RF3V49092, RF3S49092SM
Data Sheet November 1999 File Number 4600.1
20A/10A, 12V, 0.060/0.140 Ohm, Logic
Level, Complementary Power MOSFET
These complementary power MOSFETs are manufactured
using an advanced MegaFET process. This process, which
uses feature sizes approaching those of LSI integrated
circuits, gives optimum utilization of silicon, resulting in
outstanding performance. It is designed for use in
applications such as switching regulators, switching
converters, motor drivers, relay drivers, and low voltage bus
switches. This product achieves full rated conduction at a
gate bias in the 3V to 5V range, thereby facilitating true
on-off power control directly from logic level (5V) integrated
circuits.
Formerly developmental type TA49092.
Ordering Information
PART NUMBER PACKAGE BRAND
RF3V49092 TS-001AA F3V49092
RF3S49092SM MO-169AB F3S49092
NOTE: Whenordering, use the entire part number.Forordering the
MO-169ABintape and reel, add thesuffix9A to the part number,i.e.,
RF3S49092SM9A.
Features
• 20A, 12V (N-Channel)
10A, 12V (P-Channel)
•r
r
• Temperature Compensating PSPICE
= 0.060Ω (N-Channel)
DS(ON)
= 0.140Ω (P-Channel)
DS(ON)
®
Model
• On-Resistance vs Gate Drive Voltage Curves
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
S2
G2
D1
G1
S1
Packaging
JEDEC TS-001AA (ALTERNATE) JEDEC MO-169AB
S1
G1
D
S2
G2
G2
S2
D
G1
S1
4-30
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-727-9207
| Copyright © Intersil Corporation 1999
RF3V49092, RF3S49092SM
Absolute Maximum Ratings T
= 25oC Unless Otherwise Specified
C
N-CHANNEL P-CHANNEL UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RGS= 20kΩ , Note 1). . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
DGR
GS
12 -12 V
12 -12 V
± 10 ± 10 V
Drain Current
Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed (Figures 5, 26) . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating (Figures 6, 27). . . . . . . . . . . . .E
DM
AS
D
Refer to Peak Current Curve
20
10
Refer to Peak Current Curve
Refer to UIS Curve Refer to UIS Curve
A
Power Dissipation
TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
50
0.33
50
0.33
-55 to 175 -55 to 175
300
260
300
260
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications (N-Channel) T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
Gate Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
Drain to Source On Resistance r
DS(ON)ID
Turn-On Time t
Turn-On Delay Time t
d(ON)
Rise Time t
Turn-Off Delay Time t
d(OFF)
Fall Time t
Turn-Off Time t
Total Gate Charge Q
g(TOT)VGS
Gate Charge at 5V Q
Threshold Gate Charge Q
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R
DSSID
DSS
GSS
ON
r
f
OFF
g(5)
g(TH)
ISS
OSS
RSS
JC
θ
JA
θ
= 250µ A, VGS = 0V, (Figure 13) 12 - - V
= VDS, ID = 250µ A, (Figure 12) 1 - - V
VDS = 12V,
VGS = 0V
TC = 25oC- - 1µA
TC = 150oC- - 5 0µA
VGS = ± 10V - - ± 100 nA
= 20A, VGS = 5V, (Figure 9, 11) - - 0.060 Ω
VDD = 6V, ID≈ 20A, RL = 0.24Ω ,
VGS= 5V, RGS = 25Ω
(Figure 10)
- - 100 ns
-1 8-n s
-6 0-n s
-5 0-n s
-6 0-n s
- - 140 ns
= 0V to 10V VDD = 9.6V,
VGS = 0V to 5V - 12 15 nC
VGS = 0V to 1V - 0.9 1.2 nC
ID = 20A,
RL = 0.42Ω
(Figure 15)
VDS = 10V, VGS = 0V, f = 1MHz
(Figure 14)
-2 02 5n C
- 750 - pF
- 700 - pF
