InvenSense MPU-6000, MPU-6050 User Manual

InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
Release Date: 08/19/2013
MPU-6000 and MPU-6050
Product Specification
Revision 3.4
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MPU-6000/MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00 Revision: 3.4 Release Date: 08/19/2013
CONTENTS
1 REVISION HISTORY ................................................................................................................................... 5
2 PURPOSE AND SCOPE ............................................................................................................................. 6
3 PRODUCT OVERVIEW ............................................................................................................................... 7
3.1 MPU-60X0 OVERVIEW ........................................................................................................................ 7
4 APPLICATIONS ........................................................................................................................................... 9
5 FEATURES ................................................................................................................................................ 10
5.1 GYROSCOPE FEATURES ..................................................................................................................... 10
5.2 ACCELEROMETER FEATURES ............................................................................................................. 10
5.3 ADDITIONAL FEATURES ...................................................................................................................... 10
5.4 MOTIONPROCESSING ......................................................................................................................... 11
5.5 CLOCKING ......................................................................................................................................... 11
6 ELECTRICAL CHARACTERISTICS ......................................................................................................... 12
6.1 GYROSCOPE SPECIFICATIONS ............................................................................................................ 12
6.2 ACCELEROMETER SPECIFICATIONS ..................................................................................................... 13
6.3 ELECTRICAL AND OTHER COMMON SPECIFICATIONS ............................................................................ 14
6.4 ELECTRICAL SPECIFICATIONS, CONTINUED ......................................................................................... 15
6.5 ELECTRICAL SPECIFICATIONS, CONTINUED ......................................................................................... 16
6.6 ELECTRICAL SPECIFICATIONS, CONTINUED ......................................................................................... 17
6.7 I2C TIMING CHARACTERIZATION.......................................................................................................... 18
6.8 SPI TIMING CHARACTERIZATION (MPU-6000 ONLY) ........................................................................... 19
6.9 ABSOLUTE MAXIMUM RATINGS ........................................................................................................... 20
7 APPLICATIONS INFORMATION .............................................................................................................. 21
7.1 PIN OUT AND SIGNAL DESCRIPTION .................................................................................................... 21
7.2 TYPICAL OPERATING CIRCUIT ............................................................................................................. 22
7.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS .............................................................................. 22
7.4 RECOMMENDED POWER-ON PROCEDURE ........................................................................................... 23
7.5 BLOCK DIAGRAM ............................................................................................................................... 24
7.6 OVERVIEW ........................................................................................................................................ 24
7.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................ 25
7.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................ 25
7.9 DIGITAL MOTION PROCESSOR ............................................................................................................ 25
7.10 PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................ 25
7.11 AUXILIARY I2C SERIAL INTERFACE ...................................................................................................... 26
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7.12 SELF-TEST ........................................................................................................................................ 27
7.13 MPU-60X0 SOLUTION FOR 9-AXIS SENSOR FUSION USING I2C INTERFACE .......................................... 28
7.14 MPU-6000 USING SPI INTERFACE ..................................................................................................... 29
7.15 INTERNAL CLOCK GENERATION .......................................................................................................... 30
7.16 SENSOR DATA REGISTERS ................................................................................................................. 30
7.17 FIFO ................................................................................................................................................ 30
7.18 INTERRUPTS ...................................................................................................................................... 30
7.19 DIGITAL-OUTPUT TEMPERATURE SENSOR .......................................................................................... 31
7.20 BIAS AND LDO .................................................................................................................................. 31
7.21 CHARGE PUMP .................................................................................................................................. 31
8 PROGRAMMABLE INTERRUPTS ............................................................................................................ 32
9 DIGITAL INTERFACE ............................................................................................................................... 33
