Probe Board with GHZ BGA Socket
Assembly Instructions
1. Place the square piece of elastomer provided into the socket base (rotational and 'side up' orientation are not critical).
2. Adjust the elastomer to sit into the alignment plate cavity.
3. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation on target PCB is critical.
4. Place the compession plate (if required*) on top of the BGA package.
5. Install the socket top assembly with the hardware provided (four 0-80 screws).
6. Turn the compression screw clockwise, until it makes contact with the compression plate or the BGA package.
7. Turn an additional quarter-turn.
Socket
Top Assembly
BGA Package
Z-Axis Elastomer
Socket Base
Alignment plate
Compression Screw
Socket Lid
Machine Screw
Compression plate
Probe board
Test Points
Ironwood Electronics Probe Board with GHz BGA socket
*Ironwood Electronics technical sta ff will determine (from your package spec) if a compression or alignment plate is required
© 2000 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Filename: GPI.mcd, Rev A, 1/18/00, IP
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