Intersil RF1S45N06SM, RFG45N06, RFP45N06 Datasheet

RFG45N06, RFP45N06, RF1S45N06SM
Data Sheet July 1999 File Number
45A, 60V, 0.028 Ohm, N-Channel Power MOSFETs
Formerly developmental type TA49028.
Ordering Information
PART NUMBER PACKAGE BRAND
RFG45N06 TO-247 RFG45N06 RFP45N06 TO-220AB RFP45N06 RF1S45N06SM TO-263AB F1S45N06
NOTE: When ordering, use the entire part number. Addthesuffix,9A, to obtain the TO-263AB variant in tape and reel, i.e.RF1S45N06SM9A.
Features
• 45A, 60V
DS(ON)
= 0.028
®
Model
•r
• Temperature Compensating PSPICE
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
o
C Operating Temperature
• 175
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
DRAIN
GATE
SOURCE
3574.4
Packaging
DRAIN
(BOTTOM
SIDE METAL)
JEDEC STYLE TO-247 JEDEC TO-220AB
SOURCE
DRAIN
GATE
JEDEC TO-263AB
GATE SOURCE
DRAIN
(FLANGE)
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
4-455
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
RFG45N06, RFP45N06, RF1S45N06SM
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFG45N06, RFP45N06
RF1S45N06SM UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RG = 20K) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
DSS
DGR
DM
GS
AS
D
Refer to Peak Current Curve
D
Linear Derating Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
60 V 60 V 45
±20 V
Refer to UIS Curve
131
0.877
-55 to 175
300 260
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain Source On Resistance (Note 2) r
DS(ON)ID
Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 10V Q Threshold Gate Charge Q Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
DSSID
DSS
GSS
ON
r
f
OFF
g(10)
g(TH)
ISS OSS RSS
θJC
θJA
= 250µA, VGS = 0V (Figure 11) 60 - - V
= VDS, ID = 250µA (Figure 10) 2 - 4 V VDS = Rated BV VDS = 0.8 x Rated BV
, VGS = 0V - - 1 µA
DSS
, VGS = 0V (125oC) - - 25 µA
DSS
VGS = ±20V - - ±100 nA
= 45A, VGS = 10V (Figure 9) - - 0.028
VDD = 30V, ID = 45A RL = 0.667, VGS = +10V RG = 3.6(Figure 13)
- - 120 ns
-12- ns
-74- ns
-37- ns
-16- ns
- - 80 ns
= 0 to 20V VDD = 48V, ID = 45A, VGS = 0 to 10V - 67 80 nC VGS = 0 to 2V - 3.7 4.5 nC
RL = 1.07 I
= 1.5mA
g(REF)
(Figure 13)
VDS = 25V, VGS = 0V f = 1MHz (Figure 12)
- 125 150 nC
- 2050 - pF
- 600 - pF
- 200 - pF
- - 1.14
o
C/W
--80oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Diode Reverse Recovery Time t
SD
rr
NOTES:
2. Pulse test: pulse width 300µs, duty cycle 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current Capability Curve (Figure 5).
4-456
ISD = 45A - - 1.5 V ISD = 45A, dISD/dt = 100A/µs - - 125 ns
RFG45N06, RFP45N06, RF1S45N06SM
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
Unless Otherwise Specified
FIGURE 1. NORMALIZED POWERDISSIPATION vs CASE
TEMPERATURE
1
50
40
30
20
, DRAIN CURRENT (A)
D
I
10
0
25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
0.5
0.2
0.1
0.1
0.05
0.02
THERMAL IMPEDANCE
, NORMALIZED TRANSIENT
JC
θ
Z
0.01
0.01 SINGLE PULSE
-5
10
-4
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
400
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS AREA MAY BE LIMITED BY r
1
1 10 100
DS(ON)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
V
DSS(MAX)
T
= MAX RATED
J
SINGLE PULSE
= 60V
-3
10
t, RECTANGULAR PULSE DURATION (s)
TC = 25oC
100µs
1ms
10ms
100ms
DC
-2
10
3
10
VGS = 20V
, PEAK CURRENT (A)
2
10
DM
I
40
10-310
NOTES: DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-1
10
VGS = 10V
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-2
-1
10
t, PULSE WIDTH (ms)
P
DM
t
1
t
2
2
x R
JC
θ
175 TC–
----------------------- ­150
2
10
+ T
C
TC = 25oC
3
10
JC
θ
0
10
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT CAPABILITY AS FOLLOWS:

II
=

25

0
10
1
10
1
10
4
10
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
4-457
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