µC compatible power switch with diagnostic feedback
for 12 V and 24 V DC grounded loads
•
All types of resistive, inductive and capacitve loads
•
Replaces electromechanical relays and discrete circuits
Product Summary
V
Load dump
Vbb-V
V
bb (operation)
V
bb (reverse)
80 V
Avalanche Clamp 58 V
OUT
4.5 ... 42 V
-32 V
RON 38
I
L(SCp)
I
L(SCr)
I
L(ISO)
44 A
35 A
11 A
5
Straight leads
1
SMD
®
BTS 432 E2
mΩ
5
5
1
Standard
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, integrated in Smart SIPMOS
Voltage
source
V
Logic
Voltage
sensor
IN
2
ESD
4
ST
Logic
chip on chip technology. Providing protective functions.
+ V
bb
PROFET
bb
OUT
Overvoltage
protection
Charge pump
Level shifter
Rectifier
GND
Current
limit
Gate
protection
Limit for
unclamped
ind. loads
Open load
detection
Short circuit
detection
R
Temperature
sensor
1
Signal GND
Load GND
3
5
Load
1)
No external components required, reverse load current limited by connected load.
2)
Additional external diode required for charged inductive loads
Semiconductor Group 1 of 14 2003-Oct-01
BTS 432 E2
Pin Symbol Function
1 GND - Logic ground
2 IN I Input, activates the power switch in case of logical high signal
3 Vbb + Positive power supply voltage,
the tab is shorted to this pin
4 ST S Diagnostic feedback, low on failure
5 OUT
O Output to the load
(Load, L)
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter Symbol Values Unit
Supply voltage (overvoltage protection see page 3) Vbb 63V
3
Load dump protection V
LoadDump
= UA + Vs, UA = 13.5 V
)
V
66.5V
s
RI= 2 Ω, RL= 1.1 Ω, td= 200 ms, IN= low or high
Load current (Short-circuit current, see page 4) IL self-limitedA
Operating temperature range
Storage temperature range
Power dissipation (DC) P
Tj
T
stg
125W
tot
-40 ...+150
-55 ...+150
°C
Inductive load switch-off energy dissipation,
single pulse Tj=150 °C: EAS 1.7J
Electrostatic discharge capability (ESD)
V
2.0kV
ESD
(Human Body Model)
Input voltage (DC) VIN -0.5 ... +6V
Current through input pin (DC)
Current through status pin (DC)
VS is setup without DUT connected to the generator per ISO 7637-1 and DIN 40839
4)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
2
(one layer, 70µm thick) copper area for Vbb
Semiconductor Group 2 2003-Oct-01
BTS 432 E2
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Load Switching Capabilities and Characteristics
min typ max
On-state resistance (pin 3 to 5)
IL = 2 A Tj=25 °C:
RON
--
Tj=150 °C:
Nominal load current (pin 3 to 5)
I
9 11 --A
L(ISO)
ISO Proposal: VON = 0.5 V, TC = 85 °C
Output current (pin 5) while GND disconnected or
I
L(GNDhigh)
-- -- 1mA
GND pulled up, VIN= 0, see diagram page 7,
Tj =-40...+150°C
Turn-on time to 90% V
Turn-off time to 10% VR
= 12 Ω, Tj =-40...+150°C
L
Slew rate on
10 to 30% V
OUT
, R
= 12 Ω, Tj =-40...+150°C
L
Slew rate off
70 to 40% V
, RL= 12 Ω, Tj =-40...+150°C
OUT
OUT
OUT
:
ton
:
t
off
dV /dton 0.4 -- 2.5V/µs
-dV/dt
1 -- 5V/µs
off
50
10
Operating Parameters
Operating voltage 5)Tj =-40...+150°C: V
Undervoltage shutdown Tj =-40...+150°C: V
Undervoltage restart Tj =-40...+150°C: V
Undervoltage restart of charge pump
V
4.5 -- 42V
bb(on)
bb(under)
bb(u rst)
bb(ucp)
2.4 -- 4.5V
-- -- 4.5V
-- 6.5 7.5V
see diagram page 12Tj =-40...+150°C:
Undervoltage hysteresis
∆V
bb(under)
= V
bb(u rst)
- V
bb(under)
Overvoltage shutdown Tj =-40...+150°C: V
Overvoltage restart Tj =-40...+150°C: V
Overvoltage hysteresis Tj =-40...+150°C:∆V
Overvoltage protection
6)
Tj =-40°C:
Ibb=40 mA Tj =25...+150°C:
Standby current (pin 3) Tj=-40...+25°C:
VIN=0 T
Leakage output current (included in I
VIN=0
bb(off)
=150°C:
j
)
Operating current (Pin 1)7), VIN=5 V
∆V
bb(over)
bb(o rst)
V
bb(AZ)
bb(under)
bb(over)
-- 0.2 --V
42 -- 52V
42 -- --V
-- 0.2 --V
60
63
I
--
bb(off)
--
I
-- 6 --µA
L(off)
I
-- 1.1 --mA
GND
30
55
160
--
--
67
12
18
38
mΩ
70
300
µs
80
--V
25
µA
60
5)
At supply voltage increase up to V
6)
see also V
7)
Add I
, if IST > 0, add IIN, if VIN>5.5 V
ST
in table of protection functions and circuit diagram page 7. Meassured without load.
