Intersil MCTV35P60F1D Datasheet

Semiconductor
MCTV35P60F1D
April 1999
PROCESS OBSOLETE - NO NEW DESIGNS
Features
PART WITHDRAWN
• 35A, -600V = -1.35V (Max) at I = 35A and +150oC
•V
TM
• 800A Surge Current Capability
• 800A/µs di/dt Capability
• MOS Insulated Gate Control
• 50A Gate Turn-Off Capability at +150
o
C
• Anti-Parallel Diode
Description
The MCT is an MOS Controlled Thyristor designed for s witch­ing currents on and offby negative and positive pulsed control of an insulated MOS gate. It is designed for use in motor con­trols, inverters, line switches and other power switching appli­cations. The MCT is especially suited for resonant (zero voltage or zero current switching) applications. The SCR like forward drop greatly reduces conduction pow er loss .
MCTs allow the control of high power circuits with very small amounts of input energy. They feature the high peak current capability common to SCR type thyristors, and operate at junction temperatures up to +150 This device features a discrete anti-parallel diode that shunts current around the MCT in the reverse direction without introducing carriers into the depletion region.
PART NUMBER INFORMATION
PART NUMBER PACKAGE BRAND
MCTV35P60F1D TO-247 M35P60F1D
NOTE: When ordering, use the entire part number.
Formerly developmental type TA9789 (MCT) and TA49054 (diode).
o
C with active switching.
35A, 600V P-Type MOS Controlled
Thyristor (MCT) with Anti-Parallel Diode
JEDEC STYLE TO-247
A
A
K
GR
G
Symbol
GA
K
Absolute Maximum Ratings T
Peak Off-State Voltage (See Figure 11). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Continuous Cathode Current (See Figure 2)
TC = +25oC (Package Limited). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
TC = +90oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Non-repetitive Peak Cathode Current (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Peak Controllable Current (See Figure 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate-Anode Voltage (Continuous). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate-Anode Voltage (Peak) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Rate of Change of Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . dv/dt SeeFigure 11
Rate of Change of Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .di/dt 800 A/µs
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Linear Derating Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.43 W/oC
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ,T
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
(0.063" (1.6mm) from case for 10s) NOTE: 1. Maximum Pulse Width of 250µs (Half Sine) Assume TJ (Initial) = +90oC and TJ (Final) = TJ (Max) = +150oC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures. Copyright
© Harris Corporation 1999
= +25oC, Unless Otherwise Specified
C
2-8
MCTV35P60F1D UNITS
DRM
K25
K115 KSM
KC
GA1
GAM
T
STG
L
-600 V
60 35
800 A
50 A
±20 V ±25 V
178 W
-55 to +150 260
File Number 3694.4
A A
o
C
o
C
Specifications MCTV35P60F1D
Electrical Specifications T
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Peak Off-State Blocking Current
On-State Voltage V
Gate-Anode Leakage Current
Input Capacitance C
Current Turn-On Delay Time
Current Rise Time t
Current Turn-Off Delay Time t
Current Fall Time t
Turn-Off Energy E
= +25oC, Unless Otherwise Specified
C
I
DRM
VKA = -600V TC = +150oC- - 5 mA
VGA = +18V TC = +25oC - - 200 µA
IK = I
K115
V
= -7V
GA
VGA = ±20V - - 100 nA
VKA = -20V, TJ = +25oC
I
GAS
TM
ISS
VGA = +18V
t
D(ON)I
L = 200µH, IK = I
K115
RG = 1, VGA = +18V, -7V TJ = +125oC
RI
D(OFF)I
FI
OFF
VKA = -300V
TC = +150oC - - 1.35 V
= +25oC - - 1.4 V
T
C
-5-nF
- 140 - ns
- 180 - ns
- 640 - ns
- 1.1 1.4 µs
- 5.6 - mJ
Thermal Resistance (MCT) R
Thermal Resistance (Diode) R
Diode Forward Voltage V
Diode Reverse Recovery Time t
θJC
θJC
KA
RR
IKA= 35A - - 1.4 V
IKA= 35A, di/dt = 100A/µs - - 600 ns
Typical Performance Curves
100
PULSE TEST PULSE DURATION = 250µs
50
DUTY CYCLE < 2%
30 20
10
TJ = +150oC
5 3
, CATHODE CURRENT (A)
K
I
2
1
0 0.5 1.0 1.5 2.0
VTM, CATHODE VOLTAGE (V)
TJ = -40oC
TJ = +25oC
-.6.7oC/W
- 1.1 1.2
= +150oC
T
100
80
PACKAGE LIMIT
60
40
20
, DC CATHODE CURRENT (A)
K
I
0
20 40 60 80 100 120 140 160
TC, CASE TEMPERATURE (oC)
MCT SWITCHING LIMIT
DIODE
J
MCT
o
C/W
FIGURE 1. CATHODECURRENT vs SATURATION VOLTAGE
(TYPICAL)
FIGURE 2. MAXIMUM CONTINUOUS CATHODE CURRENT
2-9
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