9.1 I2C AND SPI (MPU-6000 ONLY) SERIAL INTERFACES .......................................................................... 33
9.2 I2C INTERFACE .................................................................................................................................. 33
9.3 I2C COMMUNICATIONS PROTOCOL ...................................................................................................... 33
9.4 I2C TERMS ........................................................................................................................................ 36
9.5 SPI INTERFACE (MPU-6000 ONLY) .................................................................................................... 37
10 SERIAL INTERFACE CONSIDERATIONS (MPU-6050) .......................................................................... 38
10.1 MPU-6050 SUPPORTED INTERFACES ................................................................................................. 38
10.2 LOGIC LEVELS ................................................................................................................................... 38
10.3 LOGIC LEVELS DIAGRAM FOR AUX_VDDIO = 0 .................................................................................. 39
11 ASSEMBLY ............................................................................................................................................... 40
11.1 ORIENTATION OF AXES ...................................................................................................................... 40
11.2 PACKAGE DIMENSIONS ...................................................................................................................... 41
11.3 PCB DESIGN GUIDELINES .................................................................................................................. 42
11.4 ASSEMBLY PRECAUTIONS .................................................................................................................. 43
11.5 STORAGE SPECIFICATIONS ................................................................................................................. 46
11.6 PACKAGE MARKING SPECIFICATION .................................................................................................... 46
11.7 TAPE & REEL SPECIFICATION ............................................................................................................. 47
11.8 LABEL ............................................................................................................................................... 48
11.9 PACKAGING ....................................................................................................................................... 49
11.10 REPRESENTATIVE SHIPPING CARTON LABEL ................................................................................... 50
12 RELIABILITY ............................................................................................................................................. 51
12.1 QUALIFICATION TEST POLICY ............................................................................................................. 51
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MPU-6000/MPU-6050 Product Specification
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12.2 QUALIFICATION TEST PLAN ................................................................................................................ 51
13 ENVIRONMENTAL COMPLIANCE ........................................................................................................... 52
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MPU-6000/MPU-6050 Product Specification
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Revision Date
Revision
Description
11/24/2010
1.0
Initial Release
05/19/2011
2.0
For Rev C parts. Clarified wording in sections (3.2, 5.1, 5.2, 6.1-6.4, 6.6, 6.9, 7,
7.1-7.6, 7.11, 7.12, 7.14, 8, 8.2-8.4, 10.3, 10.4, 11, 12.2)
07/28/2011
2.1
Edited supply current numbers for different modes (section 6.4)
08/05/2011
2.2
Unit of measure for accelerometer sensitivity changed from LSB/mg to LSB/g
10/12/2011
2.3
Updated accelerometer self test specifications in Table 6.2. Updated package dimensions (section 11.2). Updated PCB design guidelines (section 11.3)
10/18/2011
3.0
For Rev D parts. Updated accelerometer specifications in Table 6.2. Updated accelerometer specification note (sections 8.2, 8.3, & 8.4). Updated qualification test plan (section 12.2).
10/24/2011
3.1
Edits for clarity Changed operating voltage range to 2.375V-3.46V Added accelerometer Intelligence Function increment value of 1mg/LSB
(Section 6.2) Updated absolute maximum rating for acceleration (any axis, unpowered) from
0.3ms to 0.2ms (Section 6.9) Modified absolute maximum rating for Latch-up to Level A and ±100mA (Section
6.9, 12.2)
11/16/2011
3.2
Updated self-test response specifications for Revision D parts dated with date code 1147 (YYWW) or later.
Edits for clarity Added Gyro self-test (sections 5.1, 6.1, 7.6, 7.12) Added Min/Max limits to Accel self-test response (section 6.2) Updated Accelerometer low power mode operating currents (Section 6.3) Added gyro self test to block diagram (section 7.5) Updated packaging labels and descriptions (sections 11.8 & 11.9)
5/16/2012
3.3
Updated Gyro and Accelerometer self test information (sections 6.1, 6.2, 7.12) Updated latch-up information (Section 6.9) Updated programmable interrupts information (Section 8) Changed shipment information from maximum of 3 reels (15K units) per shipper
box to 5 reels (25K units) per shipper box (Section 11.7) Updated packing shipping and label information (Sections 11.8, 11.9) Updated reliability references (Section 12.2)
8/19/2013
3.4
Updates section 4
1 Revision History
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MPU-6000/MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00 Revision: 3.4 Release Date: 08/19/2013
2 Purpose and Scope
This product specification provides advanced information regarding the electrical specification and design related information for the MPU-6000 and MPU-6050 MotionTracking™ devices, collectively called the MPU-60X0 or MPU.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are subject to change without notice. Final specifications will be updated based upon characterization of production silicon. For references to register map and descriptions of individual registers, please refer to the MPU-6000/MPU-6050 Register Map and Register Descriptions document.
