dB
1 Msps mode, Adjacent (+3 MHz) interference -48 dB
1 Msps mode, Adjacent (≥6 MHz) interference -50 dB
1 Msps BLE mode, Co-Channel interference 6 dB
1 Msps BLE mode, Adjacent (-1 MHz) interference -2 dB
1 Msps BLE mode, Adjacent (+1 MHz) interference -9 dB
1 Msps BLE mode, Adjacent (-2 MHz) interference -22 dB
1 Msps BLE mode, Adjacent (+2 MHz) interference -46 dB
1 Msps BLE mode, Adjacent (≥3 MHz) interference -50 dB
Image frequency Interference -22 dB
Adjacent (1 MHz) interference to in-band image
-35 dB
frequency
2Msps mode, Co-Channel interference 10 dB
2 Msps mode, Adjacent (-2 MHz) interference 6 dB
2 Msps mode, Adjacent (+2 MHz) interference -14 dB
2 Msps mode, Adjacent (-4 MHz) interference -20 dB
2 Msps mode, Adjacent (+4 MHz) interference -44 dB
2 Msps mode, Adjacent (-6 MHz) interference -42 dB
2 Msps mode, Adjacent (+6 MHz) interference -47 dB
2 Msps mode, Adjacent (≥12 MHz) interference -52 dB
Table 11 : RX selectivity
13
6.3.6 Radio Timing
Symbol Description Min. Typ. Max. Units
t
TXEN
t
TXEN,FAST
t
TXDISABLE
t
TXDISABLE,2M
t
RXEN
t
RXEN,FAST
t
t
t
t
t
SWITCH
RXDISABLE
TXCHAIN
RXCHAIN
RXCHAIN,2M
Time between TXEN task and READY event after
140 us
channel FREQUENCY configured
Time between TXEN task and READY event after
40 us
channel FREQUENCY configured (Fast Mode)
Time between DISABLE task and DISABLED event
6 us
when the radio was in TX and mode is set to 1Msps
Time between DISABLE task and DISABLED event
4 us
when the radio was in TX and mode is set to 2Msps
Time between the RXEN task and READY event after
140 us
channel FREQUENCY configured in default mode
Time between the RXEN task and READY event after
40 us
channel FREQUENCY configured in fast mode
The minimum time taken to switch from RX to TX or TX
20 us
to RX (channel FREQUENCY unchanged)
Time between DISABLE task and DISABLED event
0 us
when the radio was in RX
TX chain delay 0.6 us
RX chain delay 9.4 us
RX chain delay in 2Msps mode 5 us
Table 12 : Radio timing
6.3.7 RSSI Specifications
Symbol Description Min. Typ. Max. Units
RSSI
RSSI
RSSI
ACC
RESOLUTION
PERIOD
RSSI Accuracy Valid range -90 to -20 dBm ±2 dB
RSSI resolution 1 dB
Sample period 8 us
Table 13 : RSSI specifications
14
CPU current, running from flash, cache enabled, DCDC
Additional RAM retention current per 4 KB RAM section
6.3.8 CPU Performance
The CPU clock speed is 64 MHz. Current and efficiency data is taken when in System ON and
the CPU is executing the CoreMark™ benchmark. It includes power regulator and clock base
currents. All other blocks are IDLE.
