Intersil RFL1N12L, RFL1N15L Datasheet

Semiconductor
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/
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September 1998
RFL1N12L,
RFL1N15L
1A, 120V and 150V, 1.900 Ohm,
Logic Level, N-Channel Power MOSFETs
[ /Title (RFL1N 12L, RFL1N1 5L)
Subject (1A, 120V and 150V,
1.900 Ohm, Logic Level, N-Chan­nel Power MOS­FETs)
Author ()
Key­words (Harris Semi­conduc­tor, Logic Level, N-Chan­nel Power MOS­FETs, TO­205AF)
Features
• 1A, 120V and 150V
•r
DS(ON)
= 1.900
Ordering Information
PART NUMBER PACKAGE BRAND
RFL1N12L TO-205AF RFL1N12L RFL1N15L TO-205AF RFL1N15L
NOTE: When ordering, use the entire part number.
Packaging
DRAIN (CASE)
Description
Formerly developmental type TA09528.
Symbol
D
G
S
JEDEC TO-205AF
SOURCE
GATE
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures. Copyright
© Harris Corporation 1998
7-1
File Number 1513.2
RFL1N12L, RFL1N15L
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
RFL1N12L RFL1N15L UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 1MΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . .V
DGR
Continuous Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DS
D
DM
GS
D
120 150 V 120 150 V
11A 55A
±10 ±10 V
8.33 8.33 W
Above TC = 25oC, Derate Linearly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.0667 0.0667 W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150 -55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
260 260
o
C
o
C
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
DSS
ID = 250µA, VGS = 0
RFL1N12L 120 - - V RFL1N15L 150 - - V
Gate Threshold Voltage V
GS(TH)
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain to Source On Resistance (Note 2) r Drain to Source On Voltage (Note 2) V Turn-On Delay Time t
DS(ON)ID
DS(ON)ID
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R
DSS
GSS
r
f
ISS OSS RSS
JC
θ
VGS = VDS, ID = 250µA, (Figure 8) 1 - 2 V VDS = Rated BV
DSS
VDS = 0.8 x Rated BV
, TC = 125oC--25µA
DSS
--1µA
VGS = ±10V, VDS = 0 - - ±100 µA
= 1A, VGS = 5V, (Figures 6, 7) - - 1.900 = 1A, VGS = 5V - - 1.9 V
I
1A, V
D
RL= 75, VGS = 5V, (Figures 10, 11, 12)
= 75V, RG= 6.25,
DD
-1025ns
-1045ns
-2445ns
-3050ns
VGS = 0V, VDS = 25V, f = 1MHz,(Figure 9) - - 200 pF
- - 80 pF
- - 35 pF
--15oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) V Diode Reverse Recovery Time t
SD
rr
ISD = 1A - - 1.4 V ISD = 1A, dI
NOTES:
2. Pulse test: width300µs duty cycle 2%.
3. Repetitive rating: pulse witdh limited by maximum junction temperature.
7-2
dt = 50A/µs - 150 - ns
SD/
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