Intersil RF1K49223 Datasheet

RF1K49223
Data Sheet August 1999 File Number
2.5A, 30V, 0.150 Ohm, Dual P-Channel LittleFET™ Power MOSFET
Formerly developmental type TA49223.
Ordering Information
PART NUMBER PACKAGE BRAND
RF1K49223 MS-012AA RF1K49223
NOTE: When ordering, use the entire part number. For ordering in tape and reel, add the suffix 96 to the part number, i.e.RF1K4922396.
Features
• 2.5A, 30V
DS(ON)
= 0.150
®
Model
•r
• Temperature Compensating PSPICE
• Thermal Impedance PSPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
D1(8) D1(7)
S1(1)
G1(2)
4322.1
Packaging
JEDEC MS-012AA
BRANDING DASH
1
2
D2(6) D2(5)
S2(3)
G2(4)
5
3
4
8-161
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
LittleFET™ is a trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
RF1K49223
Absolute Maximum Ratings T
= 25oC Unless Otherwise Specified
A
RF1K49223 UNITS
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (RGS= 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
DGR
GS
-30 V
-30 V
±20 V
Drain Current
Continuous (Pulse Width = 5s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
DM
AS
D
Refer to Peak Current Curve
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
2.5
Refer to UIS Curve
2
0.016
-55 to 150
300 260
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate to Source Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain to Source On Resistance r
DS(ON)ID
Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at -10V Q Threshold Gate Charge Q
DSSID
DSS
GSS
ON
r
f
OFF
g(-10) g(TH)
= 250µA, VGS = 0V, (Figure 12) -30 - - V
= VDS, ID = 250µA, (Figure 11) -1 - -3 V
VDS = -30V, VGS = 0V
TA = 25oC---1µA TA = 150oC - - -50 µA
VGS = ±20V - - ±100 nA
= 2.5A,
(Figure 9, 10)
VDD = -15V, I RL = 6, VGS = -10V, RGS = 25
VGS = -10V - - 0.150 VGS = -4.5V - - 0.360
2.5A,
D
- - 40 ns
-9-ns
-19-ns
-60-ns
-34-ns
- - 140 ns
= 0V to -20V VDD = -24V,
I
2.5A,
VGS = 0V to -10V - 15 19 nC VGS = 0V to -2V - 1.5 1.9 nC
D
RL = 9.6 I
= -1.0mA
g(REF)
-2835nC
(Figure 14) Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction to Ambient R
ISS OSS RSS
θJA
VDS = -25V, VGS = 0V, f = 1MHz (Figure 13)
Pulse Width = 1s
- 580 - pF
- 260 - pF
-38-pF
- - 62.5
o
C/W
Device mounted on FR-4 material
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Reverse Recovery Time t
8-162
SD
rr
ISD = -2.5A - - -1.25 V ISD =-2.5A, dISD/dt = 100A/µs--49ns
Typical Performance Curves
RF1K49223
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWERDISSIPATION vs AMBIENT
TEMPERATURE
10
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
1
0.05
0.02
0.01
0.1
, NORMALIZED
JA
θ
Z
0.01
THERMAL IMPEDANCE
0.001
-5
10
SINGLE PULSE
-4
10
-3
10
-2
10
t, RECTANGULAR PULSE DURATION (s)
-3.0
-2.5
-2.0
-1.5
-1.0
, DRAIN CURRENT (A)
D
I
-0.5
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-1
10
0
10
1
10
2
x R
JA
JA
θ
θ
2
10
2
+ T
A
3
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
-50
-10
-1
, DRAIN CURRENT (A)
-0.1
D
I
OPERATION IN THIS AREA MAY BE LIMITED BY r
-0.01
-0.1 V
DS
TJ = MAX RATED T
= 25oC
A
DS(ON)
V
DSS(MAX)
= -30V
-1 -10
, DRAIN TO SOURCE VOLTAGE (V)
5ms
10ms
100ms
1s
DC
-100
-100 VGS = -20V
VGS = -10V
-10
TRANSCONDUCTANCE MAY LIMIT CURRENT
, PEAK CURRENT (A)
IN THIS REGION
DM
I
-1
-5
10
-4
10
TA = 25oC
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I = I
-3
10
-2
10
t, PULSE WIDTH (s)
o
25
10
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
8-163
C DERATE PEAK
150 - T
A
125
-1
0
10
1
10
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