ON(CL)
= 6.5 V typ without charge pump, V
bb
≈Vbb - 2 V
OUT
Semiconductor Group 3 2003-Oct-01
BTS 432 E2
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
min typ max
Protection Functions8)
Initial peak short circuit current limit (pin 3 to 5)9),
(max 400 µs if VON > V
ON(SC)
)
=-40°C:
Tj
=25°C:
Tj
=+150°C:
Tj
Repetitive short circuit current limit I
I
--
L(SCp)
--
--
24
L(SCr)
44
--
Tj = Tjt (see timing diagrams, page 10) 22 35 --A
Short circuit shutdown delay after input pos. slope
> V
V
ON
min value valid only, if input "low" time exceeds 30 µs
, Tj =-40..+150°C:
ON(SC)
Output clamp (inductive load switch off)
at V
= Vbb - V
OUT
ON(CL)
IL= 30 mA
,
t
V
Short circuit shutdown detection voltage
(pin 3 to 5) V
d(SC)
ON(CL)
ON(SC)
80
--
--
-- 400µs
58 --V
8.3 --V
Thermal overload trip temperature Tjt 150 -- --°C
Thermal hysteresis
Inductive load switch-off energy dissipation
T
= 150 °C, single pulse Vbb = 12 V:
j Start
10)
,
Vbb = 24 V:
Reverse battery (pin 3 to 1)
11)
-Vbb -- -- 32V
∆
Tjt -- 10 --K
E
AS
E
Load12
E
Load24
-- -- 1.7
Integrated resistor in Vbb line Rbb -- 120 --Ω
Diagnostic Characteristics
Open load detection current Tj=-40 °C:
(on-condition)Tj=25..150°C:
I
2
L (OL)
2
--
--
74
1.3
1.0
900
750
A
--
--
J
mA
8)
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not
designed for continuous repetitive operation.
9)
Short circuit current limit for max. duration of 400 µs, prior to shutdown (see t
10)
While demagnetizing load inductance, dissipated energy in PROFET is EAS= V
V
2
= 1/
E
AS
11)
Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load.
Reverse current I
these condition is dependent on the size of the heatsink. Reverse I
external GND-resistor (150 Ω). Input and Status currents have to be limited (see max. ratings page 2 and
circuit page 7).
* L * I
2
* (
L
V
ON(CL)
of ≈ 0.3 A at Vbb= -32 V through the logic heats up the device. Time allowed under
GND
ON(CL)
- V
), see diagram page 8
bb
page 4)
d(SC)
* iL(t) dt, approx.
ON(CL)
can be reduced by an additional
GND
Semiconductor Group 4 2003-Oct-01
BTS 432 E2
Parameter and Conditions Symbol Values Unit
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Input and Status Feedback
12)
Input turn-on threshold voltage
T
=-40..+150°C:
j
Input turn-off threshold voltage
T
=-40..+150°C:
j
V
IN(T+)
V
IN(T-)
Input threshold hysteresis ∆ V
Off state input current (pin 2) VIN = 0.4 V: I
On state input current (pin 2) VIN = 3.5 V: I
Status invalid after positive input slope
(short circuit) Tj=-40 ... +150°C:
Status invalid after positive input slope
(open load) Tj=-40 ... +150°C:
IN(off)
IN(on)
t
d(ST SC)
t
d(ST)
min typ max
1.5 -- 2.4V
1.0 -- --V
-- 0.5 --V
IN(T)
1 -- 30µA
10 25 50µA
80 200 400µs
350 -- 1600µs
Status output (open drain)
Zener limit voltage Tj =-40...+150°C, IST = +1.6 mA:
ST low voltage Tj =-40...+150°C, IST = +1.6 mA:
V
ST(high)
V
ST(low)
5.4
--
6.1
--
0.4
--
V
12)
If a ground resistor R
is used, add the voltage drop across this resistor.
GND
Semiconductor Group 5 2003-Oct-01
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