The self-test response specifications provided in this document pertain to Revision D parts with date codes of 1147 (YYWW) or later. Please see Section 11.6 for package marking description details.
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3 Product Overview
3.1 MPU-60X0 Overview
MotionInterface™ is becoming a “must-have” function being adopted by smartphone and tablet manufacturers due to the enormous value it adds to the end user experience. In smartphones, it finds use in applications such as gesture commands for applications and phone control, enhanced gaming, augmented reality, panoramic photo capture and viewing, and pedestrian and vehicle navigation. With its ability to precisely and accurately track user motions, MotionTracking technology can convert handsets and tablets into powerful 3D intelligent devices that can be used in applications ranging from health and fitness monitoring to location-based services. Key requirements for MotionInterface enabled devices are small package size, low power consumption, high accuracy and repeatability, high shock tolerance, and application specific performance programmability – all at a low consumer price point.
The MPU-60X0 is the world’s first integrated 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMP) all in a small 4x4x0.9mm package. With its dedicated I2C sensor bus, it directly accepts inputs from an external 3-axis compass to provide a complete 9-axis MotionFusionoutput. The MPU-60X0 MotionTracking device, with its 6-axis integration, on-board MotionFusion™, and run-time calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. The MPU-60X0 is also designed to interface with multiple non­inertial digital sensors, such as pressure sensors, on its auxiliary I2C port. The MPU-60X0 is footprint compatible with the MPU-30X0 family.
The MPU-60X0 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs and three 16-bit ADCs for digitizing the accelerometer outputs. For precision tracking of both fast and slow motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps) and a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g.
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all the necessary on-chip processing and sensor components required to support many motion-based use cases, the MPU-60X0 uniquely enables low-power MotionInterface applications in portable applications with reduced processing requirements for the system processor. By providing an integrated MotionFusion output, the DMP in the MPU-60X0 offloads the intensive MotionProcessing computation requirements from the system processor, minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz (MPU-6000 only). For applications requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz (MPU-6000 only). Additional features include an embedded temperature sensor and an on-chip oscillator with ±1% variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-60X0 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass filters for the gyroscopes, accelerometers, and the on-chip temperature sensor.
For power supply flexibility, the MPU-60X0 operates from VDD power supply voltage range of 2.375V-3.46V. Additionally, the MPU-6050 provides a VLOGIC reference pin (in addition to its analog supply pin: VDD), which sets the logic levels of its I2C interface. The VLOGIC voltage may be 1.8V±5% or VDD.
The MPU-6000 and MPU-6050 are identical, except that the MPU-6050 supports the I2C serial interface only, and has a separate VLOGIC reference pin. The MPU-6000 supports both I2C and SPI interfaces and has a single supply pin, VDD, which is both the device’s logic reference supply and the analog supply for the part. The table below outlines these differences:
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MPU-6000/MPU-6050 Product Specification
