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Data Sheet No. PD60193
IR21093
(S)
HALF-BRIDGE DRIVER
Features
Floating channel designed for bootstrap operation
•
Fully operational to +600V
Tolerant to negative transient voltage
dV/dt immune
Gate drive supply range from 10 to 20V
•
Undervoltage lockout for both channels
•
3.3V, 5V and 15V input logic compatible
•
Cross-conduction prevention logic
•
Matched propagation delay for both channels
•
High side output in phase with IN input
•
Logic and power ground +/- 5V offset
•
Internal 540ns dead-time
•
Lower di/dt gate driver for better noise immunity
•
Description
The IR21093(S) are high voltage, high speed power
MOSFET and IGBT drivers with dependent high and
low side referenced output channels. Proprietary HVIC
and latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is
compatible with standard CMOS or LSTTL output,
down to 3.3V logic. The output drivers feature a high
pulse current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to
drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.
Product Summary
V
OFFSET
IO+/- 120 mA / 250 mA
V
OUT
t
(typ.) 750 & 200 ns
on/off
Dead Time 540 ns
600V max.
Packages
8-Lead PDIP
10 - 20V
8-Lead SOIC
Typical Connection
up to 600V
V
CC
V
CC
IN
(Refer to Lead Assignments for correct configuration). This/These diagr am(s) show electrical connections only. Please ref er to our
Application Notes and DesignTips for proper circuit board layout.
www.irf.com 1
IN
COM
LO
V
HO
V
B
TO
S
IR21093
LOAD
)
(
IR21093
S
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
LO
V
IN
dVS/dt Allowable offset supply voltage transient — 50 V/ns
P
D
Rth
JA
T
J
T
S
T
L
High side floating absolute voltage -0.3 625
High side floating supply offset voltage VB - 25 VB + 0.3
High side floating output voltage VS - 0.3 V
Low side and logic fixed supply voltage -0.3 25
Low side output voltage -0.3 VCC + 0.3
Logic input voltage VSS - 0.3 V
Package power dissipation @ TA ≤ +25°C (8 Lead PDIP) — 1.0
(8 Lead SOIC) — 0.625
Thermal resistance, junction to ambient (8 Lead PDIP) — 125
(8 Lead SOIC) — 200
Junction temperature — 150
Storage temperature -50 150
Lead temperature (soldering, 10 seconds) — 300
CC
B
+ 0.3
+ 0.3
W
°C/W
°C
V
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol Definition Min. Max. Units
VB High side floating supply absolute voltage VS + 10 VS + 20
V
S
V
HO
V
CC
V
LO
V
IN
T
A
Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).
2 www.irf.com
High side floating supply offset voltage Note 1 600
High side floating output voltage V
Low side and logic fixed supply voltage 10 20
Low side output voltage 0 V
Logic input voltage V
Ambient temperature -40 125 °C
S
SS
V
B
CC
V
CC
V