GHZ BGA Socket (surface mount)
Assembly Instructions
1. Reflow Socket Base assembly to the target PCB (see page 2 for reflow profile).
2. Place the square piece of elastomer provided into the socket base (rotation and 'side up' orientation are not critical).
Adjust the elastomer to sit into the alignment plate cavity.
3.
4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientati on on target PCB is critical.
5. Place the compess ion plate (if required*) on top of the BGA package.
6. Install the s ocket top assembly with the hardware provided (four 0-80 screws).
7. Turn the compression screw clockwi se, until it makes contact with the compression plate or the BGA package.
8. Turn an additional quarter-turn.
page 1 of 2
Socket
Top Assembly
BGA Package
Z-Axis Elastomer
Socket Base Assembly
Compression Screw
Socket Lid
Machine Screw
Compression plate
Alignment plate
Target PCB with SMT pads
*Ironwood Electronics technical staff will determine (from your package spec) if a compression or alignment plate is required
© 2000 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Filename: HSI.mcd, Rev A, 1/18/00, IP
GHZ BGA Socket (surface mount)
Assembly Instructions
1. Use caution when profiling to insure minimal temperature difference (<15 C and preferably <10 C) between components
2. Forced convection reflow with nitrogen preferred (optional)
3. Preheat stage temperature ramp rate: <2 C per second
4. Time required in Flux Activation stage: 150 to 180 seconds
5. Flux Activation stage temperature range: 150 to 183 C
6. Time required in Solder stage: 60 seconds
7. Maximum temperature 210 - 220 C (Do not exceed 10 seconds at maximum temperature)
8. Cool-Down stage temperature reduction rate: <2 C per second
page 2 of 2
250
Maximum Package Body Temperature
200
150
100
Temperature (°C)
Solder Temperature Melting Point
50
<2°C
per Second
Preheat
150 - 180 Seconds
Recommended Reflow Profile
1° to 3°C
per Second
Flux Activation
<2°C
per Second
Reflow Cool-Down
0
100
200 300
Time (seconds)
400
500
NOTE:
It may be necessary to adjust the amount of heat when attaching the part, due to the fact that
the adapter mass is different from the actual IC package. Solder sphere spec = 63Sn, 37Pb
and its melting point = 183 C
© 2000 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Filename: HSI.mcd, Rev A, 1/18/00, IP
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