Open-Q™ µ820 (APQ8096) Development Kit
Quick Start Guide
Your use of this document is subject to an d governed by those terms and conditions, https://www.intrinsyc.com/legal-terms/qualcomm-terms.html, in the Intrinsyc Purchase and Software License Agreement for the Open-Q™ micro 820 Development Kit based on the Qualcomm® Snapdrag-
on™ 820 Processor (APQ8096), which you or the legal entity you represent, as the case may be, accepted and agreed to when pur chasing an Open-Q™ micro 820 Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part
of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use o f the Open -Q™ micro 820 Development Kit under the Agr eement. Distribution of this document is strictly prohibited without the express written per mission of Intrinsyc Technolo-
gies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm and Snapdrago n are trademarks of Qualcomm Incorporated, registered in the United States and other countries.
Package Contents
1. IO Expansion header EDU
2. Mini PCI Express socket *
3. Power buon
4. Volume + buon
5. Volume - buon
6. 3 x LEDs
7. WWAN SIM card slot *
8. PCI Express slot
9. Sensors header
10. 12V DC jack
11. USB debug UART Micro B
12. USB 3.0 Expansion connector
13. USB 2.0 OTG Micro AB
14. Dual stacked USB 3.0 type A
15. Baery connector
16. HDMI out
17. General purpose buon
18. Power header
19. ANC 3.5 mm headset jack
20. GPS ext. ant. SMA connector
21. Boot conguraon DIP switches
22. MIPI camera 2 connector
23. Micro SD slot *
24. MIPI camera 1 connector
25. Open-Q µ820 System on Module
(SOM)
26. GPS module WGR7640
27. 32GB UFS
28. 3GB LP-DDR4 RAM Pop memory
on top of Snapdragon APQ8096
processor
29. WLAN module QCA6174
30. MIPI camera 0 connector
31. Audio out header
32. SOM power measurement
header
33. Audio in header
34. Hapcs output header
35. MIPI DSI LCD/touchscreen
connector to interface with
Intrinsyc display adapter
* on boom side
1. Open-Q™ 820 µSOM with APQ8096 processor
2. Carrier board
3. AC Power Adapter
4. 4.5” FWVGA MIPI DSI LCD/touchscreen (addional accessory)
1 4 9 5 8
11
12
14
16
20
22 24
31
3 6
18
13
15
23
17
33
10
21
19
30
35
7
2
27 29
26
25
28
34
32