- 275 - pF
- - 3.00
TS-001AA, and MO-169AB - - 62
o
o
C/W
C/W
N-Channel Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Voltage V
Reverse Recovery Time t
4-31
SD
ISD = 20A - - 1.5 V
ISD = 20A, dISD/dt = 100A/µ s - - 100 ns
rr
RF3V49092, RF3S49092SM
Electrical Specifications (P-Channel) T
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
Gate Threshold Voltage V
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
Drain to Source On Resistance r
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
Total Gate Charge Q
Gate Charge at -5V Q
Threshold Gate Charge Q
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R
DS(ON)ID
d(OFF)
= 25oC, Unless Otherwise Specified
C
DSSID
GS(TH)VGS
DSS
= 250µ A, VGS = 0V, (Figure 34) -12 - - V
= VDS, ID = 250µ A, (Figure 33) -1 - - V
VDS = -12V,
VGS = 0V
GSS
VGS = ± 10V - - ± 100 nA
= 10A, VGS = -5V, (Figures 30, 32) - - 0.140 Ω
ON
VDD = -6V, ID≈ 10A, RL = 0.62Ω ,
VGS= -5V, RGS = 25Ω
d(ON)
OFF
g(TOT)VGS
g(-5)
g(TH)
ISS
(Figure 31)
r
f
= 0V to -10V VDD = -9.6V,
VGS = 0V to -5V - 10 14 nC
VGS = 0V to -1V - 0.8 1.1 nC
VDS = -10V, VGS = 0V, f = 1MHz
(Figure 35)
OSS
RSS
θ JC
TS-001AA, and MO-169AB - - 62
JA
θ
TC = 25oC- - - 1µA
TC = 150oC - - -50 µ A
- - 115 ns
-2 5-n s
-6 5-n s
-4 0-n s
-4 5-n s
- - 110 ns
-1 92 4n C
ID = 10A,
RL = 1.0Ω
(Figure 36)
- 775 - pF
- 550 - pF
- 150 - pF
- - 3.00
o
o
C/W
C/W
P-Channel Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Voltage V
Reverse Recovery Time t
SD
ISD = -10A - - -1.5 V
ISD = -10A, dISD/dt = -100A/µ s - - 100 ns
rr
Typical Performance Curves (N-Channel)
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWERDISSIPATION vs CASE
TEMPERATURE
125
175
25
20
15
10
, DRAIN CURRENT (A)
D
I
5
0
25 50 75 100 125 175
TC, CASE TEMPERATURE (oC)
150
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
4-32
RF3V49092, RF3S49092SM
Typical Performance Curves (N-Channel) (Continued)
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
JC
θ
Z
THERMAL IMPEDANCE
SINGLE PULSE
0.01
-5
10
-4
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
-3
10
10
t, RECTANGULAR PULSE DURATION (s)
P
DM
t
1
t
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
-1
10
0
10
2
1/t2
x R
JC
θ
+ T
JC
C
θ
1
10
100
TJ = MAX RATED, TC = 25oC
1000
TC = 25oC
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
25
-1
10
10
, DRAIN CURRENT (A)
OPERATION IN THIS
D
I
AREA MAY BE
LIMITED BY r
1
1
VDS, DRAIN TO SOURCE VOLTAGE (V)
DS(ON)
5ms
10ms
100ms
1s
DC
10 50
100
VGS = 5V
TRANSCONDUCTANCE
, PEAK CURRENT CAPABILITY (A)
MAY LIMIT CURRENT
DM
I
IN THIS REGION
10
-5
10
10
I = I
-4
-3
10
-2
10
t, PULSE WIDTH (s)
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
100
10
STARTING TJ = 150oC
If R = 0
, AVALANCHE CURRENT (A)
tAV = (L)(IAS)/(1.3*RATED BV
AS
I
If R ≠ 0
t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
1
0.01
0.1
tAV, TIME IN AVALANCHE (ms)
STARTING TJ = 25oC
- VDD)
DSS
- VDD) +1]
DSS
1 10 100
50
V
= 10V
GS
VGS = 5V
40
30
20
, DRAIN CURRENT (A)
D
I
10
PULSE DURATION = 80µ s, TC = 25oC
0
012345
VDS, DRAIN TO SOURCE VOLTAGE (V)
DUTY CYCLE = 0.5% MAX
C
150
0
10
VGS = 4.5V
VGS = 4V
VGS = 3V
67
1
10
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
4-33
FIGURE 7. SATURATION CHARACTERISTICS