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Part / Item
MPU-6000
MPU-6050
VDD
2.375V-3.46V
2.375V-3.46V
VLOGIC
n/a
1.71V to VDD
Serial Interfaces Supported
I2C, SPI
I2C
Pin 8
/CS
VLOGIC
Pin 9
AD0/SDO
AD0
Pin 23
SCL/SCLK
SCL
Pin 24
SDA/SDI
SDA
Primary Differences between MPU-6000 and MPU-6050
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4 Applications
BlurFree™ technology (for Video/Still Image Stabilization)  AirSign™ technology (for Security/Authentication) TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)  MotionCommand™ technology (for Gesture Short-cuts)  Motion-enabled game and application framework  InstantGesture iG gesture recognition  Location based services, points of interest, and dead reckoning  Handset and portable gaming  Motion-based game controllers  3D remote controls for Internet connected DTVs and set top boxes, 3D mice  Wearable sensors for health, fitness and sports  Toys
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5 Features
5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-60X0 includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization  Integrated 16-bit ADCs enable simultaneous sampling of gyros  Enhanced bias and sensitivity temperature stability reduces the need for user calibration  Improved low-frequency noise performance  Digitally-programmable low-pass filter  Gyroscope operating current: 3.6mA  Standby current: 5µA  Factory calibrated sensitivity scale factor  User self-test
5.2 Accelerometer Features
The triple-axis MEMS accelerometer in MPU-60X0 includes a wide range of features:
Digital-output triple-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and
±16g
Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external
multiplexer
Accelerometer normal operating current: 500µA  Low power accelerometer mode current: 10µA at 1.25Hz, 20µA at 5Hz, 60µA at 20Hz, 110µA at
40Hz
Orientation detection and signaling  Tap detection  User-programmable interrupts  High-G interrupt  User self-test
5.3 Additional Features
The MPU-60X0 includes the following additional features:
9-Axis MotionFusion by the on-chip Digital Motion Processor (DMP)  Auxiliary master I2C bus for reading data from external sensors (e.g., magnetometer)  3.9mA operating current when all 6 motion sensing axes and the DMP are enabled  VDD supply voltage range of 2.375V-3.46V  Flexible VLOGIC reference voltage supports multiple I2C interface voltages (MPU-6050 only)  Smallest and thinnest QFN package for portable devices: 4x4x0.9mm  Minimal cross-axis sensitivity between the accelerometer and gyroscope axes  1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data in
bursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor  User-programmable digital filters for gyroscope, accelerometer, and temp sensor  10,000 g shock tolerant  400kHz Fast Mode I2C for communicating with all registers  1MHz SPI serial interface for communicating with all registers (MPU-6000 only)  20MHz SPI serial interface for reading sensor and interrupt registers (MPU-6000 only)
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MEMS structure hermetically sealed and bonded at wafer level  RoHS and Green compliant
5.4 MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesture
recognition algorithms
The MPU-60X0 collects gyroscope and accelerometer data while synchronizing data sampling at a
user defined rate. The total dataset obtained by the MPU-60X0 includes 3-Axis gyroscope data, 3­Axis accelerometer data, and temperature data. The MPU’s calculated output to the system processor can also include heading data from a digital 3-axis third party magnetometer.
The FIFO buffers the complete data set, reducing timing requirements on the system processor by
