Intersil RF1S45N06LESM, RFP45N06LE Datasheet

RFP45N06LE, RF1S45N06LESM
Data Sheet October 1999 File Number 4076.2
45A, 60V, 0.028 Ohm, Logic Level N-Channel Power MOSFETs
Formerly developmental type TA49177.
Ordering Information
PART NUMBER PACKAGE BRAND
RFP45N06LE TO-220AB FP45N06L RF1S45N06LESM TO-263AB F45N06LE
NOTE: When ordering,use theentirepart number.Add thesuffix 9Ato obtain theTO-263AB v ariantin tapeandreel i.e.,RF1S45N06LESM9A.
Features
• 45A, 60V
•r
DS(ON)
• Temperature Compensating PSPICE
= 0.028
®
Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
o
C Operating Temperature
• 175
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
D
G
S
Packaging
DRAIN (FLANGE)
JEDEC TO-220AB JEDEC TO-263AB
SOURCE
DRAIN
GATE
GATE
SOURCE
DRAIN
(FLANGE)
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 407-727-9207
| Copyright © Intersil Corporation 1999.
RFP45N06LE, RF1S45N06LESM
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFP45N06LE, RF1S45N06LESM UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DSS
DGR
GS
DM
AS
D
Refer to Peak Current Curve
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
60 V 60 V
±10 V
45
Refer to UIS Curve
142
0.95
-55 to 175
300 260
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V Zero Gate Voltage Drain Current I
DSSID
GS(TH)VGS
DSS
= 250µA, VGS = 0V (Figure 13) 60 - - V
= VDS, ID = 250µA (Figure 12) 1 - 3 V VDS = 55V, VGS = 0V - - 1 µA VDS = 50V, VGS = 0V, TC = 150oC - - 250 µA
Gate to Source Leakage Current I Drain to Source On Resistance (Note 2) r
DS(ON)ID
Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 5V Q Threshold Gate Charge Q
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
GSS
ON
OFF
g(5)
g(TH)
ISS OSS RSS
θJC
θJA
VGS = ±10V - - 10 µA
= 45A, VGS = 5V (Figure 11) - - 0.028
VDD = 30V, ID = 45A, RL = 0.67, VGS = 5V, RGS = 2.5 (Figures 10, 18, 19)
r
- - 215 ns
-20-ns
- 150 - ns
-55-ns
f
-90-ns
- - 185 ns
= 0V to 10V VDD = 48V, VGS = 0V to 5V - 58 75 nC VGS = 0V to 1V - 2.4 3.0 nC
ID = 45A, RL = 1.07 (Figures 20, 21)
VDS = 25V, VGS = 0V, f = 1MHz (Figure 14)
- 107 135 nC
- 2150 - pF
- 640 - pF
- 240 - pF
- - 1.05
TO-220, and TO-263 - - 80
o o
C/W C/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
SD
Diode Reverse Recovery Time t
NOTES:
2. Pulse test: pulse width 80µs, duty cycle 2%.
3. Repetitive rating: pulse width limited by Max junction temperature. See Transient Thermal Impedance curve (Figure 3).
2
ISD = 45A - - 1.5 V ISD = 45A, dISD/dt = 100A/µs - - 155 ns
rr
RFP45N06LE, RF1S45N06LESM
Typical Performance Curves Unless Otherwise Specified
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 175
TC, CASE TEMPERATURE (oC)
125
150
FIGURE 1. NORMALIZED POWER DISSIPATIONvs CASE
TEMPERATURE
2
1
0.5
0.2
0.1
0.1
JC
θ
THERMAL IMPEDANCE
0.01 10
-5
0.05
0.02
0.01 SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
, NORMALIZED
Z
50
40
30
20
, DRAIN CURRENT (A)
D
I
10
0
25 50 75 100 125 150
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENTvs
CASE TEMPERATURE
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t PEAK TJ = PDM x Z
-2
10
-1
10
2
1/t2
x R
JC
θ
0
10
175
+ T
JC
C
θ
1
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
500
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS AREA MAY BE LIMITED BY r
1
1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TC = 25oC
T
= MAX RATED
J
100µs
1ms
10ms
200
500
100
THERMAL IMPEDANCE MAY LIMIT CURRENT IN THIS REGION
, PEAK CURRENT CAPABILITY (A)
DM
I
10
-5
10
VGS = 10V
-4
10
VGS = 5V
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I = I
-3
10
t, PULSE WIDTH (s)
-2
10
o
C DERATE PEAK
175 - T
25
-1
10
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
3
150
TC = 25oC
C
0
10
1
10
Loading...
+ 5 hidden pages