RFP45N06LE, RF1S45N06LESM
Data Sheet October 1999 File Number 4076.2
45A, 60V, 0.028 Ohm, Logic Level
N-Channel Power MOSFETs
These are N-Channel enhancement mode power MOSFETs
manufactured using the latest manufacturing process
technology. This process, which uses feature sizes
approaching those of LSI circuits, gives optimum utilization
of silicon, resulting in outstanding performance. They were
designed for use in applications such as switching
regulators, switching converters, motor drivers, and relay
drivers. These transistors can be operated directly from
integrated circuits.
Formerly developmental type TA49177.
Ordering Information
PART NUMBER PACKAGE BRAND
RFP45N06LE TO-220AB FP45N06L
RF1S45N06LESM TO-263AB F45N06LE
NOTE: When ordering,use theentirepart number.Add thesuffix 9Ato
obtain theTO-263AB v ariantin tapeandreel i.e.,RF1S45N06LESM9A.
Features
• 45A, 60V
•r
DS(ON)
• Temperature Compensating PSPICE
= 0.028Ω
®
Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
o
C Operating Temperature
• 175
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
D
G
S
Packaging
DRAIN (FLANGE)
JEDEC TO-220AB JEDEC TO-263AB
SOURCE
DRAIN
GATE
GATE
SOURCE
DRAIN
(FLANGE)
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 407-727-9207
| Copyright © Intersil Corporation 1999.
RFP45N06LE, RF1S45N06LESM
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFP45N06LE, RF1S45N06LESM UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DSS
DGR
GS
DM
AS
D
Refer to Peak Current Curve
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
60 V
60 V
±10 V
45
Refer to UIS Curve
142
0.95
-55 to 175
300
260
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
Gate Threshold Voltage V
Zero Gate Voltage Drain Current I
DSSID
GS(TH)VGS
DSS
= 250µA, VGS = 0V (Figure 13) 60 - - V
= VDS, ID = 250µA (Figure 12) 1 - 3 V
VDS = 55V, VGS = 0V - - 1 µA
VDS = 50V, VGS = 0V, TC = 150oC - - 250 µA
Gate to Source Leakage Current I
Drain to Source On Resistance (Note 2) r
DS(ON)ID
Turn-On Time t
Turn-On Delay Time t
d(ON)
Rise Time t
Turn-Off Delay Time t
d(OFF)
Fall Time t
Turn-Off Time t
Total Gate Charge Q
g(TOT)VGS
Gate Charge at 5V Q
Threshold Gate Charge Q
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R
GSS
ON
OFF
g(5)
g(TH)
ISS
OSS
RSS
θJC
θJA
VGS = ±10V - - 10 µA
= 45A, VGS = 5V (Figure 11) - - 0.028 Ω
VDD = 30V, ID = 45A, RL = 0.67Ω,
VGS = 5V, RGS = 2.5Ω
(Figures 10, 18, 19)
r
- - 215 ns
-20-ns
- 150 - ns
-55-ns
f
-90-ns
- - 185 ns
= 0V to 10V VDD = 48V,
VGS = 0V to 5V - 58 75 nC
VGS = 0V to 1V - 2.4 3.0 nC
ID = 45A,
RL = 1.07Ω
(Figures 20, 21)
VDS = 25V, VGS = 0V, f = 1MHz
(Figure 14)
- 107 135 nC
- 2150 - pF
- 640 - pF
- 240 - pF
- - 1.05
TO-220, and TO-263 - - 80
o
o
C/W
C/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
SD
Diode Reverse Recovery Time t
NOTES:
2. Pulse test: pulse width ≤ 80µs, duty cycle ≤ 2%.
3. Repetitive rating: pulse width limited by Max junction temperature. See Transient Thermal Impedance curve (Figure 3).
2
ISD = 45A - - 1.5 V
ISD = 45A, dISD/dt = 100A/µs - - 155 ns
rr
RFP45N06LE, RF1S45N06LESM
Typical Performance Curves Unless Otherwise Specified
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 175
TC, CASE TEMPERATURE (oC)
125
150
FIGURE 1. NORMALIZED POWER DISSIPATIONvs CASE
TEMPERATURE
2
1
0.5
0.2
0.1
0.1
JC
θ
THERMAL IMPEDANCE
0.01
10
-5
0.05
0.02
0.01
SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
, NORMALIZED
Z
50
40
30
20
, DRAIN CURRENT (A)
D
I
10
0
25 50 75 100 125 150
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENTvs
CASE TEMPERATURE
P
DM
t
1
t
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
10
-1
10
2
1/t2
x R
JC
θ
0
10
175
+ T
JC
C
θ
1
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
500
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
1
1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TC = 25oC
T
= MAX RATED
J
100µs
1ms
10ms
200
500
100
THERMAL IMPEDANCE
MAY LIMIT CURRENT
IN THIS REGION
, PEAK CURRENT CAPABILITY (A)
DM
I
10
-5
10
VGS = 10V
-4
10
VGS = 5V
FOR TEMPERATURES
ABOVE 25
CURRENT AS FOLLOWS:
I = I
-3
10
t, PULSE WIDTH (s)
-2
10
o
C DERATE PEAK
175 - T
25
-1
10
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
3
150
TC = 25oC
C
0
10
1
10