allowing the processor burst read the FIFO data. After burst reading the FIFO data, the system processor can save power by entering a low-power sleep mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,
tap detection, and shake detection
Digitally-programmable low-pass filters  Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
5.5 Clocking
On-chip timing generator ±1% frequency variation over full temperature range  Optional external clock inputs of 32.768kHz or 19.2MHz
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MPU-6000/MPU-6050 Product Specification
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PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range
FS_SEL=0
±250 º/s
FS_SEL=1
±500 º/s
FS_SEL=2
±1000 º/s
FS_SEL=3
±2000 º/s
Gyroscope ADC Word Length
16 bits
Sensitivity Scale Factor
FS_SEL=0
131
LSB/(º/s)
FS_SEL=1
65.5
LSB/(º/s)
FS_SEL=2
32.8
LSB/(º/s)
FS_SEL=3
16.4
LSB/(º/s)
Sensitivity Scale Factor Tolerance
25°C
-3 +3 %
Sensitivity Scale Factor Variation Over Temperature
±2 % Nonlinearity
Best fit straight line; 25°C
0.2 %
Cross-Axis Sensitivity
±2 %
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C ±20 º/s
ZRO Variation Over Temperature
-40°C to +85°C
±20 º/s
Power-Supply Sensitivity (1-10Hz)
Sine wave, 100mVpp; VDD=2.5V
0.2 º/s
Power-Supply Sensitivity (10 - 250Hz)
Sine wave, 100mVpp; VDD=2.5V
0.2 º/s
Power-Supply Sensitivity (250Hz - 100kHz)
Sine wave, 100mVpp; VDD=2.5V
4
º/s
Linear Acceleration Sensitivity
Static 0.1 º/s/g
SELF-TEST RESPONSE
Relative
Change from factory trim
-14
14 % 1
GYROSCOPE NOISE PERFORMANCE
FS_SEL=0
Total RMS Noise
DLPFCFG=2 (100Hz)
0.05
º/s-rms
Low-frequency RMS noise
Bandwidth 1Hz to10Hz
0.033
º/s-rms
Rate Noise Spectral Density
At 10Hz
0.005
º/s/Hz
GYROSCOPE MECHANICAL FREQUENCIES
X-Axis 30
33
36
kHz
Y-Axis 27
30
33
kHz
Z-Axis 24
27
30
kHz
LOW PASS FILTER RESPONSE
Programmable Range
5 256
Hz
OUTPUT DATA RATE
Programmable
4 8,000
Hz
GYROSCOPE START-UP TIME
DLPFCFG=0
ZRO Settling (from power-on)
to ±1º/s of Final
30 ms
6 Electrical Characteristics
6.1 Gyroscope Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
1. Please refer to the following document for further information on Self-Test: MPU-6000/MPU-6050 Register Map and Descriptions
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PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
ACCELEROMETER SENSITIVITY
Full-Scale Range
AFS_SEL=0
±2 g
AFS_SEL=1
±4 g
AFS_SEL=2
±8 g
AFS_SEL=3
±16
g
ADC Word Length
Output in two’s complement format
16 bits Sensitivity Scale Factor
AFS_SEL=0
16,384
LSB/g
AFS_SEL=1
8,192
LSB/g
AFS_SEL=2
4,096
LSB/g
AFS_SEL=3
2,048
LSB/g
Initial Calibration Tolerance
±3 %
Sensitivity Change vs. Temperature
AFS_SEL=0, -40°C to +85°C
±0.02
%/°C
Nonlinearity
Best Fit Straight Line
0.5
%
Cross-Axis Sensitivity
±2 % ZERO-G OUTPUT
Initial Calibration Tolerance
X and Y axes
±50
mg
1
Z axis ±80
mg
Zero-G Level Change vs. Temperature
X and Y axes, 0°C to +70°C
±35
Z axis, 0°C to +70°C
±60
mg
SELF TEST RESPONSE
Relative
Change from factory trim
-14 14 % 2
NOISE PERFORMANCE
Power Spectral Density
@10Hz, AFS_SEL=0 & ODR=1kHz
400
g/Hz
LOW PASS FILTER RESPONSE
Programmable Range
5 260
Hz
OUTPUT DATA RATE
Programmable Range
4 1,000
Hz
INTELLIGENCE FUNCTION INCREMENT
32 mg/LSB
6.2 Accelerometer Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
1. Typical zero-g initial calibration tolerance value after MSL3 preconditioning
2. Please refer to the following document for further information on Self-Test: MPU-6000/MPU-6050 Register Map and Descriptions
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MPU-6000/MPU-6050 Product Specification
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PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
TEMPERATURE SENSOR
Range
-40 to +85
°C
Sensitivity
