IOR IR2308S User Manual

Data Sheet No. PD60209 revC

IR2308

(S) & (PbF)

HALF-BRIDGE DRIVER

Features

Floating channel designed for bootstrap operation

•

Fully operational to +600V
Tolerant to negative transient voltage
dV/dt immune
Gate drive supply range from 10 to 20V

•

Undervoltage lockout for both channels

•

3.3V, 5V and 15V input logic compatible

•

Cross-conduction prevention logic

•

Matched propagation delay for both channels

•

Outputs in phase with inputs

•

Logic and power ground +/- 5V offset.

•

Internal 540ns dead-time

•

Lower di/dt gate driver for better noise immunity

•

Also available LEAD_FREE

•

Description

The IR2308(S) are high voltage, high speed power
MOSFET and IGBT drivers with dependent high and
low side referenced output channels. Proprietary HVIC
and latch immune CMOS technologies enable rug­gedized monolithic construction. The logic input is
compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse
current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to drive an
N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.

Packages

8-Lead SOIC - IR2308S

Also available

LEAD-FREE (PbF)

2106//2108//2109/2304/2308 Feature Comparison

Part

2106

21064

2108

21084

2109 Internal 540ns COM

21094

2304
2308

Input
logic

HIN/LIN no none

HIN/LIN yes

IN/SD yes
HIN/LIN

Cross­conduction
prevention

logic

yes

yesHIN/LIN

Programmable 0.54~5µs

Programmable 0.54~5 µs

Internal 100ns

8-Lead PDIP

IR2308

Dead-Time Ground Pins

Internal 540ns COM

Internal 540ns COM

VSS/COM

VSS/COM

VSS/COM

COM

COM

Typical Connection

up to 600V

V

CC

V

CC

HIN

LIN

(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections
only. Please refer to our Application Notes and DesignT ips for proper circuit board layout.

HIN
LIN

www.irf.com 1

V

HO

V

LOCOM

B

S

TO

LOAD

IR2308(S) & ( PbF)

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param­eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.

Symbol Definition Min. Max. Units

V

B

V

S

V

HO

V

CC

V

LO

V

IN

dVS/dt Allowable offset supply voltage transient — 50 V/ns

P

D

Rth

JA

T

J

T

S

T

L

High side floating absolute voltage -0.3 625
High side floating supply offset voltage VB - 25 VB + 0.3
High side floating output voltage VS - 0.3 V
Low side and logic fixed supply voltage -0.3 25
Low side output voltage -0.3 VCC + 0.3
Logic input voltage (HIN & LIN ) VSS - 0.3 V

Package power dissipation @ TA ≤ +25°C (8 lead PDIP) — 1.0

(8 lead SOIC) — 0.625

Thermal resistance, junction to ambient (8 lead PDIP) — 125

(8 lead SOIC) — 200
Junction temperature — 150
Storage temperature -50 150
Lead temperature (soldering, 10 seconds) — 300

CC

B

+ 0.3

+ 0.3

V

W

°C/W

°C

Recommended Operating Conditions

The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS and VSS offset rating are tested with all supplies biased at 15V differential.

Symbol Definition Min. Max. Units

VB High side floating supply absolute voltage VS + 10 VS + 20
V

S

V

HO

V

CC

V

LO

V

IN

T

A

Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).

2 www.irf.com

High side floating supply offset voltage Note 1 600
High side floating output voltage V
Low side and logic fixed supply voltage 10 20
Low side output voltage 0 V
Logic input voltage COM V
Ambient temperature -40 125

S

V

CC

CC

B

°C

V

IR2308(S) & ( PbF)

Dynamic Electrical Characteristics

V

(VCC, VBS) = 15V, VSS = COM, CL = 1000 pF, TA = 25°C, DT = VSS unless otherwise specified.

BIAS

Symbol Definition Min. Typ. Max. Units Test Conditions

t

on

t

off

MT Delay matching | ton - t

t
t

DT Deadtime: LO turn-off to HO turn-on(DT

MDT Deadtime matching = | DT

Static Electrical Characteristics

V

BIAS

parameters are referenced to VSS/COM and are applicable to the respective input leads: HIN and LIN. The VO, IO and Ron
parameters are referenced to COM and are applicable to the respective output leads: HO and LO.

Symbol Definition Min. T yp. Max. Units T est Conditions

V

V
V
V

I

LK

I

QBS

I

QCC

I

IN+

I

IN-

V

CCUV+

V

BSUV+

V

CCUV-

V

BSUV-

V

CCUVH

V

BSUVH

I

O+

I

Turn-on propagation delay — 220 300 VS = 0V
Turn-off propagation delay — 200 280 VS = 0V or 600V

off

|

Turn-on rise time — 150 220 VS = 0V

r

Turn-off fall time — 50 80 VS = 0V

f

LO-HO) &

HO turn-off to LO turn-on (DT

LO-HO

(VCC, VBS) = 15V, VSS = COM, DT= VSS and TA = 25°C unless otherwise specified. The VIL, VIH and I

IH

IL
OH
OL

O-

Logic “1” input voltage for HIN & LIN 2.9 — — VCC = 10V to 20V
Logic “0” input voltage for HIN & LIN — — 0.8 VCC = 10V to 20V
High level output voltage, V
Low level output voltage, V
Offset supply leakage current — — 50 VB = VS = 600V
Quiescent VBS supply current 20 60 150 V
Quiescent VCC supply current 0.4 1.0 1.6 mA VIN = 0V or 5V
Logic “1” input bias current — 5 20 HIN = 5V, LIN = 5V
Logic “0” input bias current — 1 2 HIN = 0V, LIN = 0V
VCC and VBS supply undervoltage positive going 8.0 8.9 10
threshold
VCC and V
threshold
Hysteresis 0.3 0.7 —

