IOR IRF9230 User Manual
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IRF9230
REPETITIVE A V ALANCHE AND dv/dt RA TED JANTX2N6806
HEXFETTRANSISTORS
THRU-HOLE (TO-204AA/AE)
Product Summary
Part Number BVDSS RDS(on) ID
IRF9230 -200V 0.80 Ω -6.5A
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well established advantages of MOSFETs such as voltage control,
very fast switching, ease of parelleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
200V, P-CHANNEL
[REF:MIL-PRF-19500/562]
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling
JANTXV2N6806
TO-3
PD - 90548C
Absolute Maximum Ratings
Parameter Units
ID @ VGS = 0V, TC = 25°C Continuous Drain Current -6.5
ID @ VGS = 0V, TC = 100°C Continuous Drain Current -4.0
I
DM
PD @ TC = 25°C Max. Power Dissipation 7 5 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt ➂ -5.0
T
J
T
STG
For footnotes refer to the last page
Pulsed Drain Current ➀ -28
Linear Derating Factor 0.60 W/°C
Gate-to-Source Voltage ±20 V
Single Pulse Avalanche Energy ➁ 66 mJ
Avalanche Current ➀ -6.5 A
Repetitive Avalanche Energy ➀ 7.5 mJ
Operating Junction -55 to 150
Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 11.5 (typical) g
www.irf.com 1
A
V/ns
o
C
01/22/01
IRF9230
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
t
BV
∆BV
R
V
g
I
DSS
I
GSS
I
GSS
Q
Q
Q
t
d(on)
t
r
t
d(off)
f
L
C
C
C
DSS
DSS
DS(on)
GS(th)
fs
g
gs
gd
S + LD
iss
oss
rss
Drain-to-Source Breakdown Voltage -200 — — V VGS = 0V, ID = -1.0mA
/∆TJTemperature Coefficient of Breakdown — -0.20 — V/°C Reference to 25°C, ID = -1.0mA
Voltage
Static Drain-to-Source On-State — — 0.80 VGS =-10V, ID =-4.0A➃
Resistance — — 0.92 VGS =-10V, ID =-6.5A ➃
Gate Threshold Voltage -2.0 — -4.0 V VDS = VGS, ID =-250µA
Forward Transconductance 2.0 — — S ( ) VDS >-15V, IDS =-4.0A➃
Zero Gate Voltage Drain Current — — -2 5 VDS=-160V, VGS=0V
— — -250 VDS =-160V
VGS = 0V, TJ = 125°C
Gate-to-Source Leakage Forward — — -100 VGS =-20V
Gate-to-Source Leakage Reverse — — 1 00 VGS =-20V
Total Gate Charge — — 3 1 VGS =-10V, ID=-6.5A
Gate-to-Source Charge — — 7 .0 n C VDS =-100V
Gate-to-Drain (‘Miller’) Charge — — 1 7
Turn-On Delay Time — — 50 VDD =-100V, ID =-6.5A,
Rise Time — — 1 00 RG =7.5Ω
Turn-Off Delay Time — — 1 00
Fall Time — — 80
Total Inductance — 6. 1 —
Input Capacitance — 700 VGS = 0V, VDS =25V
Output Capacitance — 20 0 — pF f = 1.0MHz
Reverse Transfer Capacitance — 40 —
Ω
Ω
µA
nA
ns
nH
Measured from the center of
drain pad to center of source
pad
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
I
Continuous Source Current (Body Diode) — — -6.5
S
I
Pulse Source Current (Body Diode) ➀ — — -28
SM
V
Diode Forward Voltage — — -6.0 V Tj = 25°C, IS =-6.5A, VGS = 0V ➃
SD
t
Reverse Recovery Time — — 400 nS Tj = 25°C, IF =-6.5A, di/dt ≤-100A/µs
rr
Q
Reverse Recovery Charge — — 4 .0 µc VDD ≤-50V ➃
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
A
S
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
R
thJC
R
thJA
For footnotes refer to the last page
2 www.irf.com
Junction to Case — — 1.67
Junction-to-Ambient — — 30 Soldered to a 2” square copper-clad board
°C/W
+ LD.
IRF9230
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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