Intersil RFP10P15 Datasheet

RFP10P15
Data Sheet October 1999
-10A, -150V, 0.500 Ohm, P-Channel Power MOSFET
Formerly developmental type TA9404.
Ordering Information
PART NUMBER PACKAGE BRAND
RFP10P15 TO-220AB RFP10P15
NOTE: When ordering, include the entire part number.
File Number 1595.2
Features
• -10A, -150V
•r
DS(ON)
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
= 0.500
Components to PC Boards”
Symbol
D
G
Packaging
DRAIN
(TAB)
TO-220AB
SOURCE
DRAIN
GATE
S
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
407-727-9207
| Copyright © Intersil Corporation 1999
RFP10P15
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFP10P15 UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20K(Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DS
D
DM
GS
D
-150 V
-150 V 10 A 30 A
±20 V
75 W
Linear Derating Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 (for TO-220). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
300 260
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate to Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
DSSID
DSS
= 250µA, VGS = 0 -150 - - V
= VDS, ID = 250µA -2 - -4 V VDS = Rated BV VDS= 0.8 x Rated BV
, VGS = 0V - - 1 µA
DSS
, VGS = 0V,
DSS
TC = 125oC--25µA
Gate to Source Leakage Current I Drain to Source On Voltage (Note 2) V Drain to Source On Resistance (Note 2) r Turn-On Delay Time t
DS(ON)ID
DS(ON)ID
d(ON)ID
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance, Junction to Case R
GSS
OSS RSS
VGS = ±20V, VDS = 0 - - ±100 nA
= 10A, VGS = -10V - - -5.0 V = 10A, VGS = -10V, (Figures 6, 7) - - 0.500
R
r
L
(Figures 10, 11, 12)
10A, V
= 7.5Ω, V
= -75V, R
DS
= -10V
GS
= 50Ω
G
-2450ns
- 74 150 ns
- 138 225 ns
f
VGS = 0V, VDS = -25V
ISS
f = 1MHz (Figure 9)
- 61 100 ns
- - 1700 pF
- - 600 pF
- - 350 pF
RFM10P12, RFM10P15 - - 1.25
JC
θ
RFP10P12, RFP10P15 1.67
o o
C/W C/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) V Reverse Recovery Time t
SD
rr
NOTES:
2. Pulsed: Pulse Duration = 300µs Max, Duty Cycle 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature.
2
ISD = -10A - - 1.4 V ISD = -10A, dlSD/dt = 100A/µs - 210 - ns
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