IOR IR2122 S User Manual

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Preliminary Data Sheet No. PD60130-J
CURRENT SENSING SINGLE CHANNEL DRIVER
Features
Floating channel designed for bootstrap operation
Fully operational to +600V T olerant to negative transient v oltage dV/dt immune
Gate drive supply range from 10 to 20V
Undervoltage lockout
3.3V , 5V and 15V input logic compatib le
FAULT
Output out of phase with input
Description
The IR2122(S) is a high voltage, high speed power MOSFET and IGBT driver. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is compatible with standard CMOS or LSTTL outputs, down to
3.3V. The protection circuity detects over-current in the driven power transistor and terminates the gate drive voltage. An open drain vided to indicate that an over-current shutdown has occurred. The output driver features a high pulse current buffer stage designed for minimum cross-con­duction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side or low side configuration which operates up to 600 volts.
lead indicates shutdown has occured
FAULT
signal is pro-
Product Summary
V
OFFSET
+/- 110 mA / 110 mA
O
V
OUT
V
CSth
t
(typ.) 250 & 200 ns
on/off
Packages
8-Lead PDIP
IR2122(S
600V max.
10 - 20V
500 mV
8-Lead SOIC
)
Typical Connection
V
CC
IN
FAULT
www.irf.com 1
V
CC
IN FAULT COM
V
B
HO
CS
V
S
(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
IR2122(S)
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param­eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
V
FLT
V
CS
dVs/dt Allowable Offset Supply Voltage Transient 50 V/ns
P
D
R
THJA
T
J
T
S
T
L
High Side Floating Supply Voltage -0.3 625 High Side Floating Offset Voltage VB - 25 VB + 0.3 High Side Floating Output Voltage VS - 0.3 V
B
+ 0.3 Logic Supply Voltage -0.3 25 V Logic Input Voltage -0.3 V
Output Voltage -0.3 V
FAULT
Current Sense Voltage VS - 0.3 V
CC CC
B
+ 0.3
+ 0.3
+ 0.3
Package Power Dissipation @ TA +25°C (8 Lead DIP) 1.0
(8 Lead SOIC) 0.625
Thermal Resistance, Junction to Ambient (8 Lead DIP) 125
(8 Lead SOIC) 200
°C/W
Junction Temperature 150 Storage Temperature -55 150
°C
Lead Temperature (Soldering, 10 seconds) 300
W
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
V
FLT
V
CS
T
A
Note 1: Logic operational f or VS of -5 to +600V. Logic state held f or VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details).
2 www.irf.com
High Side Floating Supply Voltage VS + 13 VS + 20 High Side Floating Offset Voltage Note 1 600 High Side Floating Output Voltage V
S
V
B
Logic Supply Voltage 13 20 V Logic Input Voltage 0 V
Output Voltage 0 V
FAULT
Current Sense Signal Voltage V
S
CC
CC
V
+ 5
S
Ambient Temperature -40 150 °C
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