Untrimmed
340
LSB/ºC
Temperature Offset
35oC -521
LSB
Linearity
Best fit straight line (-40°C to +85°C)
±1 °C
VDD POWER SUPPLY
Operating Voltages
2.375
3.46
V
Normal Operating Current
Gyroscope + Accelerometer + DMP
3.9 mA
Gyroscope + Accelerometer (DMP disabled)
3.8 mA
Gyroscope + DMP (Accelerometer disabled)
3.7 mA
Gyroscope only (DMP & Accelerometer disabled)
3.6 mA
Accelerometer only (DMP & Gyroscope disabled)
500 µA
Accelerometer Low Power Mode Current
1.25 Hz update rate
10 µA
5 Hz update rate
20 µA
20 Hz update rate
70 µA
40 Hz update rate
140 µA
Full-Chip Idle Mode Supply Current
5 µA
Power Supply Ramp Rate
Monotonic ramp. Ramp rate is 10% to 90% of the final value
100
ms
VLOGIC REFERENCE VOLTAGE
MPU-6050 only
Voltage Range
VLOGIC must be VDD at all times
1.71
VDD
V
Power Supply Ramp Rate
Monotonic ramp. Ramp rate is 10% to 90% of the final value
3 ms
Normal Operating Current
100 µA
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable beyond Specified Temperature Range
-40 +85
°C
6.3 Electrical and Other Common Specifications
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
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PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
SPI Operating Frequency, All Registers Read/Write
MPU-6000 only, Low Speed Characterization
100 ±10%
kHz
MPU-6000 only, High Speed Characterization
1 ±10%
MHz
SPI Operating Frequency, Sensor and Interrupt Registers Read Only
MPU-6000 only
20 ±10%
MHz
I2C Operating Frequency
All registers, Fast-mode
400
kHz
All registers, Standard-mode
100
kHz
I2C ADDRESS
AD0 = 0
1101000
AD0 = 1
1101001
DIGITAL INPUTS (SDI/SDA, AD0, SCLK/SCL, FSYNC, /CS, CLKIN)
VIH, High Level Input Voltage
MPU-6000
0.7*VDD V MPU-6050
0.7*VLOGIC
V
VIL, Low Level Input Voltage
MPU-6000
0.3*VDD
V
MPU-6050
0.3*VLOGIC
V
CI, Input Capacitance
< 5 pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
R
LOAD
=1MΩ; MPU-6000
0.9*VDD
V
R
LOAD
=1MΩ; MPU-6050
0.9*VLOGIC
V
V
OL1
, LOW-Level Output Voltage
R
LOAD
=1MΩ; MPU-6000
0.1*VDD
V
R
LOAD
=1MΩ; MPU-6050
0.1*VLOGIC
V
V
OL.INT1
, INT Low-Level Output
Voltage
OPEN=1, 0.3mA sink Current
0.1 V
Output Leakage Current
OPEN=1
100 nA
t
INT
, INT Pulse Width
LATCH_INT_EN=0
50 µs
6.4 Electrical Specifications, Continued
VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
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Parameters
Conditions
Typical
Units
Notes
Primary I2C I/O (SCL, SDA)
VIL, LOW-Level Input Voltage
MPU-6000
-0.5 to 0.3*VDD
V
VIH, HIGH-Level Input Voltage
MPU-6000
0.7*VDD to VDD + 0.5V
V
V
hys
, Hysteresis
MPU-6000
0.1*VDD
V VIL, LOW Level Input Voltage
MPU-6050
-0.5V to 0.3*VLOGIC
V
VIH, HIGH-Level Input Voltage
MPU-6050
0.7*VLOGIC to VLOGIC + 0.5V
V
Vhys, Hysteresis
MPU-6050
0.1*VLOGIC
V V
OL1
, LOW-Level Output Voltage
3mA sink current
0 to 0.4
V
IOL, LOW-Level Output Current
VOL = 0.4V
3
mA
VOL = 0.6V
5
mA
Output Leakage Current
100
nA
tof, Output Fall Time from V
IHmax
to V
ILmax
Cb bus capacitance in pF
20+0.1Cb to 250
ns
CI, Capacitance for Each I/O pin
< 10
pF
Auxiliary I2C I/O (AUX_CL, AUX_DA)
MPU-6050: AUX_VDDIO=0
VIL, LOW-Level Input Voltage
-0.5V to 0.3*VLOGIC
V
VIH, HIGH-Level Input Voltage
0.7*VLOGIC to
VLOGIC + 0.5V
V
V
hys
, Hysteresis
0.1*VLOGIC
V
V
OL1
, LOW-Level Output Voltage
VLOGIC > 2V; 1mA sink current
0 to 0.4
V
V
OL3
, LOW-Level Output Voltage
VLOGIC < 2V; 1mA sink current
0 to 0.2*VLOGIC
V
IOL, LOW-Level Output Current
VOL = 0.4V VOL = 0.6V 1 1
mA mA
Output Leakage Current
100
nA
tof, Output Fall Time from V
IHmax
to V
ILmax
Cb bus capacitance in pF
20+0.1Cb to 250
ns
CI, Capacitance for Each I/O pin
< 10
pF
6.5 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, VLOGIC (MPU-6050 only) = 1.8V±5% or VDD, TA = 25°C
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