Symbol Description Min. Typ. Max. Units
W
W
W
I
I
I
I
I
I
I
I
CM
CM
FLASH
FLASHCACHE
RAM
DDFLASHCACHE
DDFLASHCACHEDCDC
DDFLASH
DDFLASHDCDC
DDRAM
DDRAMDCDC
DDFLASH
DDFLASHDCDC/MHz
FLASH
FLASH/MHz
CPU wait states, running from flash, cache disabled 0 2
CPU wait states, running from flash, cache enabled 0 3
CPU wait states, running from RAM 0
CPU current, running from flash, cache enabled, LDO 7.4 mA
3.7 mA
3V
CPU current, running from flash, cache disabled, LDO 8.0 mA
CPU current, running from flash, cache disabled,
3.9 mA
DCDC 3V
CPU current, running from RAM, LDO 6.7 mA
CPU current, running from RAM, DCDC 3V 3.3 mA
CPU efficiency, running from flash, cache enabled,
125
LDO
CPU efficiency, running from flash, cache enabled,
58
DCDC 3V
CoreMark3, running from flash, cache enabled
215
CoreMark per MHz, running from flash, cache enabled 3.36
µA/
MHz
µA/
MHz
CoreMark
CoreMark
MHz
CM
FLASH/mA
CoreMark per mA, running from flash, cache enabled,
DCDC 3V
6.3.9 Current Consumption, Sleep
Symbol Description Min. Typ. Max. Units
I
OFF
ION
I
RAM
System OFF current, no RAM retention
System ON base current, no RAM retention 1.2 μA
Table 15 : Current consumption, sleep
Table 14 : CPU performance
15
58
CoreMark
mA
0.7 μA
20 nA
7. Reference Circuit
7.1 Schematic with Internal LDO
Figure 6 : Schematic with internal LDO
7.2 Schematic with Internal DC/DC Converter
Figure 7 : Schematic with internal DC/DC converter
16
8. Development Kit
The ISBLE1810-EV is a versatile single board development kit for iSenseTek 1810 BLE
module series. The kit gives access to all module I/O and interfaces via connectors and has
4 LEDs and 4 buttons which are user-programmable. Using the ISBLE1810-EV it enables
setting up of a peer device that you can use to test the connection of your application, it
provides a complete solution, allowing faster time to market.
Figure 8 : Development Kit for ISBLE1810
FEATURES
Support USB to UART for DTM use
All GPIO and interfaces available at edge connectors
Button *4 and LED *4
CR2032 battery holder *1
Molex NFC connector (051281-0594) *1
Support module test & program socket
17
9. Antenna Forbidden Zone Description
The PCB and mechanism design need to meet antenna forbidden zone description Tabl e.
Otherwise affect the efficiency of the antenna.
Figure 9 : Antenna Forbidden Zone Description
Material \ Dimension (mm) A B C D
FR4 (without Copper)
FR4 (with Copper)
Metal
Plastic
≧ 1 ≧ 3 ≧ 1 ≧ 3
≧ 4 ≧ 7 ≧ 10 ≧ 4
≧ 4 ≧ 3.5 ≧ 10 ≧ 3
≧ 1 ≧ 1 ≧ 1 ≧ 3
Table 16 : Antenna Forbidden Zone List
18
10. RF Exposure Warning Statement
This equipment complies with FCC RF radiation exposure limits set forth for an
uncontrolled environment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
This equipment complies with Part 15 of the FCC Rules. Operation is subject the
following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may
cause undesired operation.
The devices must be installed and used in strict accordance with the manufacturer’s
instructions as described in this document.
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
The final end product must be labeled in a visible area with the following: “Contains FCC ID:
2AI2V-ISBLE1810X52”.
This module has been granted modular approval for mobile applications. OEM integrators
for host products may use the module in their final products without additional FCC
certification if they meet the following conditions. Otherwise, additional FCC approvals must
19
be obtained.
• The host product with the module installed must be evaluated for simultaneous
transmission requirements.
• The users manual for the host product must clearly indicate the operating requirements
and conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.
• To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed {Insert Reference to Your Antenna Information Here}.
20
11. Document History
Revision Date Description/Changes
1.0 2016/05/16
2.1 2016/07/22
2.2 2016/11/17
2.3 2017/01/04 Add RF Exposure Warning Statement. P19
2.4 2017/02/09 Modify RF Exposure Warning Statement Content. P19~20
New Approval Sheet
1. Modify Part No. to ISBLE1810-x52. P1
2. Update P/N Number Define. P5
3. ISBLE1810-P52xxxxxA add shielding marking and test point for
PCB Bottom layer. P5
4. Update PCB layout guide information. P8
5. Update development kit information & Photos. P18
1. Modify Product Dimensions. P5
2. Modify Pin Description. P6
3. Modify PCB Layout Guide. P8
4. Modufy Reference Circuit. P16
21
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