Intersil RF3S49092SM, RF3V49092 Datasheet

RF3V49092, RF3S49092SM
Data Sheet November 1999 File Number 4600.1
20A/10A, 12V, 0.060/0.140 Ohm, Logic Level, Complementary Power MOSFET
Formerly developmental type TA49092.
Ordering Information
PART NUMBER PACKAGE BRAND
RF3V49092 TS-001AA F3V49092 RF3S49092SM MO-169AB F3S49092
NOTE: Whenordering, use the entire part number.Forordering the MO-169ABintape and reel, add thesuffix9A to the part number,i.e., RF3S49092SM9A.
Features
• 20A, 12V (N-Channel) 10A, 12V (P-Channel)
•r r
• Temperature Compensating PSPICE
= 0.060(N-Channel)
DS(ON)
= 0.140(P-Channel)
DS(ON)
®
Model
• On-Resistance vs Gate Drive Voltage Curves
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
S2 G2
D1
G1 S1
Packaging
JEDEC TS-001AA (ALTERNATE) JEDEC MO-169AB
S1
G1
D
S2
G2
G2
S2
D
G1
S1
4-30
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-727-9207
| Copyright © Intersil Corporation 1999
RF3V49092, RF3S49092SM
Absolute Maximum Ratings T
= 25oC Unless Otherwise Specified
C
N-CHANNEL P-CHANNEL UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RGS= 20k, Note 1). . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
DGR
GS
12 -12 V 12 -12 V
±10 ±10 V
Drain Current
Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed (Figures 5, 26) . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating (Figures 6, 27). . . . . . . . . . . . .E
DM
AS
D
Refer to Peak Current Curve
20
10
Refer to Peak Current Curve
Refer to UIS Curve Refer to UIS Curve
A
Power Dissipation
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
50
0.33
50
0.33
-55 to 175 -55 to 175
300 260
300 260
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications (N-Channel) T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain to Source On Resistance r
DS(ON)ID
Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 5V Q Threshold Gate Charge Q Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
DSSID
DSS
GSS
ON
r
f
OFF
g(5)
g(TH)
ISS OSS RSS
JC
θ
JA
θ
= 250µA, VGS = 0V, (Figure 13) 12 - - V
= VDS, ID = 250µA, (Figure 12) 1 - - V
VDS = 12V, VGS = 0V
TC = 25oC--1µA TC = 150oC--50µA
VGS = ±10V - - ±100 nA
= 20A, VGS = 5V, (Figure 9, 11) - - 0.060
VDD = 6V, ID≈ 20A, RL = 0.24, VGS= 5V, RGS = 25 (Figure 10)
- - 100 ns
-18-ns
-60-ns
-50-ns
-60-ns
- - 140 ns
= 0V to 10V VDD = 9.6V, VGS = 0V to 5V - 12 15 nC VGS = 0V to 1V - 0.9 1.2 nC
ID = 20A, RL = 0.42 (Figure 15)
VDS = 10V, VGS = 0V, f = 1MHz (Figure 14)
-2025nC
- 750 - pF
- 700 - pF
- 275 - pF
- - 3.00
TS-001AA, and MO-169AB - - 62
o o
C/W C/W
N-Channel Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Voltage V Reverse Recovery Time t
4-31
SD
ISD = 20A - - 1.5 V ISD = 20A, dISD/dt = 100A/µs - - 100 ns
rr
RF3V49092, RF3S49092SM
Electrical Specifications (P-Channel) T
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain to Source On Resistance r Turn-On Time t Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t Turn-Off Time t Total Gate Charge Q Gate Charge at -5V Q Threshold Gate Charge Q Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Case R Thermal Resistance Junction to Ambient R
DS(ON)ID
d(OFF)
= 25oC, Unless Otherwise Specified
C
DSSID
GS(TH)VGS
DSS
= 250µA, VGS = 0V, (Figure 34) -12 - - V
= VDS, ID = 250µA, (Figure 33) -1 - - V VDS = -12V,
VGS = 0V
GSS
VGS = ±10V - - ±100 nA
= 10A, VGS = -5V, (Figures 30, 32) - - 0.140
ON
VDD = -6V, ID≈ 10A, RL = 0.62, VGS= -5V, RGS = 25
d(ON)
OFF
g(TOT)VGS
g(-5)
g(TH)
ISS
(Figure 31)
r
f
= 0V to -10V VDD = -9.6V, VGS = 0V to -5V - 10 14 nC VGS = 0V to -1V - 0.8 1.1 nC VDS = -10V, VGS = 0V, f = 1MHz
(Figure 35)
OSS RSS
θJC
TS-001AA, and MO-169AB - - 62
JA
θ
TC = 25oC---1µA TC = 150oC - - -50 µA
- - 115 ns
-25-ns
-65-ns
-40-ns
-45-ns
- - 110 ns
-1924nC ID = 10A, RL = 1.0 (Figure 36)
- 775 - pF
- 550 - pF
- 150 - pF
- - 3.00
o o
C/W C/W
P-Channel Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Voltage V Reverse Recovery Time t
SD
ISD = -10A - - -1.5 V ISD = -10A, dISD/dt = -100A/µs - - 100 ns
rr
Typical Performance Curves (N-Channel)
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWERDISSIPATION vs CASE
TEMPERATURE
125
175
25
20
15
10
, DRAIN CURRENT (A)
D
I
5
0
25 50 75 100 125 175
TC, CASE TEMPERATURE (oC)
150
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
4-32
RF3V49092, RF3S49092SM
Typical Performance Curves (N-Channel) (Continued)
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
JC
θ
Z
THERMAL IMPEDANCE
SINGLE PULSE
0.01
-5
10
-4
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
-3
10
10
t, RECTANGULAR PULSE DURATION (s)
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
-1
10
0
10
2
1/t2
x R
JC
θ
+ T
JC
C
θ
1
10
100
TJ = MAX RATED, TC = 25oC
1000
TC = 25oC
FOR TEMPERATURES ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
25
-1
10
10
, DRAIN CURRENT (A)
OPERATION IN THIS
D
I
AREA MAY BE LIMITED BY r
1
1
VDS, DRAIN TO SOURCE VOLTAGE (V)
DS(ON)
5ms 10ms
100ms
1s
DC
10 50
100
VGS = 5V
TRANSCONDUCTANCE
, PEAK CURRENT CAPABILITY (A)
MAY LIMIT CURRENT
DM
I
IN THIS REGION
10
-5
10
10
I = I
-4
-3
10
-2
10
t, PULSE WIDTH (s)
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
100
10
STARTING TJ = 150oC
If R = 0
, AVALANCHE CURRENT (A)
tAV = (L)(IAS)/(1.3*RATED BV
AS
I
If R 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
1
0.01
0.1 tAV, TIME IN AVALANCHE (ms)
STARTING TJ = 25oC
- VDD)
DSS
- VDD) +1]
DSS
1 10 100
50
V
= 10V
GS
VGS = 5V
40
30
20
, DRAIN CURRENT (A)
D
I
10
PULSE DURATION = 80µs, TC = 25oC
0
012345
VDS, DRAIN TO SOURCE VOLTAGE (V)
DUTY CYCLE = 0.5% MAX
C
150
0
10
VGS = 4.5V
VGS = 4V
VGS = 3V
67
1
10
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
4-33
FIGURE 7. SATURATION CHARACTERISTICS
Loading...
+ 9 hidden pages