Programmable preheat time
Programmable run frequency
RoHS compliant
Description
The IRS2166D is a fully integrated, fully protected 600 V
ballast control IC designed to drive all types of fluorescent
lamps. The IRS2166D is based on the popular IR2166
control IC with additional improvements to increase ballast
performance. PFC circuitry operates in critical conduction
mode and provides high PF, low THD, and DC bus
regulation. The IRS2166D features include programmable
preheat and run frequencies, programmable preheat time,
and programmable end-of-life protection. Comprehensive
End-of-life window comparator pin
Internal up/down current-sense fault counter
DC bus undervoltage reset
Lamp removal/auto-restart shutdown pin
Internal bootstrap MOSFET
Internal 15.6 V zener clamp diode on V
Micropower startup (250 µA)
Latch immunity and ESD protection
System Features
Improved V
Increased SD pin shutdown voltage threshold hysteresis
Changed EOL pin internal 2.0 V bias to a +/-10 µA OTA
Internal bootstrap MOSFET
regulation voltage tolerance
BUS
Packages
protection features such as protection from failure of a lamp
to strike, filament failures, end-of-life protection, DC bus
undervoltage reset as well as an automatic restart function,
have been included in the design.
Note: Thick traces represent high-frequency, high-current paths.
Lead lengths should be minimized and power and IC grounds should be separated to avoid high-frequency
noise problems.
MPFC
RPFC
DPFC
CBUS
RBUS
RVDC
CVDC
VBUS
1
CPH
CPH
2
RT
DCOMP
RPH
CCOMP
RZX
RPH
COMP
PFC
3
4
CT
5
6
ZX
7
8
RT
CT
HO
16
IRS2166D
VS
15
VB
14
VCC
13
CVCC1
COM
12
LO
11
CS
10
SD/EOL
9
IC BALLAST
CCS
CBOOT
DSD
CSD1
CVCC2
CSD2
RH
O
RL
O
RLIM
RSUPPLY
MHS
CSNUB
DCP2
ML
S
RPU
RSD
RCS
DCP1
LRES
CEOL
CDC
RDC
REOL1
REOL2
REOL3
REOL4
CRES
www.irf.com Page 1
IRS2166D(S)PbF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High-side floating supply voltage -0.3 625
VS High-side floating supply offset voltage VB – 25 VB + 0.3
mA
mA
ºC/W
CLAMP
V
V
W
ºC
V
VHO High-side floating output voltage VS - 0.3 VB + 0.3
VLO Low-side output voltage -0.3 VCC + 0.3
V
PFC gate driver output voltage -0.3 VCC + 0.3
PFC
I
O,MAX
V
V
Maximum allowable output current (HO, LO, PFC) due to external
power transistor miller effect
VBUS pin voltage -0.3 VCC + 0.3
BUS
CPH pin voltage -0.3 VCC + 0.3
CPH
-500 500 mA
VRT RT pin voltage -0.3 VCC + 0.3
V
RPH pin voltage -0.3 VCC + 0.3
RPH
IRT RT pin current -5 5
I
RPH pin current -5 5
RPH
VCT CT pin voltage -0.3 VCC + 0.3 V
I
COM pin current -5 5
COMP
IZX ZX pin current -5 5
ICC VCC pin current (see Note 1) -25 25
V
SD/EOL pin voltage -0.3 VCC + 0.3 V
SD/EOL
I
SD/EOL pin current -5 5 mA
SD/EOL
VCS CS pin voltage -0.3 VCC + 0.3 V
ICS CS pin current -5 5 mA
dV/dt Allowable VS offset voltage slew rate -50 50 V/ns
PD
R
Package power dissipation @ T
)/R
PD = (T
JMAX-TA
Thermal resistance, junction to ambient
ΘJA
θJA
≤ +25 ºC
A
(16-Pin DIP) --- 1.8
(16-Pin SOIC) --- 1.4
(16-Pin DIP) --- 70
(16-Pin SOIC) --- 82
TJ Junction temperature -55 150
TS Storage temperature -55 150
TL Lead temperature (soldering, 10 seconds) --- 300
Note 1: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown
voltage of 15.6 V. This supply pin should not be driven by a DC, low impedance power source greater than the V
specified in the electrical characteristics section.
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol Definition Min. Max. Units
VB-VS High side floating supply voltage V
VS Steady state high-side floating supply offset voltage -1 600
VCC Supply voltage V
ICC V
supply current (see Note 2) Note 2 20 mA
CC
CT CT pin capacitance 220 --- pF
I
SD/EOL pin current
SD/EOL
ICS CS pin current
IZX ZX pin current
TJ Junction temperature -25 125 ºC
Note 2: Enough current should be supplied into the VCC pin to keep the internal 15.6 V zener clamp diode on this pin
regulating its voltage, V
CLAMP
.
V
BSUV+
V
CCUV+
CLAMP
CLAMP
-1 1 mA
www.irf.com Page 2
IRS2166D(S)PbF
Electrical Characteristics
VCC = VBS = V
1000 pF, C
Symbol Definition Min Typ Max UnitsTest Conditions
Supply Characteristics
V
CCUV+
V
CCUV-
V
UVHYS
I
UVLO mode VCC quiescent current --- 250 500 µA VCC = 8 V, CT = COM
QCCUV
I
Quiescent VCC supply current --- 4.3 5.1 mA CT = COM
QCC
I
QCCFLT
I
VCC current at RUN frequency --- 5.0 --- mA
CC,RUN
V
CLAMP
Floating Supply Characteristics
I
Quiescent VBS supply current --- 30 70 VHO = VS
QBS0
I
Quiescent VBS supply current --- 50 90
QBS1
V
BSUV+
V
BSUV-
I
VS offset supply leakage current --- --- 50 µA VB = VS = HO = 600 V
LKVS
PFC Error Amplifier Characteristics
I
COMP,SOURCE
I
COMP,SINK
V
COMPOH
V
COMPOL
PFC Control Characteristics
V
VBUSREG
V
VBUSOV+
V
VBUSOV-
VZX
=14 V +/- 0.25 V, V
BIAS
= 470 pF, TA =25 °C unless otherwise specified. See state diagram for MODE.