Intersil RFM12N35, RFM12N40 Datasheet

Semiconductor
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September 1998
RFM12N35,
RFM12N40
12A, 350V and 400V, 0.500 Ohm,
N-Channel Power MOSFETs
[ /Title (RFM12 N35, RFM12 N40)
Sub-
ect (12A, 350V and 400V,
0.500 Ohm, N-Chan­nel Power MOS­FETs)
Author ()
Key­words (12A, 350V and 400V,
0.500 Ohm, N-Chan­nel Power MOS­FETs)
Cre­ator ()
DOCIN
Features
• 12A, 350V and 400V
DS(ON)
= 0.500
•r
Ordering Information
PART NUMBER PACKAGE BRAND
RFM12N35 TO-204AA RFM12N35 RFM12N40 TO-204AA RFM12N40
NOTE: When ordering, use the entire part number.
Packaging
DRAIN (FLANGE)
GATE (PIN 1)
Description
Formerly developmental type TA17434.
Symbol
D
G
S
JEDEC TO-204AA
SOURCE (PIN 2)
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures. Copyright
© Harris Corporation 1998
5-1
File Number 1787.1
RFM12N35, RFM12N40
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFM12N35 RFM12N40 UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 1MΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . V
DGR
Continuous Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DS
D
DM
GS
D
350 400 V 350 400 V
12 12 A
24 24 A ±20 ±20 V 150 150 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 1.2 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . .TJ, T
STG
-55 to 150 -55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
260 260
o
C
o
C
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
DSSID
= 250mA, VGS = 0V
RFM12N35 350 - - V
RFM12N40 400 - - V Gate Threshold Voltage V Zero Gate Voltage Drain Current I
GS(TH)VGS
DSS
= VDS, ID = 250µA, (Figure 8) 2 - 4 V
VDS = Rated BV
DSS,VGS
VDS = 0.8 x Rated BV
= 0 - - 1 µA
DSS, VGS
= 0,
--25µA
TC = 125oC Gate to Source Leakage Current I Drain to Source On Resistance (Note 2) r Drain to Source On Voltage (Note 2) V
GSS
DS(ON)ID
DS(ON)ID
VGS = ±20V, VDS = 0V - - ±100 nA
= 12A, VGS = 10V, (Figures 6, 7) - - 0.500 = 6A, VGS = 10V - - 3 V
ID = 12A, VGS = 10V - - 6.0 V Turn-On Delay Time t
d(ON)ID
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R
r
f
ISS OSS RSS
θJC
6A, V
= 200V, RG = 50Ω,
DS
VGS = 10V, RL = 33Ω, (Figures 10, 11, 12)
VGS = 0V, VDS = 25V, f = 1MHz (Figures 9)
-3050ns
- 105 150 ns
- 480 750 ns
- 140 200 ns
- - 3000 pF
- - 900 pF
- - 400 pF
- - 0.83
o
C/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) V
SD
Diode Reverse Recovery Time t
NOTE:
2. Pulse test: pulse width 300µs, duty cycle 2%.
3. Repetitive rating: pulse width is limited by maximum junction temperature.
ISD = 6A - - 1.4 V ISD = 4A, dISD/dt = 100A/µs - 950 - ns
rr
5-2
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