Output high short circuit pulsed current 97 200 — VO = 0V,

Output low short circuit pulsed current 250 350 — VO = 15V,

supply undervoltage negative going 7.4 8.2 9.0

BS

BIAS

O

- V

- DT

O

HO-LO)

HO-LO

—046

400 540 680

—060

|

— 0.8 1.4 IO = 20 mA
— 0.3 0.6 IO = 20 mA

nsec

V

µA

µA

V

mA

IN

PW ≤ 10 µs

PW ≤ 10 µs

IN

= 0V or 5V

www.irf.com 3

IR2308(S) & ( PbF)

Functional Block Diagram

IR2308

HIN

VSS/COM

LEVEL
SHIFT

PULSE

GENERATOR

HV

LEVEL

SHIFTER

PULSE
FILTER

UV

DETECT

VB

R

Q

R
S

HO

VS

LIN

DT

VSS

DEADTIME &

SHOOT-THROUGH

PREVENTION

VSS/COM

LEVEL
SHIFT

DELAY

UV

DETECT

VCC

LO

COM

4 www.irf.com

Lead Definitions

Symbol Description

HIN Logic input for high side gate driver output (HO), in phase
LIN Logic input for low side gate driver output (LO), in phase
V

B

HO High side gate driver output
V

S

V

CC

LO Low side gate driver output
COM Low side return

High side floating supply

High side floating supply return
Low side and logic fixed supply

IR2308(S) & ( PbF)

Lead Assignments

1

V

CC

2

HIN

3

LIN

4

COM

8 Lead PDIP 8 Lead SOIC

V

HO

V
LO

8

B

7
6

S

5

1

V

CC

2

HIN

3

LIN

4

COM

Also available LEAD-FREE(PbF)

IR2308 IR2308S

www.irf.com 5

V

HO

V
LO

8

B

7
6

S

5

IR2308(S) & ( PbF)

LIN

HIN

50%

50%

LIN

HIN

HO

HO

LO

Figure 1. Input/Output Timing Diagram Figure 2. Switching Time Waveform Definitions

LIN

50

HIN

%

LO

50

%

90%

t

on

t

r

t

off

t

f

90% 90%

10% 10%

HO

LO

DT

MDT=

LO-HO

90%

DT

10%

LO-HO

- DT

DT

HO-LO

10%

HO-LO

Figure 3. Deadtime Waveform Definitions

IR WORLD HEADQUARTERS: 233 Kansas Street, El Segundo, California 90245 Tel: [phone]

Data and specifications subject to change without notice. 3/19/2003

6 www.irf.com

Case outlines

IR2308(S) & ( PbF)

A

E

D B

5

87

6

6X

65

H

4312

0.25 [ . 010 ] A

e

e1

A

C

8X b

0.25 [ . 010 ]

NOTES:

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.

2. CONT ROLLING DIMENSION: MILLIMETER

3. D IMENSIONS ARE SHOW N IN MILL IMETERS [INCHES] .

4. OUTLINE CONFORMS TO JEDE C OUT L INE MS-01 2 A A .

A1

CAB

0.10 [ . 004 ]

8-Lead SOIC

8-Lead PDIP

6.46 [. 2 55]

3X 1.27 [. 05 0]

y

01-3003 01

DIM

FOOTPRINT

8X 0.72 [. 02 8]

8X 1.78 [. 07 0]

MIN MAX

.0532

A
A1
b
c .0075 .0098 0.19 0.25
D
E
e

e1

H
K
L
y

.0688

.0040

.0098
.020

.013

.1968

.189

.1574

.1497
.050 BASIC
.025 BASIC 0.635 BASIC
.2284

.2440

.0099

.0196

.016

.050

0°

K x 4 5°

8X L

8X c

7

5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NO T TO EXCEED 0.15 [.006].

6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NO T TO EXCEED 0.25 [.010].

7 DIMENSION IS THE LENGT H OF L EAD FOR SOLD ERING T O
A SUBSTRATE.

01-0021 11

8°

01-6014

(MS-001AB)

MILLIMETERSINC H E S

MIN MAX

1.35

1.75

0.10

0.25

0.33

0.51

4.80

5.00

3.80

4.00

1.27 BASIC

5.80

6.20

0.25

0.50

0.40

1.27

0°

8°

01-6027

(MS-012AA)

www.irf.com 7

IR2308(S) & ( PbF)

LEADFREE PART MARKING INFORMATION

Part number

Date code

Pin 1
Identifier

?

MARKING CODE

P

Lead Free Released
Non-Lead Free

Released

IRxxxxxx

YWW?

ORDER INFORMATION

Basic Part (Non-Lead Free)

8-Lead PDIP IR2308 order IR2308
8-Lead SOIC IR2308S order IR2308S

IR logo

?XXXX

Lot Code

(Prod mode - 4 digit SPN code)

Assembly site code
Per SCOP 200-002

Leadfree Part

8-Lead PDIP R2308 not available
8-Lead SOIC IR2308S order IR2308SPbF

Thisproduct has been designed and qualified for the industrial market.

Qualification Standards can be found on IR’s Web Site http://www.irf.com

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: [phone]

8 www.irf.com

Data and specifications subject to change without notice.

6/15/2004