Intersil RF1K49088 Datasheet

RF1K49088

Data Sheet August 1999 File Number

3.5A, 30V, 0.06 Ohm, Logic Level, Dual N-Channel LittleFET™ Power MOSFET
Formerly developmental type TA49088.
Ordering Information
PART NUMBER PACKAGE BRAND
RF1K49088 MS-012AA RF1K49088
NOTE: When ordering, use the entire part number. For ordering in tape andreel, add the suffix 96 to the partnumber ,i.e.,RF1K4908896.

Features

• 3.5A, 30V
DS(ON)
= 0.060
®
Model
•r
• Temperature Compensating PSPICE
• On-Resistance vs Gate Drive Voltage Curves
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
D1(8) D1(7)
S1(1)
G1(2)
3952.5

Packaging

JEDEC MS-012AA
BRANDING DASH
1
2
D2(6) D2(5)
S2(3)
G2(4)
5
3
4
8-94
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
LittleFET™ is a trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.
http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999

RF1K49088

Absolute Maximum Ratings T
= 25oC Unless Otherwise Specified
A
RF1K49088 UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS= 20k, Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
DGR
GS
30 V 30 V
±10 V
Drain Current
Continuous (Pulse Width = 5s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed (Figure 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Avalanche Rating (Figure 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
DM
AS
D
Refer to Peak Current Curve
3.5
Refer to UIS Curve
A
Power Dissipation
TA = 25oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
2
0.016
-55 to 150
300 260
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ = 25oC to 125oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV Gate Threshold Voltage V
GS(TH)VGS
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I Drain to Source On Resistance r
DS(ON)ID
Turn-On Time t Turn-On Delay Time t
d(ON)
Rise Time t Turn-Off Delay Time t
d(OFF)
Fall Time t Turn-Off Time t Total Gate Charge Q
g(TOT)VGS
Gate Charge at 5V Q Threshold Gate Charge Q Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Thermal Resistance Junction-to-Ambient R
DSSID
DSS
GSS
ON
r
f
OFF
g(5)
g(TH)
ISS OSS RSS
JA
θ
= 250µA, VGS = 0V, (Figure 13) 30 - - V
= VDS, ID = 250µA, (Figure 12) 1 - 2 V
VDS = 30V, VGS = 0V
TA = 25oC--1µA TA = 150oC--50µA
VGS = ±10V - - ±100 nA
= 3.5A, VGS = 5V, (Figures 9, 11) - - 0.060
VDD = 15V, ID≈ 3.5A, RL = 4.29, VGS = 5V, RGS = 25 (Figure 10)
- - 100 ns
-18-ns
-60-ns
-53-ns
-47-ns
- - 125 ns
= 0V to 10V VDD = 24V, VGS = 0V to 5V - 13 17 nC VGS = 0V to 1V - 0.8 1.0 nC
ID = 3.5A, RL = 6.86 (Figure 15)
VDS = 25V, VGS = 0V, f = 1MHz (Figure 14)
-2430nC
- 750 - pF
- 275 - pF
- 100 - pF
Pulse width = 1s
- - 62.5
o
C/W
Device mounted on FR-4 material
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Reverse Recovery Time t
8-95
SD
rr
ISD = 3.5A - - 1.25 V ISD = 3.5A, dISD/dt = 100A/µs--50ns
Typical Performance Curves

RF1K49088

1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT
TEMPERATURE
10
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
, NORMALIZED
JA
0.1
θ
Z
THERMAL IMPEDANCE
SINGLE PULSE
0.01
-3
10
-2
10
-1
10
t, RECTANGULAR PULSE DURATION (s)
4.0
3.5
3.0
2.5
2.0
1.5
, DRAIN CURRENT (A)
1.0
D
I
0.5 0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
0
10
1
10
10
2
1/t2
x R
JA
JA
θ
θ
2
+ T
A
3
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
100
10
1
, DRAIN CURRENT (A)
D
0.1
OPERATION IN THIS
I
AREA MAY BE LIMITED BY r
0.01
0.1 VDS, DRAIN TO SOURCE VOLTAGE (V)
TJ = MAX RATED
= 25oC
T
A
DS(ON)
V
DSS(MAX)
= 30V
1 10 100
5ms
10ms
100ms
1s
DC
200
100
10
, PEAK CURRENT CAPABILITY (A)
DM
I
1
-5
10
VGS = 10V
VGS = 5V
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-4
10
-3
10
t, PULSE WIDTH (s)
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I = I
25
-2
10
10
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
8-96
o
C DERATE PEAK
150 - T
A
125
TA = 25oC
-1
0
10
1
10
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