
Tel: (800) 404-0204
www.ironwoodelectronics.com
Pseudo Gull Wing Soldering Instructions
The Ironwood Electronics, Pseudo Gull
Wing surface mount feet are designed to
solder to standard gull wing surface
mount land patterns. Because the feet do
not fully emulate the physical characteristics
of a gull wing package, the methods used to
solder it to a target PCB are different. The
recommended method detailed below has
produced very good results.
A Pseudo Gull Wing surface mount
emulator foot and target PCB with surface
Figure 1: Target PCB/Emulator Foot
soluble or no-clean) on two apposing corner pads of the target PCB land pattern as
shown in Figure 2.
2. Place the foot onto the land pattern noting
orientation (pin 1 location) and align it to the
pads with the aid of a microscope as shown in
Figure 2. Handle the adapter by the top pin
array or PCB corners (if pins are not present).
3. While holding the foot in place by pressing
down gently, solder two apposing corner leads
to their pads using Sn63/Pb37 solder wire and
a very fine tipped soldering iron. Verify the
lead to pad alignment with a microscope after
soldering.
Figure 3: Applying Flux
mount land pattern are shown in Figure 1.
1. Place a small amount of tack flux (water
Figure 2: Align the Foot to PCB
4. Apply supplemental flux (water soluble or
no-clean) to the lead/pad area along each side of
the foot as shown in Figure 3.
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Pseudo Gull Wing Soldering Instructions
Figure 4: Soldering Process
Remove solder bridges using fluxed solder wick.
7. Clean the foot thoroughly using an
aqueous cleaning system and inspect for
proper solder connections as shown in
Figure 5.
Tel: (800) 404-0204
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5. Using a microscope, individually solder
each lead of the foot to their pads using solder
sparingly. See soldering process in Figure 4.
Excess solder will collect on the inboard end
of the leads underneath the foot potentially
causing solder bridges to occur between
adjacent legs. Caution must be used when
touching the soldering iron tip to the emulator
foot leads to avoid excessive heat, heating
time and pressure, which may damage the
adaptor or target board pads.
6. After soldering, inspect the foot for proper
fillets and solder bridges using a microscope.
Figure 5: Solder Connections
filename: PSI.doc, Rev A
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